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CY7C1386C-225AI

Description
1M X 18 CACHE SRAM, 2.8 ns, PQFP100
Categorystorage    storage   
File Size550KB,34 Pages
ManufacturerCypress Semiconductor
Download Datasheet Parametric View All

CY7C1386C-225AI Overview

1M X 18 CACHE SRAM, 2.8 ns, PQFP100

CY7C1386C-225AI Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals100
Maximum operating temperature70 Cel
Minimum operating temperature0.0 Cel
Maximum supply/operating voltage3.6 V
Minimum supply/operating voltage3.14 V
Rated supply voltage3.3 V
maximum access time2.8 ns
Processing package description14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
stateACTIVE-UNCONFIRMED
CraftsmanshipCMOS
packaging shapeRECTANGULAR
Package SizeFLATPACK
surface mountYes
Terminal formGULL WING
Terminal spacing0.6500 mm
terminal coatingTIN LEAD (800)
Terminal locationQUAD
Packaging MaterialsPLASTIC/EPOXY
Temperature levelCOMMERCIAL
memory width18
organize1M X 18
storage density1.89E7 deg
operating modeSYNCHRONOUS
Number of digits1.05E6 words
Number of digits1M
Memory IC typeCACHE SRAM
serial parallelPARALLEL
CY7C1386C
CY7C1387C
18-Mb (512K x 36/1M x 18) Pipelined DCD
Sync SRAM
Features
• Supports bus operation up to 250 MHz
• Available speed grades are 250, 225, 200 and 167 MHz
• Registered inputs and outputs for pipelined operation
• Optimal for performance (Double-Cycle deselect)
• Depth expansion without wait state
• 3.3V –5% and +10% core power supply (V
DD
)
• 2.5V / 3.3V I/O operation
• Fast clock-to-output times
— 2.6 ns (for 250-MHz device)
— 2.8 ns (for 225-MHz device)
— 3.0 ns (for 200-MHz device)
— 3.4 ns (for 167-MHz device)
• Provide high-performance 3-1-1-1 access rate
User-selectable burst counter supporting Intel
Pentium interleaved or linear burst sequences
• Separate processor and controller address strobes
• Synchronous self-timed writes
• Asynchronous output enable
• Offered in JEDEC-standard 100-pin TQFP, 119-ball BGA
and 165-Ball fBGA packages
• IEEE 1149.1 JTAG-Compatible Boundary Scan
• “ZZ” Sleep Mode Option
Functional Description
[1]
The CY7C1386C/CY7C1387C SRAM integrates 524,288 x 36
and 1048,576 x 18 SRAM cells with advanced synchronous
peripheral circuitry and a two-bit counter for internal burst
operation. All synchronous inputs are gated by registers
controlled by a positive-edge-triggered Clock Input (CLK). The
synchronous inputs include all addresses, all data inputs,
address-pipelining Chip Enable (CE
1
), depth-expansion Chip
Enables (CE
2
and CE
3[2]
), Burst Control inputs (ADSC, ADSP,
and ADV), Write Enables (BW
X
, and BWE), and Global Write
(GW). Asynchronous inputs include the Output Enable (OE)
and the ZZ pin.
Addresses and chip enables are registered at rising edge of
clock when either Address Strobe Processor (ADSP) or
Address Strobe Controller (ADSC) are active. Subsequent
burst addresses can be internally generated as controlled by
the Advance pin (ADV).
Address, data inputs, and write controls are registered on-chip
to initiate a self-timed Write cycle.This part supports Byte Write
operations (see Pin Descriptions and Truth Table for further
details). Write cycles can be one to four bytes wide as
controlled by the byte write control inputs. GW active LOW
causes all bytes to be written. This device incorporates an
additional pipelined enable register which delays turning off
the output buffers an additional cycle when a deselect is
executed.This feature allows depth expansion without penal-
izing system performance.
The CY7C1386C/CY7C1387C operates from a +3.3V core
power supply while all outputs operate with a +3.3V or a +2.5V
supply. All inputs and outputs are JEDEC-standard
JESD8-5-compatible.
Selection Guide
250 MHz
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
2.6
350
70
225 MHz
2.8
325
70
200 MHz
3.0
300
70
167 MHz
3.4
275
70
Unit
ns
mA
mA
Shaded areas contain advance information.
Please contact your local Cypress sales representative for availability of these parts.
Notes:
1. For best–practices recommendations, please refer to the Cypress application note
System Design Guidelines
on www.cypress.com.
2. CE
3
and CE
2
are for TQFP and 165 fBGA package only. 119 BGA is offered only in Single Chip Enable.
Cypress Semiconductor Corporation
Document #: 38-05239 Rev. *B
3901 North First Street
San Jose
,
CA 95134
408-943-2600
Revised February 26, 2004
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