IC,SRAM,256X1,TTL,DIP,16PIN,CERAMIC
| Parameter Name | Attribute value |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Filter level | MIL-STD-883 Class C |
| Is Samacsys | N |
| Objectid | 1436311263 |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | compliant |
| ECCN code | 3A001.A.2.C |
| YTEOL | 0 |
| Is it Rohs certified? | No |
| organize | 256X1 |
| Nominal supply voltage (Vsup) | 5 V |
| Maximum access time | 80 ns |
| memory width | 1 |
| JESD-30 code | R-XDIP-T16 |
| JESD-609 code | e0 |
| Certification status | Not Qualified |
| technology | TTL |
| Temperature level | MILITARY |
| Memory IC Type | STANDARD SRAM |
| word count | 256 words |
| character code | 256 |
| Operating mode | ASYNCHRONOUS |
| Output characteristics | OPEN-COLLECTOR |
| Parallel/Serial | PARALLEL |
| Package body material | CERAMIC |
| Encapsulate equivalent code | DIP16,.3 |
| Package form | IN-LINE |
| surface mount | NO |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Number of terminals | 16 |
| Package shape | RECTANGULAR |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| encapsulated code | DIP |
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