product brief
Intel
®
440MX Chipset
For Applied Computing
The Intel
®
440MX chipset represents the latest
in chipset integration. By providing a cost
effective, low power single-component chipset
specifically designed to reduce system cost,
space and power, this product is ideal for low-
power, low cost applied computing platform
solutions. The 440MX chipset offers designers
an extremely cost effective way to enable Intel
quality, reliability, and initiatives across all their
low power market segments.
The 440MX chipset supports low power Intel
®
Celeron
TM
processor and Intel
®
Pentium
®
III
processor designs. The 440MX is offered in the
small form-factor, 492 Ball Grid Array (BGA)
package with a typical power dissipation of
2.1W making it an effective solution for fanless
applications.
The 440MX chipset provides advanced
features like support for USB, ACPI power
management and AC-97 link interface, which
enable soft technologies. The chipset is a single-
component that integrates the North Bridge and
the South Bridge and an additional AC-97
digital link (2 channels) into one chip. It
replaces the ISA interface with an 8-bit X-bus
that supports KBC, SIO, and Flash memory.
Figure 1 illustrates a block diagram of the
440MX platform.
Product Highlights
s
s
Lower power small total footprint
Based on the Intel
®
440BX AGPset Core
Architecture
Integrated DRAM controller
Supports up to 100 MHz SDRAM
256 MB maximum memory
AC’97 Host Controller
Power Management
PCI Rev 2.2 Compliant
4 PCI Bus Masters
Integrated IDE Controller for Ultra DMA/33
Integrated USB Controller
Low Cost PCI Graphics
SMBus Interface
492 BGA
3.3-V core and mixed 3.3V with 5.0-V
tolerant and GTL I/O Buffers
2.1W (at 100 MHz) and 1.6-W (at 66 MHz)
TDP (typical) power dissipation with low-
power features enabled
s
s
s
s
s
s
s
s
s
s
s
s
s
s
s
Flexible processor support ranging from the
Intel Celeron processor – Low Power at
400 MHz to the Pentium
III
processor – Low
Power at 700 MHz and beyond with support
for 66 or 100 MHz Processor Side Bus
(PSB) speeds
Offers power management options such as
ACPI and Suspend To RAM (STR)
Supports highly integrated single chipset
combining north and south bridges
s
s
LINECARD
PRODUCT
440MX
PRODUCT CODE
FW82443MX100
PACKAGE
492 BGA
FEATURES
s
s
s
s
Combines the 440BX AGPset core architecture and PIIX4 south bridge into a single chip
Advanced power management features
AC-97 link interface based on Intel AC’97 Specification v 2.1
BOM cost savings
440MX
Provides New Level of Integration
Intel
processor
– Low Power &
Pentium
®
III processor
– Low Power
Celeron
™
®
Clocking
CK100
Thermal
Server
DC/DC
Module
SDRAM
100 PSB
IDE
SDRAM
PCI
Video
USB
USB
440MX-100
492
µBGA
3.3V PCI
CARDBUS
AC'97 CODEC
X-BUS
SERIAL
SIO
PARALLEL
440MX Chipset
Single component chipset
Integrates 443BX and PIIX4E
100/66 MHz PSB
492 mBGA
FLASH
BIOS
KBC/EC
FLOPPY
IR
Intel Access
Developer’s Site
Intel Embedded Chipsets
Other Intel Support:
Intel Literature Center
General Information Hotline
developer.intel.com
developer.intel.com/design/chipsets/embedded
developer.intel.com/design/litcentr
(800) 548-4725 7 a.m. to 7 p.m. CST (U.S. and Canada)
International locations please contact your local sales office.
(800) 628-8686 or (916) 356-3104 5 a.m. to 5 p.m. PST
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise,
to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such
products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel
products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent,
copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel
reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to them.
*Other brands and names are the property of their respective owners.
For more information, visit the Intel Web site at:
developer.intel.com
UNITED STATES AND CANADA
Intel Corporation
Robert Noyce Bldg.
2200 Mission College Blvd.
P.O. Box 58119
Santa Clara, CA 95052-8119
USA
© Intel Corporation 2001
EUROPE
Intel Corporation (UK) Ltd.
Pipers Way
Swindon
Wiltshire SN3 1RJ
UK
ASIA-PACIFIC
Intel Semiconductor Ltd.
32/F Two Pacific Place
88 Queensway, Central
Hong Kong, SAR
JAPAN
Intel Kabushiki Kaisha
P.O. Box 115 Tsukuba-gakuen
5-6 Tokodai, Tsukuba-shi
Ibaraki-ken 305
Japan
SOUTH AMERICA
Intel Semicondutores do Brazil
Rue Florida, 1703-2 and CJ22
CEP 04565-001 Sao Paulo-SP
Brazil
Order Number: 273492-001 Printed in USA/0301/10K/IL0372E GA