The INMP401 is available in a 4.72 × 3.76 × 1.00 mm surface-
mount package. It is reflow solder compatible with no
sensitivity degradation. The INMP401 is halide free.
*Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; and 7,961,897.
Other patents are pending.
GENERAL DESCRIPTION
*
APPLICATIONS
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Mobile Devices
Teleconferencing Systems
Headsets
Security Panels
Intercom Devices
FEATURES
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4.72 × 3.76 × 1.00 mm Surface-Mount Package
SNR of 62 dBA
Sensitivity
of −42
dBV
Flat Frequency Response from 60 Hz to 15 kHz
Low Current Consumption: <250 µA
Single-Ended Analog Output
High PSR of 70 dB
Compatible with Sn/Pb and Pb-Free Solder Processes
RoHS/WEEE Compliant
FUNCTIONAL BLOCK DIAGRAM
ORDERING INFORMATION
PART
TEMP RANGE
−40°C to +85°C
−40°C to +85°C
—
—
INMP401ACEZ-R0*
INMP401ACEZ-R7†
EV_INMP401
EV_INMP401-FX
OUTPUT
AMPLIFIER
OUTPUT
* – 13” Tape and Reel
INMP401
POWER
† – 7” Tape and reel to be discontinued. Contact
sales@invensense.com
for availability.
VDD
GND
InvenSense reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
www.invensense.com
Document Number: DS-INMP401-00
Revision: 1.1
Rev Date: 05/21/2014
INMP401
TABLE OF CONTENTS
General Description ................................................................................................................................................. 1
Features ................................................................................................................................................................... 1
Ordering Information ............................................................................................................................................... 1
Table of Contents ............................................................................................................................................................ 2
Absolute Maximum Ratings ............................................................................................................................................ 4
Table 2. Absolute Maximum Ratings ....................................................................................................................... 4
Pin Configurations And Function Descriptions ............................................................................................................... 6
Table 4. Pin Function Descriptions........................................................................................................................... 6
Applications Information ................................................................................................................................................ 8
Connecting To Audio Codecs ................................................................................................................................... 8
PCB Design And Land Pattern Layout ........................................................................................................................... 10
Pick And Place Equipment ..................................................................................................................................... 11
Revision History ..................................................................................................................................................... 13
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