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IS61VF25636B-7.5B3I

Description
Cache SRAM, 256KX36, 7.5ns, CMOS, PBGA165, 13 X 15 MM, TFBGA-165
Categorystorage    storage   
File Size824KB,33 Pages
ManufacturerISSI(Integrated Silicon Solution Inc.)
Websitehttp://www.issi.com/
Download Datasheet Parametric View All

IS61VF25636B-7.5B3I Overview

Cache SRAM, 256KX36, 7.5ns, CMOS, PBGA165, 13 X 15 MM, TFBGA-165

IS61VF25636B-7.5B3I Parametric

Parameter NameAttribute value
Objectid8141454107
package instructionTBGA,
Reach Compliance Codeunknown
Country Of OriginMainland China, Taiwan
ECCN code3A991.B.2.A
YTEOL5.75
Maximum access time7.5 ns
JESD-30 codeR-PBGA-B165
length15 mm
memory density9437184 bit
Memory IC TypeCACHE SRAM
memory width36
Number of functions1
Number of terminals165
word count262144 words
character code256000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256KX36
Package body materialPLASTIC/EPOXY
encapsulated codeTBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE
Parallel/SerialPARALLEL
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)2.625 V
Minimum supply voltage (Vsup)2.375 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
width13 mm
IS61(64)LF25636B, IS61VF/VVF25636B
IS61(64)LF51218B, IS61VF/VVF51218B
256K x 36, 512K x 18
9 Mb SYNCHRONOUS
FLOW-THROUGH
STATIC RAM
FEATURES
• Internal self-timed write cycle
• Individual Byte Write Control and Global Write
• Clock controlled, registered address, data and
control
• Burst sequence control using MODE input
• Three chip enable option for simple depth expan-
sion and address pipelining
• Common data inputs and data outputs
• Auto Power-down during deselect
• Single cycle deselect
• Snooze MODE for reduced-power standby
• JTAG Boundary Scan for BGA package
• Power Supply
LF: Vdd
3.3V (+
5%), Vddq
3.3V/2.5V (+
5%)
VF: Vdd
2.5V (+
5%), Vddq
2.5V (+
5%)
VVF: Vdd
1.8V (+
5%), Vddq
1.8V (+
5%)
• JEDEC 100-Pin QFP, 119-pin BGA, and 165-pin
BGA packages
• Lead-free available
MARCH 2020
DESCRIPTION
The 9Mb product family features high-speed, low-power
synchronous static RAMs designed to provide burstable,
high-performance memory for communication and network-
ing applications. The IS61(64)LF/VF25636B
is organized
as 262,144 words by 36 bits. The IS61(64)LF/VF51218B
is organized as 524,288 words by 18 bits. Fabricated with
ISSI
's advanced CMOS technology, the device integrates
a 2-bit burst counter, high-speed SRAM core, and high-
drive capability outputs into a single monolithic circuit. All
synchronous inputs pass through registers controlled by
a positive-edge-triggered single clock input.
Write cycles are internally self-timed and are initiated by the
rising edge of the clock input. Write cycles can be one to
four bytes wide as controlled by the write control inputs.
Separate byte enables allow individual bytes to be writ-
ten. Byte write operation is performed by using byte write
enable (BWE)
input combined with one or more individual
byte write signals (BWx). In addition, Global Write (GW)
is available for writing all bytes at one time, regardless of
the byte write controls.
Bursts can be initiated with either
ADSP
(Address Status
Processor) or
ADSC
(Address Status Cache Controller)
input pins. Subsequent burst addresses can be gener-
ated internally and controlled by the
ADV
(burst address
advance) input pin.
The mode pin is used to select the burst sequence order,
Linear burst is achieved when this pin is tied LOW. Inter-
leave burst is achieved when this pin is tied HIGH or left
floating.
FAST ACCESS TIME
Symbol
tkq
tkc
Parameter
Clock Access Time
Cycle Time
Frequency
-6.5
6.5
7.5
133
-7.5
7.5
8.5
117
Units
ns
ns
MHz
Copyright © 2020 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no
liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on
any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause
failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written
assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. B2
03/04/2020
1

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