EEWORLDEEWORLDEEWORLD

Part Number

Search

B0202AG-02-1692-C

Description
Fixed Resistor, Thin Film, 0.25W, 16900ohm, 100V, 0.25% +/-Tol, 50ppm/Cel, Surface Mount, 0202, CHIP
CategoryPassive components    The resistor   
File Size381KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

B0202AG-02-1692-C Overview

Fixed Resistor, Thin Film, 0.25W, 16900ohm, 100V, 0.25% +/-Tol, 50ppm/Cel, Surface Mount, 0202, CHIP

B0202AG-02-1692-C Parametric

Parameter NameAttribute value
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Rated temperature70 °C
surface mountYES
Operating Voltage100 V
Objectid1579360941
package instructionCHIP
Reach Compliance Codecompliant
ECCN codeEAR99
Is SamacsysN
YTEOL0
Tolerance0.25%
Installation featuresSURFACE MOUNT
Rated power dissipation(P)0.25 W
resistance16900 Ω
Resistor typeFIXED RESISTOR
size code0202
technologyTHIN FILM
Temperature Coefficient50 ppm/°C
Terminal shapeONE SURFACE
Number of terminals2
Package shapeRECTANGULAR PACKAGE
method of packingTRAY
Wire Bondable
Chip Resistors
WBC Series
Discrete or tapped schematics
MIL inspection available
High resistor density
IRC’s WBC series wire bondable chip resistors are ideally suited for
the most demanding hybrid application. The WBC combines IRC’s
TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to produce an extremely small
footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
(0.508mm ±0.025)
0.020˝ ±0.001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
(0.508mm ±0.025)
0.020˝ ±0.001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
R0202 and
T0303
B0202
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
(0.762mm ±0.025)
0.030˝ ±0.001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
WBC Series Issue January 2009 Sheet 1 of 3
EEWORLD University ---- Freescale Tire Pressure Monitoring Solution
Freescale Tire Pressure Monitoring Solution : https://training.eeworld.com.cn/course/620...
chenyy Automotive Electronics
Pressure sensor/pressure transmitter failure phenomena and solutions
Problem phenomenon Inspection and testing SolutionPressure sensor/pressure transmitter has no output 1: Check whether the power supply of the pressure sensor is connected in reverse; Connect the power...
cazsensor Industrial Control Electronics
Apply for ARM7 development board
Hope it can be approved! Thank you! Our products are used for industrial control, thank you...
eeleader NXP MCU
【MXCHIP Open1081】TCP+AD+18B20 and some issues
[i=s]This post was last edited by ljj3166 on 2014-11-30 14:57[/i] [size=4][b]Last time I used UDP to send data to PC[/b][/size] [size=4][b]This time I tried TCP, and drove 18B20 and an AD channel[/b][...
ljj3166 RF/Wirelessly
The stm32f103vb development board is very hot when debugging
The stm32f103vb development board, the mcu is not hot after power on, but it is very hot during debugging, but some functions can be realized. I don't know if the mcu is burned out...
mudashu stm32/stm8
Rookie Questions
Can anyone help me find some information about the 6502 microcontroller?...
xi19871208 MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1991  539  1087  1095  1184  41  11  22  23  24 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号