Continuous Power Dissipation (Note 1) ..............................5.3W
Operating Case Temperature Range (Note 4) .. -40NC to +85NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
Note 1:
Based on junction temperature T
J
= T
C
+ (q
JC
x V
CC
x I
CC
). This formula can be used when the temperature of the
exposed pad is known while the device is soldered down to a PCB. See the
Applications Information
section for details.
The junction temperature must not exceed +150NC.
Note 2:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial.
Note 3:
Junction temperature T
J
= T
A
+ (q
JA
x V
CC
x I
CC
). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150NC.
Note 4:
T
C
is the temperature on the exposed pad of the package. T
A
is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
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Industrial Control Electronics
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