PHJ-8P8C-10S-8-4 datasheet, PDF

PHJ-8P8C-10S-8-4: DescriptionTelecom and Datacom Connector, 8 Contact(s), Male, Right Angle, Solder Terminal, Receptacle; CategoryThe connector The connector; File Size573KB，7 Pages; ManufacturerPower Dynamics, Inc.; Websitehttp://www.powerdynamics.com/

Download Datasheet Parametric View All

PHJ-8P8C-10S-8-4 Overview

Telecom and Datacom Connector, 8 Contact(s), Male, Right Angle, Solder Terminal, Receptacle

Parameter Name	Attribute value
UL Flammability Code	94V-0
Guideline	CSA, UL
Is Samacsys	N
YTEOL	0
Objectid	1154829757
Reach Compliance Code	compliant
ECCN code	EAR99
Installation type	BOARD
Rated current (signal)	1.5 A
Body/casing type	RECEPTACLE
Contact point gender	FEMALE
Installation method	RIGHT ANGLE
Shell material	METAL
Total number of contacts	8
Other features	SHIELDED
Contact to complete cooperation	AU ON NI
insulator material	GLASS FILLED POLYBUTYLENE TEREPHTHALATE
Connector type	TELECOM AND DATACOM CONNECTOR
Contact resistance	20 mΩ
PCB row number	2
Terminal pitch	2.54 mm
Contact material	PHOSPHOR BRONZE
Contact style	TELCOM, MODULAR
Mixed contacts	NO
PCB contact pattern	STAGGERED
Plating thickness	30u inch
Shell surface	TIN
Board mount options	LOCATING POSTS
contact mode	RECTANGULAR
empty shell	NO
Insulator color	BLACK
PCB contact row spacing	2.54 mm
Termination type	SOLDER
subject depth	0.837 inch
body length	5.625 inch
Terminal length	0.127 inch
body width	0.541 inch
Insulation resistance	500000000 Ω
Number of ports	10
Dielectric withstand voltage	1000VAC V
Filter function	NO

About the delay method in 28335: In your current project, there is an ADC interrupt cycle of 125us. A 1ms 1s timing flag is set in the interrupt, and then in the while loop of main, it is judged that when the flag expires, CAN data u...; 龙江仙人 DSP and ARM Processors

Detailed analysis of 7 feasible processes for PCB production: 1. Circuit 1. Minimum line width: 6mil (0.153mm). That is to say, if the line width is less than 6mil, it will not be produced (the minimum line width and line spacing of the inner layer of the multil...; 随和的雏菊 PCB Design

About kernel objects?winobj: I want to know the differences among kernel objects, such as Arcname, basenamedobjects, callback, device, etc., which are seen in Winobj. What are the differences among these kernel objects? It should...; 4219021 Embedded System

The process is getting smaller and smaller, which is the reason why chips are always out of stock: Reprinted from: https://stor.zol.com.cn/769/7694090.htmlOn May 7, the low-key blue giant IBM announced a major breakthrough in chip manufacturing technology. According to them, it has created the worl...; dcexpert Talking

The administrator came in and opened the prize for the posting activity with the theme of gratitude?: RT~~~~~~~~~~~~~~~...; glorys Talking

Mobile communication: [i=s]This post was last edited by paulhyde on 2014-9-15 09:52[/i] [url=http://www.dinghantech.com/chanpinfangan.asp?PotID=100&request_Style=2]High Frequency Switching DC Power Supply System[/url]...; conquer85 Electronics Design Contest

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components