Tantalum chip capacitors
SpeedPower, Low ESR
Construction
Polar tantalum capacitors with solid electrolyte
Conventional, optimized TaMnO
2
technology
Flame-retardant plastic case (UL 94 V-0)
Optionally tinned or gold-plated terminals
B45197A, B45198R, B450, B451
Features
Wide variety of Low ESR values
High ripple current capability
High volumetric efficiency
Excellent solderability
Stable temperature and frequency characteristics
Low leakage current, low dissipation factor
Low self-inductance
High resistance to shock and vibration
Suitable for use without series resistor
(special operating conditions recommended)
Lead-free and material content compatible with RoHS
Some partnumbers are only available in M (±20%) tolerance; these types have a maximum
capacitance drift at +125
°C
of +20%
Applications
Telecommunications (e.g. mobile phones, infrastructure)
Data processing (e.g. laptops, mainframes)
Measuring and control engineering (e.g. voltage regulators)
Automotive electronics (e.g. navigation systems, electronic control units)
Medical engineering
DC/DC converters
Soldering
Suitable for reflow soldering (IR and vapor phase, in compliance with JEDEC J-STD-020 C) and
wave soldering
Delivery mode
Taped and reeled in accordance with IEC 60286-3
Please read
Important notes
and
Cautions and warnings
at the end of this document.
Page 2 of 26
Tantalum chip capacitors
SpeedPower, Low ESR
Dimensional drawing
B45197A, B45198R, B450, B451
Encapsulation: molded epoxy resin
NiFe; tinned surface Sn100 or gold-plated
Reduced slot length for case size A
Dimensions
Case size
Dimensions in mm (inches)
KEMET
EIA/IECQ
L
W
A
3216-18
3.2
±0.2
(.126
±0.008)
3.5
±0.2
(.138
±0.008)
6.0
±0.3
(.236
±0.012)
7.3
±0.3
(.287
±0.012)
7.3
±0.3
(.287
±0.012)
1.6
±0.2
(.063
±0.008)
2.8
±0.2
(.110
±0.008)
3.2
±0.3
(.126
±0.012)
4.3
±0.3
(.169
±0.012)
4.3
±0.3
(.169
±0.012)
H
B
3528-21
C
6032-28
D
7343-31
E
7343-44
1.6
±0.2
(.063
±0.008)
1.9
±0.2
(.075
±0.008)
2.5
±0.3
(.098
±0.012)
2.8
±0.3
(.110
±0.012)
4.1
±0.3
(.161
±0.012)
L
2
typ. W
2
±0.1
H
2
typ. P
±0.3
±(.004)
±(.012)
3.2
1.2
1.3
0.8
(.126) (.047)
(.051) (.031)
3.5
2.2
(.138) (.087)
6.1
2.2
(.240) (.087)
7.3
2.4
(.287) (.094)
7.3
2.4
(.287) (.094)
1.4
0.7
(.055) (.027)
1.8
1.3
(.071) (.051)
1.8
1.3
(.071) (.051)
1.8
1.3
(.071) (.051)
Please read
Important notes
and
Cautions and warnings
at the end of this document.
Page 3 of 26
Tantalum chip capacitors
SpeedPower, Low ESR
Marking
Case size A
Case size B
B45197A, B45198R, B450, B451
Case sizes C, D, E
Voltage coding for case size A
Rated voltage
Code letter
2.5 4
F
G
6.3 10
J
A
16
C
20
D
25
E
35
V
50
T
Capacitance coding
1st and 2nd digit
3rd digit
Capacitance in pF
Multiplier:
6 = 10
6
pF
7 = 10
7
pF
8 = 10
8
pF
Date coding
Year
S = 2004
T = 2005
U = 2006
V = 2007
W = 2008
X = 2009
Month
1 = January
2 = February
3 = March
4 = April
5 = May
6 = June
7 = July
8 = August
9 = September
O = October
N = November
D = December
Please read
Important notes
and
Cautions and warnings
at the end of this document.
Page 4 of 26
Tantalum chip capacitors
SpeedPower, Low ESR
Specifications and characteristics in brief
Series
Ordering code
Technology
Terminals
Rated voltage
Rated capacitance
Capacitance tolerance
Maximum equivalent series
resistance
Operating temperature range
Failure rate
(1 fit = 1 10
-9
failures/h)
C
R
V
R
≤
330
µF
V
C
R
V
R
> 330
µF
V
Service life
Leakage current
Detail specification
Climatic category
(to IEC 60068-1)
(at 40
°C; ≤
V
R
,
R
S
≤
0.1
Ω/V)
(20
°C,
100 kHz)
ESR
max
T
op
(up to 85
°C)
(20
°C,
120 Hz)
V
R
C
R
B45197A, B45198R, B450, B451
SpeedPower
B45197A,
B450
Ta-MnO
2
Tinned
2.5 ... 50
0.15 ... 1000
±20%, ±10%
40 ... 15000
55 ... +125
mΩ
°C
fit
≤40
≤144
or 288
(dependent on type)
(V
R
, 5 min, 20
°C)
(tinned terminals)
( 55
°C/+125 °C/56
days damp heat test)
I
leak
>500000
10
CECC 30801-805
55/125/56
h
nA/µC
B45198R,
B451
Ta-MnO
2
Gold-plated
VDC
µF
Please read
Important notes
and
Cautions and warnings
at the end of this document.
Page 5 of 26
Microcontroller MCU
京公网安备 11010802033920号
EEWORLD
