EEWORLDEEWORLDEEWORLD

Part Number

Search

2225N270F102SWM

Description
Ceramic Capacitor, Multilayer, Ceramic, 1000V, 1% +Tol, 1% -Tol, C0G, -/+30ppm/Cel TC, 0.000027uF, 2225,
CategoryPassive components    capacitor   
File Size56KB,4 Pages
ManufacturerKnowles
Websitehttp://www.knowles.com
Environmental Compliance
Download Datasheet Parametric View All

2225N270F102SWM Overview

Ceramic Capacitor, Multilayer, Ceramic, 1000V, 1% +Tol, 1% -Tol, C0G, -/+30ppm/Cel TC, 0.000027uF, 2225,

2225N270F102SWM Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid884794399
package instruction, 2225
Reach Compliance Codecompliant
Country Of OriginMainland China, USA
ECCN codeEAR99
YTEOL7
capacitance0.000027 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high2.03 mm
length5.59 mm
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance1%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package formSMT
method of packingWaffle Pack
positive tolerance1%
Rated (DC) voltage (URdc)1000 V
size code2225
surface mountYES
Temperature characteristic codeC0G
Temperature Coefficient30ppm/Cel ppm/°C
Terminal shapeWRAPAROUND
width6.35 mm
COG - COMMERCIAL - 16Vdc to 10KVdc
Ultra stable Class I dielectric (EIA COG) or NPO:
linear temperature coefficient, low loss,
stable electrical properties with time, voltage and frequency. Designed for surface mount
application with nickel barrier termination suitable for solder wave, vapor phase or reflow
solder board attachment. Also available with silver-palladium terminations for hybrid use
with conductive epoxy. COG chips are used in precision circuitry requiring Class I stability.
CAPACITANCE & VOLTAGE SELECTION FOR POPULAR CHIP SIZES
3 digit code: two significant digits, followed by number of zeros eg: 183 = 18,000 pF. R denotes decimal, eg. 2R7 = 2.7 pF
SIZE
Min Cap
0402 0504 0603 0805 1005 1206 1210 1515
0R3
.
024
1808
5R0
.065
393
333
223
153
103
682
472
472
472
392
392
222
122
821
391
221
5R0
.080
393
333
273
223
153
103
562
472
472
472
472
332
182
122
471
271
x
1812
100
.065
563
563
393
273
183
153
103
103
103
822
822
472
272
182
821
471
100
.100
563
563
393
393
273
223
153
123
123
103
103
822
472
272
122
821
x
1825
150
.080
104
104
104
683
473
393
223
223
223
183
183
103
562
272
122
681
391
150
.140
104
104
104
823
683
563
473
333
273
183
183
153
103
562
222
122
821
x
0R5
.044
222
182
152
152
821
561
0R3
.035
152
122
102
102
561
331
0R5
.054
562
472
392
392
182
152
821
821
821
681
681
471
0R5
.054
822
682
562
562
272
222
122
122
122
102
102
391
3R0
.064
153
123
123
103
562
392
272
182
182
152
152
102
561
391
5R0
.065
273
273
223
183
103
822
472
472
472
392
392
222
122
821
3R0
.130
473
393
333
333
223
223
153
103
822
682
682
562
392
272
122
681
Tmax
16V
25V
V O LTA G E
271
221
181
181
101
560
50V
100V
200V
250V
300V
400V
500V
CAP
MAX
&
600V
800V*
1000V*
1500V*
2000V*
3000V*
4000V*
5000V*
6000V*
7000V*
8000V*
9000V*
10000V*
Note:
“ x ”
denotes a special
thickness
(see Tmax
row above).
An
X is required in the part number. Please
refer to page 10 for
how to order.
* Units rated above 800V may require conformal coating in use to preclude arcing over the chip surface
NOTE: REFER TO PAGES 10 & 11 FOR ORDERING INFORMATION
12
.
www.
N O V A C A P
.
com
12
How to Layout a Circuit Board for an Op Amp
[align=left][color=#000][font="][size=4] During the circuit design process, application engineers often overlook the layout of the printed circuit board (PCB). The problem is that the circuit schemati...
qwqwqw2088 PCB Design
Texas Instruments: TMS320C5535 eZdsp USB Development Kit Demonstration
Texas Instruments: TMS320C5535 eZdsp USB Development Kit DemonstrationIntroduction: TMDX5535eZdsp is a USB- powered, ultra-low-cost, small DSP development kit that includes all the software and hardwa...
德仪DSP新天地 DSP and ARM Processors
Power Sequencing for Electronic Products
I would like to ask all the experts. Electronic products basically have power timing regulations. How are these timings determined? What conditions determine the delay time between each group of power...
zf_zxsk Analog electronics
[Repost] Help me up, I can still model!
[align=right][b] [color=Red][b]To all my friends who are fighting hard in the American Mathematics Competition[/b][/b][/color][/align][align=right][color=Red][b][b][/b][/color][/align] [color=#545455]...
5之蒲公英 Talking
Multithreading on LM3S8962_phtotthreads
The flashing of the light-emitting diode is realized by using multi-threaded photothreads, in which thread 1 is used to realize the flipping of the IO port, and thread 2 is used to realize the delay. ...
lixiaohai8211 Microcontroller MCU
Running Debian system on K510 (unsuccessful compilation)
Suddenly I saw in the Makefile fileI guess it is possible to use make to generate a debian image that can run on K510. Try to use the make debian command, which fails as expected, becauseTipsThen type...
tobot Domestic Chip Exchange

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 494  342  1018  2200  382  10  7  21  45  8 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号