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K7A803208B-QI25

Description
Cache SRAM, 256KX32, 2.6ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100
Categorystorage    storage   
File Size475KB,18 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric View All

K7A803208B-QI25 Overview

Cache SRAM, 256KX32, 2.6ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100

K7A803208B-QI25 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid1932326842
Parts packaging codeQFP
package instructionLQFP, QFP100,.63X.87
Contacts100
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
YTEOL0
Maximum access time2.6 ns
Maximum clock frequency (fCLK)250 MHz
I/O typeCOMMON
JESD-30 codeR-PQFP-G100
JESD-609 codee0
length20 mm
memory density8388608 bit
Memory IC TypeCACHE SRAM
memory width32
Number of functions1
Number of terminals100
word count262144 words
character code256000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256KX32
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Encapsulate equivalent codeQFP100,.63X.87
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum standby current0.06 A
Minimum standby current3.14 V
Maximum slew rate0.47 mA
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
width14 mm
K7A803608B
K7A803208B
K7A801808B
Document Title
256Kx36/x32 & 512Kx18 Synchronous SRAM
256Kx36 & 256Kx32 & 512Kx18-Bit Synchronous Pipelined Burst SRAM
Revision History
Rev. No.
0.0
0.1
0.2
1.0
History
Initial draft
1. Delete pass- through
1. Add x32 org part and industrial temperature part
1. Final spec release
2. Change I
SB2
form 50mA to 60mA
Draft Date
May. 18 . 2001
June. 26. 2001
Aug. 11. 2001
Nov. 16. 2001
Remark
Preliminary
Preliminary
Preliminary
Final
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
-1-
Nov 2001
Rev 1.0
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