MKL24Z32VFT4 datasheet, PDF - EEWORLD Datasheet

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MKL24Z32VFT4: Descriptionarm microcontrollers - mcu arm 32b 32kflash, 48; Categorysemiconductor Other integrated circuit (IC); File Size1MB，54 Pages; ManufacturerFREESCALE (NXP); Environmental Compliance

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arm microcontrollers - mcu arm 32b 32kflash, 48

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Freescale Semiconductor, Inc.

Data Sheet: Technical Data

Document Number: KL24P80M48SF0

Rev 5 08/2014

Kinetis KL24 Sub-Family

48 MHz Cortex-M0+ Based Microcontroller with USB

MKL24ZxxVFM4

MKL24ZxxVFT4

MKL24ZxxVLH4

MKL24ZxxVLK4

Designed with efficiency in mind. Compatible with all other

Kinetis L families as well as Kinetis K2x family. General purpose

MCU with USB 2.0, featuring market leading ultra low-power to

provide developers an appropriate entry-level 32-bit solution.

This product offers:

• Run power consumption down to 47 μA/MHz in very low

power run mode

• Static power consumption down to 2 μA with full state

retention and 4 μs wakeup

• Ultra-efficient Cortex-M0+ processor running up to 48 MHz

with industry leading throughput

• Memory option is up to 128 KB flash and 16 KB RAM

• Energy-saving architecture is optimized for low power with

90 nm TFS technology, clock and power gating techniques,

and zero wait state flash memory controller

32-pin QFN (FM)

48-pin QFN (FT)

5 x 5 x 1 Pitch 0.5 mm 7 x 7 x 1 Pitch 0.5 mm

64-pin LQFP (LH)

80-pin LQFP (LK)

10 x 10 x 1.4 Pitch 0.5 12 x 12 x 1.4 Pitch 0.5

Performance

• 48 MHz ARM

Cortex

-M0+ core

Memories and memory interfaces

• Up to 64 KB program flash memory

• Up to 8 KB SRAM

Human-machine interface

• Up to 66 general-purpose input/output (GPIO)

Communication interfaces

• USB full-/low-speed On-the-Go controller with on-

chip transceiver and 5 V to 3.3 V regulator

• Two 8-bit SPI modules

• One low power UART module

• Two UART modules

• Two I2C module

System peripherals

• Nine low-power modes to provide power optimization

based on application requirements

• COP Software watchdog

• 4-channel DMA controller, supporting up to 63 request

Analog Modules

sources

• 12-bit SAR ADC

• Low-leakage wakeup unit

• Analog comparator (CMP) containing a 6-bit DAC

• SWD debug interface and Micro Trace Buffer

and programmable reference input

• Bit Manipulation Engine

Clocks

• 32 kHz to 40 kHz or 3 MHz to 32 MHz crystal oscillator

• Multi-purpose clock source

• 1 kHz LPO clock

Operating Characteristics

• Voltage range: 1.71 to 3.6 V

Timers

• Six channel Timer/PWM (TPM)

• Two 2-channel Timer/PWM modules

• Periodic interrupt timers

• 16-bit low-power timer (LPTMR)

• Real time clock

Security and integrity modules

• 80-bit unique identification number per chip

Freescale reserves the right to change the detail specifications as may be required to

Table of Contents

1 Ratings.................................................................................... 5

1.1 Thermal handling ratings................................................. 5

1.2 Moisture handling ratings................................................ 5

1.3 ESD handling ratings....................................................... 5

1.4 Voltage and current operating ratings............................. 5

2 General................................................................................... 6

2.1 AC electrical characteristics.............................................6

2.2 Nonswitching electrical specifications..............................7

2.2.1 Voltage and current operating requirements....... 7

2.2.2 LVD and POR operating requirements................7

2.2.3 Voltage and current operating behaviors.............8

2.2.4 Power mode transition operating behaviors........ 9

2.2.5 Power consumption operating behaviors............ 10

2.2.6 EMC radiated emissions operating behaviors..... 16

2.2.7 Designing with radiated emissions in mind..........17

2.2.8 Capacitance attributes.........................................17

2.3 Switching specifications...................................................17

2.3.1 Device clock specifications..................................17

2.3.2 General switching specifications......................... 18

2.4 Thermal specifications..................................................... 18

2.4.1 Thermal operating requirements......................... 18

2.4.2 Thermal attributes................................................19

3 Peripheral operating requirements and behaviors.................. 19

3.1 Core modules.................................................................. 19

3.1.1 SWD electricals .................................................. 19

3.2 System modules.............................................................. 21

3.3 Clock modules................................................................. 21

3.3.1 MCG specifications..............................................21

3.3.2 Oscillator electrical specifications........................23

3.4 Memories and memory interfaces................................... 25

3.4.1 Flash electrical specifications.............................. 25

3.5 Security and integrity modules........................................ 27

3.6 Analog............................................................................. 27

3.6.1 ADC electrical specifications............................... 27

3.6.2 CMP and 6-bit DAC electrical specifications....... 30

3.7 Timers..............................................................................32

3.8 Communication interfaces............................................... 32

3.8.1 USB electrical specifications............................... 32

3.8.2 USB VREG electrical specifications.................... 32

3.8.3 SPI switching specifications................................ 33

3.8.4 Inter-Integrated Circuit Interface (I2C) timing...... 37

3.8.5 UART...................................................................39

Dimensions............................................................................. 39

4.1 Obtaining package dimensions....................................... 39

Pinout...................................................................................... 39

5.1 KL24 Signal Multiplexing and Pin Assignments...............39

5.2 KL24 pinouts....................................................................42

Ordering parts......................................................................... 46

6.1 Determining valid orderable parts....................................46

Part identification.....................................................................46

7.1 Description.......................................................................47

7.2 Format............................................................................. 47

7.3 Fields............................................................................... 47

7.4 Example...........................................................................47

Terminology and guidelines.................................................... 48

8.1 Definition: Operating requirement....................................48

8.2 Definition: Operating behavior......................................... 48

8.3 Definition: Attribute.......................................................... 48

8.4 Definition: Rating............................................................. 49

8.5 Result of exceeding a rating............................................ 49

8.6 Relationship between ratings and operating

requirements....................................................................50

8.7 Guidelines for ratings and operating requirements..........50

8.8 Definition: Typical value...................................................51

8.9 Typical value conditions.................................................. 52

9 Revision history.......................................................................52

Freescale Semiconductor, Inc.

Kinetis KL24 Sub-Family, Rev5 08/2014.

MKL24Z32VFT4 Related Products

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