NXP Semiconductors
Data Sheet: Technical Data
Document Number MC56F827XXDS
Rev. 3.0, 09/2016
Supports MC56F82748VLH,
MC56F82746VLF, MC56F82746MLF,
MC56F82743VLC, MC56F82743VFM,
MC56F82738VLH, MC56F82736VLF,
MC56F82733VLC, MC56F82733VFM,
MC56F82733MFM, MC56F82728VLH,
MC56F82726VLF, MC56F82723VLC,
MC56F82723VFM
Features
• This family of digital signal controllers (DSCs) is
based on the 32-bit 56800EX core. On a single chip,
each device combines the processing power of a DSP
and the functionality of an MCU, with a flexible set of
peripherals to support many target applications:
– Industrial control
– Home appliances
– Smart sensors
– Wireless charging
– Switched-mode power supply and power
management
– Power distribution systems
– Motor control (ACIM, BLDC, PMSM, SR, stepper)
– Photovoltaic systems
– Circuit breaker
– Medical device/equipment
– Instrumentation
– Uninterruptible power supplies (UPSs)
– Lighting
• DSC based on 32-bit 56800EX core
– Up to 100 MIPS at 100 MHz core frequency in fast
mode
– DSP and MCU functionality in a unified, C-efficient
architecture
• On-chip memory
– Up to 64 KB flash memory
– Up to 8 KB data/program RAM
– On-chip flash memory and RAM can be mapped
into both program and data memory spaces
• Analog
– Two high-speed, 8-channel, 12-bit ADCs with
dynamic x1, x2, and x4 programmable amplifier
– Four analog comparators with integrated 6-bit DAC
references
– Up to two 12-bit digital-to-analog converters (DAC)
• One eFlexPWM module with up to 8 PWM outputs,
including 8 channels with high resolution NanoEdge
placement
• Communication interfaces
– Up to two high-speed queued SCI (QSCI) modules
with LIN slave functionality
– Up to two queued SPI (QSPI) modules
– One I2C/SMBus port
– One Modular/Scalable Controller Area Network
(MSCAN) module
• Timers
– One 16-bit quad timer (1 x 4 16-bit timer)
– Two Periodic Interval Timers (PITs)
• Security and integrity
– Cyclic Redundancy Check (CRC) generator
– Windowed Computer operating properly (COP)
watchdog
– External Watchdog Monitor (EWM)
• Clocks
– Two on-chip relaxation oscillators: 8 MHz (400 kHz
at standby mode) and 200 kHz
– Crystal / resonator oscillator
MC56F827xx
MC56F827XXDS
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.
• System
– DMA controller
– Integrated power-on reset (POR) and low-voltage interrupt (LVI) and brown-out reset module
– Inter-module crossbar connection
– JTAG/enhanced on-chip emulation (EOnCE) for unobtrusive, real-time debugging
• Operating characteristics
– Single supply: 3.0 V to 3.6 V
– 5 V–tolerant I/O (except for RESETB pin which is a 3.3 V pin only)
– Operation ambient temperature: V temperature option: -40°C to 105°C
– Operation ambient temperature: M temperature option: -40°C to 125°C
• 64-pin LQFP, 48-pin LQFP, 32-pin QFN, and 32-pin LQFP packages
MC56F827xx, Rev. 3.0, 09/2016
2
NXP Semiconductors
Table of Contents
1
Overview............................................................................................ 4
1.1
1.2
1.3
1.4
1.5
1.6
1.7
2
MC56F827xx Product Family.................................................4
56800EX 32-bit Digital Signal Controller (DSC) core...........5
Operation Parameters.............................................................. 6
On-Chip Memory and Memory Protection............................. 6
Interrupt Controller................................................................. 7
Peripheral highlights............................................................... 7
Block diagrams........................................................................13
7
6.1
6.2
6.3
6.4
Thermal handling ratings........................................................ 31
Moisture handling ratings........................................................31
ESD handling ratings.............................................................. 31
Voltage and current operating ratings..................................... 32
General............................................................................................... 33
7.1
7.2
7.3
7.4
7.5
General characteristics............................................................ 33
AC electrical characteristics....................................................34
Nonswitching electrical specifications....................................35
Switching specifications..........................................................41
Thermal specifications............................................................ 42
MC56F827xx signal and pin descriptions..........................................16
2.1
Signal groups...........................................................................25
8
3
Ordering parts.....................................................................................25
3.1
Determining valid orderable parts...........................................25
Peripheral operating requirements and behaviors.............................. 44
8.1
8.2
8.3
8.4
8.5
8.6
8.7
Core modules...........................................................................44
System modules.......................................................................45
Clock modules.........................................................................45
Memories and memory interfaces........................................... 48
Analog..................................................................................... 50
PWMs and timers.................................................................... 56
Communication interfaces.......................................................57
4
Part identification............................................................................... 25
4.1
4.2
4.3
4.4
Description.............................................................................. 26
Format..................................................................................... 26
Fields....................................................................................... 26
Example...................................................................................26
5
Terminology and guidelines...............................................................27
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
Definition: Operating requirement.......................................... 27
Definition: Operating behavior............................................... 27
Definition: Attribute................................................................27
Definition: Rating....................................................................28
Result of exceeding a rating.................................................... 28
Relationship between ratings and operating requirements......28
Guidelines for ratings and operating requirements................. 29
Definition: Typical value........................................................ 29
Typical value conditions......................................................... 30
9
Design Considerations....................................................................... 63
9.1
9.2
9.3
Thermal design considerations................................................63
Electrical design considerations.............................................. 65
Power-on Reset design considerations....................................66
10 Obtaining package dimensions.......................................................... 68
11 Pinout................................................................................................. 69
11.1 Signal Multiplexing and Pin Assignments.............................. 69
11.2 Pinout diagrams.......................................................................71
12 Product documentation.......................................................................73
13 Revision History.................................................................................74
6
Ratings................................................................................................31
MC56F827xx, Rev. 3.0, 09/2016
NXP Semiconductors
3
Overview
1 Overview
1.1 MC56F827xx Product Family
The following table is the comparsion of features among members of the family.
Table 1. MC56F827xx Family
Feature
Part Number
1
748V
LH
746V
LF
746M
LF
Core frequency
(MHz)
Flash memory
(KB)
RAM (KB)
Interrupt
Controller
Windowed
Computer
Operating
Properly (WCOP)
External
Watchdog Monitor
(EWM)
Periodic Interrupt
Timer (PIT)
Cyclic
Redundancy
Check (CRC)
Quad Timer
(TMR)
12-bit Cyclic ADC
channels
PWM Module:
Input capture
channels
2
High-resolution
channels
Standard
channels
12-bit DAC
DMA
12
8
4
2
Yes
6
6
0
2
Yes
6
6
0
2
Yes
6
6
0
2
Yes
12
8
4
2
Yes
6
6
0
2
Yes
6
6
0
2
Yes
6
6
0
2
Yes
12
8
4
2
Yes
6
6
0
2
Yes
6
6
0
2
Yes
6
6
0
2
Yes
743V
LC
743V
FM
738V
LH
MC56F82
736V
LF
733V
LC
733V
FM
733M
FM
728V
LH
726V
LF
723V
LC
723V
FM
100/50 100/50 100/50 100/50 100/50 100/50 100/50 100/50 100/50 100/50 100/50 100/50
64
8
Yes
1
64
8
Yes
1
64
8
Yes
1
64
8
Yes
1
48
8
Yes
1
48
8
Yes
1
48
8
Yes
1
48
8
Yes
1
32
6
Yes
1
32
6
Yes
1
32
6
Yes
1
32
6
Yes
1
1
1
1
1
1
1
1
1
1
1
1
1
2
1
2
1
2
1
2
1
2
1
2
1
2
1
2
1
2
1
2
1
2
1
2
1
1x4
2x8
1x4
2x5
1x4
2x3
1x4
2x3
1x4
2x8
1x4
2x5
1x4
2x3
1x4
2x3
1x4
2x8
1x4
2x5
1x4
2x3
1x4
2x3
Table continues on the next page...
MC56F827xx, Rev. 3.0, 09/2016
4
NXP Semiconductors
Overview
Table 1. MC56F827xx Family (continued)
Feature
Part Number
1
748V
LH
746V
LF
746M
LF
Analog
Comparators
(CMP)
QSCI
QSPI
I2C/SMBus
MSCAN
GPIO
Package pin
count
AEC-Q100
3
4
4
3
3
4
4
3
743V
LC
743V
FM
738V
LH
MC56F82
736V
LF
733V
LC
733V
FM
733M
FM
3
4
4
3
3
728V
LH
726V
LF
723V
LC
723V
FM
2
2
1
1
54
64
LQFP
Yes
2
1
1
1
39
48
LQFP
Yes
1
1
1
0
26
32
LQFP
No
1
1
1
0
26
32
QFN
No
2
2
1
1
54
64
LQFP
Yes
2
1
1
1
39
48
LQFP
Yes
1
1
1
0
26
32
LQFP
No
1
1
1
0
26
32
QFN
No
2
2
1
1
54
64
LQFP
Yes
2
1
1
1
39
48
LQFP
Yes
1
1
1
0
26
32
LQFP
No
1
1
1
0
26
32
QFN
No
1. Temperature options
V: -40°C to 105°C
M: -40°C to 125°C
2. Input capture shares the pin with cooresponding PWM channels.
3. Qualification aligned to AEC-Q100
1.2 56800EX 32-bit Digital Signal Controller (DSC) core
• Efficient 32-bit 56800EX Digital Signal Processor (DSP) engine with modified dual
Harvard architecture:
• Three internal address buses
• Four internal data buses: two 32-bit primary buses, one 16-bit secondary data
bus, and one 16-bit instruction bus
• 32-bit data accesses
• Supports concurrent instruction fetches in the same cycle, and dual data accesses
in the same cycle
• 20 addressing modes
• As many as 100 million instructions per second (MIPS) at 100 MHz core frequency
• 162 basic instructions
• Instruction set supports both fractional arithmetic and integer arithmetic
• 32-bit internal primary data buses support 8-bit, 16-bit, and 32-bit data movement,
plus addition, subtraction, and logical operations
• Single-cycle 16 × 16-bit -> 32-bit and 32 x 32-bit -> 64-bit multiplier-accumulator
(MAC) with dual parallel moves
• 32-bit arithmetic and logic multi-bit shifter
• Four 36-bit accumulators, including extension bits
MC56F827xx, Rev. 3.0, 09/2016
NXP Semiconductors
5
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