and compact size to a new family of high power solid
state relays. As part of that family, the CPC1726 is
a normally open (1-Form-A) solid state relay. The
CPC1726 employs optically coupled MOSFET
technology to provide 2500V
rms
of input to output
isolation.
The optically coupled outputs, that use patented
OptoMOS architecture, are controlled by a highly
efficient infrared LED. The combination of low
on-resistance and high load current handling
capabilities makes the relay suitable for a variety of
high performance switching applications.
Features
•
•
•
•
•
•
•
•
Handle Load Currents Up to 1A
DC
2500V
rms
Input/Output Isolation
Power SIP Package
High Reliability
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Flammability Rating UL 94 V-0
Applications
•
•
•
•
•
•
•
•
•
•
•
•
Industrial Controls
Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
IC Equipment
Home Appliances
Approvals
•
UL 508 Certified Component: File E69938
•
CSA Certified Component: Certificate 1172007
Ordering Information
Part #
CPC1726Y
Description
4-Pin (8-Pin Body) Power SIP Package (25 per tube)
Pin Configuration
Switching Characteristics
of Normally Open Devices
Form-A
I
F
90%
I
LOAD
t
on
10%
t
off
DS-CPC1726-R04
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Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input control Current
Peak (10ms)
Input Power Dissipation
1
Total Power Dissipation
2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
CPC1726
Ratings
250
5
50
1
150
1600
2500
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
Derate linearly 3.33 mW / ºC
Derate linearly 16.667 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current, Continuous
Peak Load Current
On-Resistance
1
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Input/Output Characteristics
Capacitance, Input to Output
1
Conditions
Free air
t=10ms
I
L
=1A
V
L
=250V
P
I
F
=10mA, V
L
=10V
I
F
=0mA, V
L
=50V, f=1MHz
I
L
=1A
-
I
F
=5mA
V
R
=5V
V
IO
=0V, f=1MHz
Symbol
I
L
I
LPK
R
ON
I
LEAK
t
on
t
off
C
OFF
I
F
I
F
V
F
I
R
C
IO
Min
-
-
-
-
-
-
-
-
0.6
0.9
-
-
Typ
-
-
0.64
-
0.67
0.04
60
1.8
-
1.2
-
2
Max
1
3
0.75
1
5
2
-
10
-
1.4
10
-
Units
A
DC
A
µA
ms
pF
mA
mA
V
µA
pF
Measurement taken within 1 second of on-time.
Thermal Characteristics
Parameter
Thermal Impedance (junction to case)
Conditions
-
Symbol
R
JC
Min
-
Typ
1.5
Max
-
Units
°C/W
2
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PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical Turn-OnTime Distribution
(N=50, I
F
=10mA, V
L
=10V)
25
Device Count (N)
20
15
10
5
0
0.49
0.55
0.61 0.67 0.73 0.79
Turn-On Time (ms)
0.85
0.035
0.038 0.041 0.044 0.047
Turn Off Time (ms)
0.050
CPC1726
20
Typical Turn-Off Time Distribution
(N=50, I
F
=10mA, V
L
=10V)
25
20
15
10
5
0
Typical On-Resistance Distribution
(N=50, I
F
=10mA, I
L
=1A)
Device Count (N)
15
10
5
0
Device Count (N)
0.61
0.62
0.63 0.64 0.65 0.66
On Resistance ( )
0.67
Typical Blocking Voltage Distribution
(N=50)
30
25
Device Count (N)
Device Count (N)
20
15
10
5
0
285
288
291
294
297
Blocking Voltage (V
P
)
300
30
25
20
15
10
5
0
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA)
LED Forward Voltage (V)
Typical LED Forward Voltage
vs. Temperature
1.6
1.5
I
F
=50mA
1.4
I
F
=20mA
1.3
1.2
1.1
-40
I
F
=10mA
1.230
1.235
1.240
1.245
LED Forward Voltage (V)
1.250
-20
0
20
40
60
Temperature (ºC)
80
100
700
600
Turn-On Time ( s)
500
400
300
200
100
0
Typical Turn-On Time
vs. LED Forward Current
(V
L
=10V, R
L
=1k )
1.1
1.0
Turn-On Time (ms)
0.9
0.8
0.7
0.6
0.5
0.4
0.3
Typical Turn-On Time
vs. Temperature
(I
F
=10mA, V
L
=10V, R
L
=1k )
3.6
3.2
2.8
2.4
2.0
1.6
-40
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=500mA)
LED Current (mA)
10
20
30
40
LED Forward Current (mA)
50
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-20
0
20
40
60
Temperature (ºC)
80
100
Typical Turn-Off Time
vs. LED Forward Current
(V
L
=10V, R
L
=1k )
60
Turn-Off Time (ms)
Turn-Off Time ( s)
0.055
0.050
0.045
0.040
0.035
0.030
0.025
-40
Typical Turn-Off Time
vs. Temperature
(I
F
=10mA, V
L
=10V, R
L
=1k )
Typical I
F
for Switch Dropout
vs. Temperature
2.2
2.1
LED Current (mA)
2.0
1.9
1.8
1.7
1.6
-40
55
50
45
40
0
10
20
30
40
LED Forward Current (mA)
50
-20
0
20
40
60
Temperature (ºC)
80
100
-20
0
20
40
60
Temperature (ºC)
80
100
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R04
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PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Typical Load Current
vs. Load Voltage
(I
F
=10mA)
Load Current (mA
DC
)
CPC1726
1200
Load Current (mA)
1000
800
600
400
200
0
0.0
0.1
1100
1000
900
800
700
600
500
Maximum Load Current
vs. Temperature
(I
F
=10mA)
1.3
1.2
On-Resistance ( )
1.1
1.0
0.9
0.8
0.7
0.6
0.5
Typical On-Resistance vs. Temperature
(I
F
=10mA, I
L
=500mA)
0.2
0.3 0.4 0.5 0.6
Load Voltage (V)
0.7
0.8
-40
-20
0
20
40
60
Temperature (ºC)
80
100
0.4
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Typical Blocking Voltage
vs. Temperature
315
Leakage Current (nA)
Blocking Voltage (V
P
)
310
305
300
295
290
285
280
275
-40
-20
0
20
40
60
Temperature (ºC)
80
100
30
25
20
15
10
5
0
-40
Leakage Current vs. Temperature
Measured Across Pins 3 & 4
(V
L
=250V)
Energy Rating Curve
Free air, No Heat Sink
8
7
Load Current (A)
6
5
4
3
2
1
-20
0
20
40
60
Temperature (ºC)
80
100
0
10 s 100 s 1ms 10ms 100ms
Time
1s
10s
100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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Manufacturing Information
Moisture Sensitivity
CPC1726
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest
version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We
test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
CPC1726Y
Moisture Sensitivity Level (MSL) Classification
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be above (TC - 5)ºC. The classification temperature sets the Maximum Body
Temperature allowed for this device during lead-free reflow processes. For through hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device
CPC1726Y
Classification Temperature (T
c
)
245ºC
Dwell Time (t
p
)
30 seconds
Max Reflow Cycles
1
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce
or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken
to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash
and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the
washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake
temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the
user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not
be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
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Embedded System
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