|
TMS5701224BPGEQQ1 |
TMS5701224BZWTQQ1 |
| Description |
ARM Microcontrollers - MCU 16/32-Bit RISC Flash MCU |
ARM Microcontrollers - MCU 16/32-Bit RISC Flash MCU |
| Brand Name |
Texas Instruments |
Texas Instruments |
| Is it lead-free? |
Lead free |
Lead free |
| Is it Rohs certified? |
conform to |
conform to |
| Maker |
Texas Instruments |
Texas Instruments |
| Parts packaging code |
QFP |
BGA |
| package instruction |
LFQFP, QFP144,.87SQ,20 |
LFBGA, BGA337,19X19,32 |
| Contacts |
144 |
337 |
| Reach Compliance Code |
compliant |
compli |
| ECCN code |
3A991.A.2 |
3A001.A.3 |
| Has ADC |
YES |
YES |
| bit size |
32 |
32 |
| CPU series |
CORTEX-R4F |
CORTEX-R4F |
| maximum clock frequency |
80 MHz |
80 MHz |
| DAC channel |
NO |
NO |
| DMA channel |
YES |
YES |
| JESD-30 code |
S-PQFP-G144 |
S-PBGA-B337 |
| JESD-609 code |
e4 |
e1 |
| length |
20 mm |
16 mm |
| Humidity sensitivity level |
3 |
3 |
| Number of I/O lines |
64 |
101 |
| Number of terminals |
144 |
337 |
| On-chip program ROM width |
8 |
8 |
| Maximum operating temperature |
125 °C |
125 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
| PWM channel |
YES |
YES |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
LFQFP |
LFBGA |
| Encapsulate equivalent code |
QFP144,.87SQ,20 |
BGA337,19X19,32 |
| Package shape |
SQUARE |
SQUARE |
| Package form |
FLATPACK, LOW PROFILE, FINE PITCH |
GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
| power supply |
1.2,3.3 V |
1.2,3.3 V |
| Certification status |
Not Qualified |
Not Qualified |
| RAM (bytes) |
196608 |
196608 |
| rom(word) |
1310720 |
1310720 |
| ROM programmability |
FLASH |
FLASH |
| Filter level |
AEC-Q100 |
AEC-Q100 |
| Maximum seat height |
1.6 mm |
1.4 mm |
| speed |
160 MHz |
180 MHz |
| Maximum slew rate |
350 mA |
375 mA |
| Maximum supply voltage |
1.32 V |
1.32 V |
| Minimum supply voltage |
1.14 V |
1.14 V |
| Nominal supply voltage |
1.2 V |
1.2 V |
| surface mount |
YES |
YES |
| technology |
CMOS |
CMOS |
| Temperature level |
AUTOMOTIVE |
AUTOMOTIVE |
| Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form |
GULL WING |
BALL |
| Terminal pitch |
0.5 mm |
0.8 mm |
| Terminal location |
QUAD |
BOTTOM |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
| width |
20 mm |
16 mm |
| uPs/uCs/peripheral integrated circuit type |
MICROCONTROLLER, RISC |
MICROCONTROLLER, RISC |