EPROM, 8KX8, 300ns, MOS, CDIP28
| Parameter Name | Attribute value |
| JESD-30 code | R-XDIP-T28 |
| JESD-609 code | e0 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.6 |
| surface mount | NO |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Number of terminals | 28 |
| Package body material | CERAMIC |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Is it Rohs certified? | No |
| YTEOL | 0 |
| Objectid | 101154937 |
| package instruction | DIP, DIP28,.6 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Is Samacsys | N |
| Maximum access time | 300 ns |
| memory density | 65536 bit |
| memory width | 8 |
| organize | 8KX8 |
| Nominal supply voltage (Vsup) | 5 V |
| word count | 8192 words |
| Output characteristics | 3-STATE |
| Maximum slew rate | 0.07 mA |
| Parallel/Serial | PARALLEL |
| Programming voltage | 21 V |
| technology | MOS |
| I/O type | COMMON |
| Memory IC Type | OTP ROM |
| Number of functions | 1 |
| character code | 8000 |
| Operating mode | ASYNCHRONOUS |
| Temperature level | COMMERCIAL |
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