A range of dc rated multi-layer chip capacitors from
0.47pF to 22µF and in case sizes 0603 to 8060 in
C0G/NP0 and X7R dielectrics. Suitable for all general
purpose and high reliability applications where package
size and reliability are important. All are manufactured
using Syfer’s unique wet process and incorporate
precious metal electrodes.
Dissipation Factor
Ageing Rate
Range Dimensions – Standard MLCC Ranges
Length
(L1)
mm/inches
1.6 ± 0.2
0.063 ± 0.008
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
5.7 ± 0.4
0.225 ± 0.016
5.7 ± 0.4
0.225 ± 0.016
9.2 ± 0.5
0.36 ± 0.02
14.0 ± 0.5
0.55 ± 0.02
20.3 ± 0.5
0.8 ± 0.02
Width
(W)
mm/inches
0.8 ± 0.2
0.031 ± 0.008
1.25 ± 0.2
0.05 ± 0.008
1.6 ± 0.2
0.063 ± 0.008
2.5 ± 0.3
0.1 ± 0.012
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
6.30 ± 0.4
0.25 ± 0.016
5.0 ± 0.4
0.197 ± 0.016
6.3 ± 0.4
0.25 ± 0.016
10.16 ± 0.5
0.4 ± 0.02
12.7 ± 0.5
0.5 ± 0.02
15.24 ± 0.5
0.6 ± 0.02
Max. Thickness
(T)
mm/inches
0.8
0.013
1.3
0.051
1.6
0.063
2.0
0.08
2.0
0.08
2.5
0.1
2.5
0.1
4.2
0.16
4.2
0.16
2.5
0.1
4.2
0.16
2.5
0.1
Termination Band
(L2)
mm/inches
min
0.10
0.004
0.13
0.005
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.5
0.02
0.5
0.02
0.5
0.02
max
0.40
0.015
0.75
0.03
0.75
0.03
0.75
0.03
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.5
0.06
1.5
0.06
1.5
0.06
Size
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
5550
8060
Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specific requests direct to the sales office.
Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be considered by request – please refer
[align=left][font=微软雅黑][size=5] Transistor Application from Beginner to Master --- Complete Collection of Transistor Data [/size][/font][/align] [align=left][font=微软雅黑][size=5] [/size][/font][/align] ...
Today, I compiled a Mitsubishi PLC sequential control instruction according to the PLC tutorial. Intention: After power on, S1 segment works for 10 seconds and outputs Y0, then switches to S2 segment ...
I have just started to learn WinCE embedded and now I am learning EVC. Do I need to master VC to learn EVC? Do I need other knowledge besides VC? What else do I need to learn to learn WinCE embedded h...
This lecture will introduce the new generation of solutions for TI's SimpleLink wireless processor family, which includes a new version with upgraded functions and cost optimization based on TI's exis...
stm32f107 communicates with RTL8201BL. When the network cable is plugged in, the MII line has a waveform of received data, but the stm32F107 debugging simulation cannot receive any data. Every registe...
Some time ago, I attended the 4th Energy Chemistry Forum of the Chinese Chemical Society and learned about high-energy-density and high-safety batteries. I would like to summarize and share this wi...[Details]
With the rapid development of technology, automotive intelligence is increasing at an unprecedented rate. This not only enhances vehicle functionality and comfort, but also places higher deman...[Details]
1. Introduction
Electronic scales are gradually replacing traditional measuring tools like springs and balances in everyday life, such as electronic price computing scales and electronic weigh...[Details]
Industrial computers with GPUs leverage powerful parallel processing to build deep learning models to analyze and respond to optical inputs. The systems develop an understanding of visual data to i...[Details]
According to Nikkei, Japan has performed poorly in responding to China's power semiconductor challenges.
There are five major companies in Japan's power chip market: Mitsubishi Electric,...[Details]
According to Nikkei, a survey found that global electric vehicle battery supply is expected to reach more than three times the required quantity due to
cooling
demand for electric vehicles,...[Details]
A patent disclosed by Ford proposes replacing traditional segmented side curtain airbags with integrated full-width side curtain airbags that span the side of the vehicle and can be deployed simult...[Details]
Tiantai Robot's official Weibo account announced on the evening of August 20 that Tiantai Robot Co., Ltd., together with strategic partners including Shandong Future Robot Technology Co., Ltd., Sha...[Details]
High-definition media consumption is experiencing a dual growth: an increase in the number of consumers and a transition to higher-definition content. This growth is driven by increasingly widespre...[Details]
The drive shaft is the shaft in a universal joint that transmits power. As a high-speed, low-support rotating body, its dynamic balance is crucial. Generally, drive shafts undergo dynamic balancing...[Details]
In the wave of electrification and intelligence in the automotive industry, the E/E architecture is transitioning from distributed to domain control and then to regional architecture.
Th...[Details]
New energy electric vehicles are energy-saving, environmentally friendly, have low operating costs, and enjoy strong support from national policies. With the growth in sales of new energy electric ...[Details]
In this era of transition, traditional fuel vehicles and new energy vehicles are at odds with each other. Many people say new energy vehicles are too complicated. While pure electric vehicles are f...[Details]
The basic structure of the power grid dispatching automation system includes three parts: control center, master station system, plant terminal (RTU) and information channel. According to the diffe...[Details]
Silicon carbide (SiC) power switching devices are becoming a popular choice for industrial battery applications due to their ability to achieve faster switching speeds and superior low-loss operati...[Details]
Embedded System
京公网安备 11010802033920号
EEWORLD
