General Electrical, Physical, and Environmental Characteristics
Test Procedures:
Section J of the catalog covers the
applicable test procedures
Humidity Test:
The Non-Hermetically sealed units shall be
tested as outlined in section J “Humidity Test”
As a result of the test there shall be:
• No visible damage
• Max.
∆
C of ± 5%
• Min. IR = 50% of initial limit
• Max. DF = .5%
Electrical Characteristics:
Capacitance, Dissipation Factor, Insulation
Resistance, and Dielectric Strength shall be
measured as specified in section J.
Physical Characteristics:
The Lead Strength shall be measured as
specified in section J.
DC Life:
810P, 820P, 842P & 860P: 140% of rated voltage at 125°C for 250 hours.
832P & 880P: 125% of rated voltage at 150C for 250 hours.
882P: 125% of rated voltage for 250 hours at 125C.
As a result of the test there shall be:
• No permanent open or short circuit
Environmental Characteristics:
Vibration Test: (Condition B)
No mechanical damage, short, open or
intermittent circuit
• No visible damage
• Max.
∆
C of ± 5%
• Min. IR = 50% of initial limit
Moisture Resistance:
The hermetically sealed units shall be tested
as outlined in the Moisture Resistance testing
of section J.
As a result of the test there shall be:
• No visible damage
• Max.
∆
C of ± 5%
• Min. IR = 50% of initial limit
• Max. DF = .5%
• Max. DF = 0.3%
AC Life:
The 859P shall be tested at 110% of the
rated rms voltage at 400 Hz for 250 hours at 85°C.
As a result of the test there shall be:
• No permanent open or short circuit
• No visible damage
• Max.
∆
C of ± 5%
• Min. IR = 50% of initial limit
• Max. DF = 0.5%
F-2
electronics
,
inc.
METALIZED POLYPHENYLENE SULFIDE FILM CAPACITORS
F3
electronics
,
inc.
POLYPHENYLENE SULFIDE FILM CAPACITORS
STYLES FOR METAL-CASE FILM CAPACITORS
SECTION GROUNDED TO CASE
SECTION INSULATED FROM CASE
DIMENSIONS IN INCHES
DIMENSIONS IN INCHES
CASE STYLE 01
+1.00
-0
1.625
CASE STYLE 02
±0.031
0.172 MAX
L
±0.031
+1.00
-0
1.625
0.172
MAX
1.625
+1.00
-0.00
L
D
-0.005
±0.015
DIA
D
+0.015
-0.005
CASE STYLE 04
+1.00
-0
1.625
±0.015
0.020
1.625
+1.000
-0.000
CASE STYLE 03
+1.00
-0
1.625
±0.015
0.020
L
±0.062
L
±0.31
0.020
±0.015
0.172
MAX
0.172
MAX
INSULATING SLEEVE
0.0075 MAX THICKNESS
D
+0.015
-0.005
D
+0.015
-0.037 DIA.
INSULATING SLEEVE
0.0075 MAX THICKNESS
CASE STYLE 12
1.625
+1.00
-0
CASE STYLE 13
1.625
+1.00
-0
1.625
+1.000
-0.000
WRAP-AROUND
APPROX. 135°
FOR 0.400 DIA.,
AND APPROX.
225° FOR LARGER DIA.
DIA
0.172
MAX
L
D
±0.031
L
±0.031
+0.015 DIA
-0.005
C
L
0.172
MAX
C
L
D
-0.005
±0.015
A
±0.005
DIA
C B
W
±0.015
0.033
±0.005
FOR 0.400 DIA.,
0.051
±0.005
FOR DIA. 0.500
AND LARGER
±0.005
A
DIA
C B
W
±0.015
0.033
±0.005
FOR 0.400
DIA., 0.051
±0.005
FOR
DIA. 0.500 AND LARGER
Bracket Dimensions (Style 12 & 13)
Inches
D
0.400
0.500
0.562
0.670
0.750
1.000
W
0.250
0.500
0.500
0.500
0.500
0.500
A
0.144
0.156
0.156
0.156
0.156
0.156
B
0.187±0.015
0.250±0.031
0.250±0.031
0.250±0.031
0.250±0.031
0.250±0.031
C
0.312±0.031
0.437±0.062
0.437±0.062
0.437±0.062
0.437±0.062
0.437±0.062
dimensionsbrac style 12 and 13
F4
electronics
,
inc.
POLYPHENYLENE SULFIDE FILM CAPACITORS
TYPICAL TAB TERMINAL DIMENSIONS
0.020
c
L
±0.005
0.125
±0.015
c
L
SLOT 0.062 x 0.125
A
B
0.296
±0.062
Dwg. No A-9525
A = 0.156 ± 0.015" (3.96 ± 0.38mm)
B = 0.187 ± 0.015" (4.75 ± 0.38mm)
Tab Terminal available only on case diameters equal to or greater than 0.400 inches.
T1 & T3 s t y l e s a r e s u p p l i e d w i t h o n e t a b t e r m i n a l o n t h e i n s u l a t e d e n d a n d a g r o u n d lead on the opposite end.
CATALOG NUMBERING SYSTEM
EXAMPLE:
859P
183
X9
165
S
02
STYLE NUMBER.
SEE PAGE 4 FOR STYLE VARIATIONS
AND CORRESPONDING DIMENSIONS. (Metal case only)
TERMINAL.
S = WIRE LEADS, T = SOLDERING TAB*
*SOLDERING TABS ARE A VAILABLE ONLY ON CASE
DIAMETERS EQUAL TO OR GREATER THAN 0.400
INCHES. (Metal case only)
AC or DC VOLTAGE RATING.
EXPRESSED IN VOLTS. SEE STANDARD
RATINGS CHARTS FOR VOLTAGE CODE.
CAPACITANCE TOLERANCE.
X0 = ±20%; X9 = ±10%
X5 = ± 5%; X2 = ±2%
X1 = ± 1%
CAPACITANCE.
EXPRESSED IN PICOFARADS. THE FIRST TWO DIGITS ARE SIGNIFICANT
FIGURES; THE THIRD IS THE NUMBER OF ZEROS FOLLOWING. SEE STANDARD RATINGS
TABLES FOR CAP ACITANCE CODE. e.g. 183 = 18000pf or 0.018µf
Remove with a soldering iron:Step 1. Use an enameled wire with a diameter of about 0.15mm to pass under the first row of pins, fix one end and hold the other end in your hand.2. Heat the moving end of...
An I2C is simulated in STM32. When communicating with the ferroelectric, it is found that the ferroelectric has no response. Therefore, the function of reading the ferroelectric cannot be used! ! ! !
...
Currently, there are 4 devices connected to FSMC.Among them, the interrupt of DM90000A is connected to a common GPIO for interruption.Can these two be used? (The key is whether these two are used for ...
Can the magnetic bead between the digital power supply and analog power supply of the AD chip be replaced by a 0 ohm resistor? How to choose the package of the 0 ohm resistor? (DC occasion)...
Tesla and BYD, vying for dominance in the global electric vehicle market, are reportedly considering adopting Samsung's AMOLED (active-matrix organic light-emitting diode) technology for their next...[Details]
Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
A parallel inverter consists of two thyristors (T1 and T2), a capacitor, a center-tapped transformer, and an inductor. The thyristors provide a current path, while the inductor L maintains a consta...[Details]
introduction
With the development of digital and network technologies, broadcasting technology has become increasingly diversified, with the most significant trend being the transition from an...[Details]
In recent years, many people have switched to new energy vehicles, and this type of vehicle has indeed been highly sought after and is considered the future direction of automobile development, and...[Details]
According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
Common Mode Semiconductor has officially released its latest generation of power management ICs—the GM6506 series. This fully integrated high-frequency synchronous rectification step-down p...[Details]
With the rapid development of electric vehicles in my country, people are beginning to pay attention to the issue of radiation from electric vehicles. We all know that mobile phones emit radiation,...[Details]
Common methods for troubleshooting roller press bearing wear include repair welding, thermal spraying, brush plating, and scrapping and replacement. However, these methods are often subject to asse...[Details]
With the support and encouragement of national policies, some Internet car manufacturers have also joined the new energy vehicle manufacturing industry. From the perspective of new car manufacturer...[Details]
With the gradual popularization of new energy vehicles in recent years, more and more people have been able to access and purchase electric vehicles. The structure of electric vehicles is composed ...[Details]
introduction
In today's busy society, people experience chronic high stress, which in turn poses a significant threat to our health. Therefore, effectively relieving stress has become a pr...[Details]
introduction
In recent years, with the increasing number of high-rise buildings, the demand for elevators has also increased. Currently, the elevators we use most often use LED dot array displ...[Details]
As the power density of modern electronic systems continues to increase, effective thermal management has become critical to ensuring system performance, reliability, and longevity—especially in hi...[Details]
Anyone who has driven a pure electric vehicle will find that it starts much faster than a fuel vehicle. So why do pure electric vehicles start so quickly?
We all know that an engine's to...[Details]