Glenair’s new 1000 Hour Grey over stainless steel.
Glenair’s standard olive drab zinc-nickel finish.
Glenair’s standard black zinc-nickel finish.
Glenair’s RoHs compliant black zinc-nickel.
Glenair’s standard black cadmium over stainless steel.
Glenair’s standard olive drab cadmium over stainless steel.
1000
1000
1000
1000
500
1000
2000
TABLE I - BACKSHELL INTERFACE DIMENSIONS
A
C*
D
08
E
08
F
08 [9]
G
H
09 [A]
08
08 [A]
03
10
10 [B]
12
12 [7] 12
14
14 [12] 14
16
16 [19] 16
18 [27]
18
20 [37]
20
22
22
22 [H]
24
61
24 [J]
25 [G]
24
28
28
32
32
36
36
40
40
40
44
44
48
48
33 [J]
36
29 [H]
32
28
24
24
24 [25] 23 [F]
25 [J]
24
24
22
22
22 [23]
23 [H]
24
20
20
20 [21]
21 [G]
19 [E]
20 [G]
22
22
22
18
18
18 [19]
19 [F]
17 [D]
18 [F]
20
20
20
16
16 [17]
17 [E]
15 [C]
16 [E]
18
18
18
12
14
12 [13]
13 [C]
11 [A]
14 [15]
15 [D]
13 [B]
14 [D]
16
16
16 [17]
14 [15]
14
14
12
12
10
10
10 [11]
11 [B]
12 [13]
10
11
10
10
J
K
08
L
08
S
08
.770 (19.6)
.890 (22.6)
.890 (22.6)
1.020 (25.9)
1.020 (25.9)
1.150 (29.2)
1.150 (29.2)
1.260 (32.0)
1.230 (31.2)
1.400 (35.6)
1.360 (34.5)
1.530 (38.9)
1.480 (37.6)
1.600 (40.6)
(40.6)
(49.3)
.820 (20.8)
1.060 (26.9)
.820 (20.8)
.940
1.170
.940
1.060
1.290
1.060
(23.8)
(29.7)
(23.8)
(26.9)
(32.7)
(26.9)
1.170 (29.7)
1.420 (36.1)
1.170 (29.7)
1.290 (32.7)
1.540 (39.1)
1.420 (36.0)
1.670 (42.4)
1.540 (39.1)
2.010 (51.1)
1.840 (46.7)
1.970 (50.0)
2.090 (53.1)
2.280 (57.9)
2.340 (59.4)
2.340 (59.4)
2.530 (64.3)
2.590 (65.8)
2.590 (65.8)
2.780 (70.6)
2.910 (73.9)
3.030 (77.0)
3.160 (80.3)
3.220 (81.8)
3.410 (86.6)
1.600
(43.9)
(43.9) 1.940
(43.2)
(42.4)
(49.3)
(46.2)
1.940
1.970 (50.0)
2.190 (55.6) 2.190
2.220 (56.4)
2.440 (62.0) 2.440
2.440
2.47 (62.7)
2.690
2.690
2.720 (69.1)
2.930
2.970 (75.4)
1.730
1.730
1.700
1.670
1.940
1.820
3.220 (81.8)
1.660 (42.2)
2.120 (53.8)
(49.3)
2.010 (51.1)
(55.6)
2.260 (57.4)
(62.0)
(62.0)
2.530 (64.3)
(68.3)
(68.3)
3.040 (77.2)
(74.4)
* Code C, MIL-C-22992, Left-Hand Thread. Connector designations depicted thus [ ] are for reference only and are not to be used in part number development.
BACKSHELL INTERFACE STANDARDS (See pages 15-17 for more information)
Continuing from the previous post 2-to-1 data selector design - [Altera SoC] - Electronic Engineering World - Forum [url]https://bbs.eeworld.com.cn/thread-498338-1-1.html[/url] Previously, the 2-input...
As the title says, I am designing a data acquisition system and need a RAM chip. I plan to use Intel 6264, but there is no Intel component library in Protel 2004. After converting the Intel component ...
:(i) This circuit diagram is a typical electronic mosquito swatter circuit that has been mapped; (ii) Oscillating transformer: The coil is sealed with insulating paint, so it is impossible to know the...
[backcolor=rgb(238, 238, 238)][size=12px]Recently I saw a topic in the Shandong Province Electronic Design Competition. Let's see how to do it. Pay attention to the instructions. [/size][/backcolor] [...
If the ultimate form of a car is a silicon-based life form, then in
the field of
intelligent driving
, it has gradually taken on the appearance of a "veteran driver." In
the field of
the ...[Details]
How do you know if a machine is operating properly? The answer: by leveraging deep learning to detect anomalies in routine vibration data from industrial machines. Anomaly detection has many uses, ...[Details]
ISP devices, such as field programmable devices (FPGAs and CPLDs), do not require a programmer. Using programming kits provided by the device manufacturer, they employ a top-down modular design app...[Details]
Some time ago, I attended the 4th Energy Chemistry Forum of the Chinese Chemical Society and learned about high-energy-density and high-safety batteries. I would like to summarize and share this wi...[Details]
On August 25th, SK Hynix announced that it has completed development and entered mass production of its 321-layer, 2Tb QLC NAND flash memory product. This achievement marks the world's first applic...[Details]
According to foreign media reports, secondary battery materials company POSCO Future M announced that it has successfully developed two experimental (prototype) positive electrode materials for the...[Details]
On August 21, WeRide officially launched WePilot AiDrive, a one-stage end-to-end assisted driving solution developed in cooperation with Bosch. This comes only half a year after the two parties' "t...[Details]
This paper proposes a temperature real-time transmission and display solution based on LED optical data transmission, with Jingwei Yager low-power FPGA HR (Yellow River) series as the main controll...[Details]
1 Source of creativity
With the further development of electronic technology, electronic pets have gradually entered people's family life. At present, there are two main categories of relative...[Details]
With the development of science, the use of variable frequency technology is becoming more and more widespread, and it is used in both industrial equipment and household appliances. Inverter air co...[Details]
There are basically three causes of spontaneous combustion of electric vehicles: The first is that the battery components are punctured or suffer fatal damage due to a collision accident, and part ...[Details]
Keysight Technologies is combining its electromagnetic simulator with Synopsys' AI-driven RF design migration flow to create an integrated design flow for migrating from TSMC's N6RF+ process techno...[Details]
A multilevel inverter converts a DC signal into a multilevel staircase waveform. Instead of a straight positive-negative output waveform, the output waveform of a multilevel inverter alternates in ...[Details]
Plessey Semiconductors has been acquired by Haylo Labs, which was established in March last year with a $100 million, five-year loan from Chinese technology company Goertek.
Haylo Labs w...[Details]
On August 21, according to a report by Korean media SEDaily yesterday, according to semiconductor industry sources, the HBM4 samples provided by Samsung to Nvidia last month have passed initial tes...[Details]