REVISIONS
LTR
A
B
C
D
E
F
G
DESCRIPTION
Changes in accordance with NOR 5962-R344-97.
Correct table II.
Correct dimensioning for figure 1, case outline Z.
Add device type 07. Redefine table I for device types 01 through 06.
Rewrite paragraphs 4.2.a.2. and 4.3.3.b.2 to add T
C
.
Add device types 08 through 13. Figure 1, add case outline U.
Add devices types 14 through 17. 1.3: Correct footnote 2/ from
“Hottest die.” to “Since there are multiple components in this part.
Thermal impedance is provided only for the hottest die”. 1.4: Correct
footnotes 1/ through 4/, from V
CC
to V logic. Table I; Added supply
current limits for 50 percent and 100 percent duty cycles. V
TH
correct
max limit from 700 mVp-p to 860 mVp-p. Table lll, change pins
“TXINHA and TXINHB” TO “TX INH OUT A and TX INH OUT B” Add
terminal symbol “TX INH IN A an d TX INH IN B”. -gc
DATE (YR-MO-DA)
97-06-12
98-05-14
01-09-25
03-06-18
04-11-15
05-05-11
13-03-19
APPROVED
K. A. Cottongim
K. A. Cottongim
Raymond Monnin
Raymond Monnin
Raymond Monnin
Raymond Monnin
Charles F. Saffle
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
G
15
G
16
G
17
G
18
REV
SHEET
PREPARED BY
Gary Zahn
CHECKED BY
Michael C. Jones
G
19
G
20
G
21
G
1
G
22
G
2
G
3
G
4
G
5
G
6
G
7
G
8
G
9
G
10
G
11
G
12
G
13
G
14
STANDARD
MICROCIRCUIT
DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil/
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
APPROVED BY
Kendall A. Cottongim
MICROCIRCUIT, HYBRID, LINEAR,
MIL-STD-1553, BC/RTU/MT, MULTIPLEXED
TERMINAL
DRAWING APPROVAL DATE
97-02-10
REVISION LEVEL
G
SIZE
A
SHEET
CAGE CODE
67268
1 OF
22
5962-96887
5962-E489-12
DSCC FORM 2233
APR 97
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When
available, a choice of radiation hardness assurance levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962
Federal
stock class
designator
\
-
RHA
designator
(see 1.2.1)
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
16
17
Generic number
BU61582X1
BU61582X2
BU61583X1
BU61583X2
BU61582X0
BU61583X0
BU61582X3
BU63825X1
BU63825X2
BU63925X1
BU63925X2
BU63825X0
BU63925X0
BU63825X3
BU63825X6
BU63925X3
BU63925X6
Circuit function
MIL-STD-1553, BC/RT/MT, 32K RAM, +5/-15 V transceiver
MIL-STD-1553, BC/RT/MT, 32K RAM, +5/-12 V transceiver
MIL-STD-1553, BC/RT/MT, 32K RAM, +5/-15 V transceiver, RT address latch
MIL-STD-1553, BC/RT/MT, 32K RAM, +5/-12 V transceiver, RT address latch
MIL-STD-1553, BC/RT/MT, 32K RAM, transceiverless
MIL-STD-1553, BC/RT/MT, 32K RAM, transceiverless, RT address latch
MIL-STD-1553, BC/RT/MT, 32K RAM, +5/+5 V transceiver
MIL-STD-1553, BC/RT/MT, 32K RAM, +5/-15 V transceiver
MIL-STD-1553, BC/RT/MT, 32K RAM, +5/-12 V transceiver
MIL-STD-1553, BC/RT/MT, 32K RAM, +5/-15 V transceiver, RT address latch
MIL-STD-1553, BC/RT/MT, 32K RAM, +5/-12 V transceiver, RT address latch
MIL-STD-1553, BC/RT/MT, 32K RAM, transceiverless
MIL-STD-1553, BC/RT/MT, 32K RAM, transceiverless, RT address latch
MIL-STD-1553, BC/RT/MT, 32K RAM, +5/+5 V transceiver
MIL-STD-1553, BC/RT/MT, 32K RAM, +5/+5 V transceiver with
“TX INHIBIT” (Transmit Inhibit)
MIL-STD-1553, BC/RT/MT, 32K RAM, +5/+5 V transceiver, RT
address latch
MIL-STD-1553, BC/RT/MT, 32K RAM, +5/+5 V transceiver, RT
address latch with “TX INHIBIT” (Transmit Inhibit)
96887
01
Device
type
(see 1.2.2)
/
H
Device
class
designator
(see 1.2.3)
X
Case
outline
(see 1.2.4)
X
Lead
finish
(see 1.2.5)
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level.
All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K,
and E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
K
H
Device performance documentation
Highest reliability class available. This level is intended for use in space
applications.
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
G
5962-96887
SHEET
2
DSCC FORM 2234
APR 97
G
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C, and D).
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
E
D
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
U
X
Y
Z
Descriptive designator
See figure 1
See figure 1
See figure 1
See figure 1
Terminals
70
70
70
70
Package style
Flat package with ceramic tie bars
Dual-in-line
Flat package
Gull wing
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 1/
Transceiver, channels A and B, positive input supply voltage range (+5VA, +5VB):
Device types 01 through 04, and 07 ......................................................................
Transceiver, channels A and B, positive input supply voltage range (+5VA, +5VB):
Device types 08 through 11, and 14 through 17 ....................................................
Transceiver, channels A and B, negative input supply voltage range (-VA, -VB):
Device types 01, 02, 03, and 04 ............................................................................
Transceiver, channels A and B, negative input supply voltage range (-VA, -VB):
Device types 08, 09, 10, and 11 ............................................................................
Logic supply voltage range (+5 V logic):
Device types 01 through 07 ...................................................................................
Device types 08 through 17 ...................................................................................
Power dissipation (P
D
): 1/ 2/ 3/
Device types 01, 03, 08, and 10 ............................................................................
Device types 02, 04, 09, and 11 ............................................................................
Device types 05, 06, 12, and 13 ............................................................................
Device type 07, and 14 through 17........................................................................
Storage temperature range .......................................................................................
Lead temperature (soldering, 10 seconds) ...............................................................
Thermal resistance, junction to case (θ
JC
):
Device types 01 through 07 ...................................................................................
Device types 08, 09, 10, and 11 ............................................................................
Device types 12 and 13 .........................................................................................
Device types 14 through 17 ...................................................................................
-0.3 V dc to +6.0 V dc
-0.5 V dc to +7.0 V dc
+0.5 V dc to -18 V dc
+0.5 V dc to -18 V dc
-0.3 V dc to +6.0 V dc
-0.5 V dc to +6.5 V dc
3.77 W
3.71 W
0.75 W
2.23 W
-65°C to +150°C
+300°C
6.99°C/W 2/
7.82°C/W 2/
7.10°C/W 2/
12°C/W 2/
1/
2/
3/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability. Applies up to T
C
= +125°C.
Since there are multiple components in this part. Thermal impedance is provided only for the hottest die.
Assumes 100 percent transmitter duty cycle on one channel and 0 percent duty cycle on the other channel.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
G
5962-96887
SHEET
3
DSCC FORM 2234
APR 97
1.4 Recommended operating conditions.
Transceiver, channels A and B, positive input supply voltage range (+5VA, +5VB):
Device types 01 through 04 and 08 through 11 .....................................................
Device types 07, and 14 through 17 ......................................................................
Logic supply voltage range (+5 V logic):
Device types 01 through 06 and 08 through 17 .....................................................
Device type 07.......................................................................................................
Transceiver, channels A and B, negative input supply voltage range (-VA, -VB):
Device types 01, 03, 08 and 10 .............................................................................
Device types 02 , 04, 09, and 11 ...........................................................................
Minimum logic high input voltage (V
IH
):
Device types 01 through 07 ...................................................................................
Device types 08 through 17 ...................................................................................
Device types 08 through 17 ...................................................................................
Maximum logic low input voltage (V
IL
).......................................................................
Device types 01 through 07 ...................................................................................
Device types 08 through 17 ...................................................................................
Device types 08 through 17 ...................................................................................
Operating frequency (F
OP
) ........................................................................................
Case operating temperature range (T
C
) ....................................................................
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at
https://assist.dla.mil/quicksearch/
or from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
+4.5 V dc to +5.5 V dc
+4.75 V dc to +5.25 V dc
+4.5 V dc to +5.5 V dc
+4.75 V dc to +5.25 V dc
-14.25 V dc to -15.75 V dc
-11.40 V dc to -12.60 V dc
3.9 V dc
3.85 V dc 1/
2.0 V dc 2/
1.3 V dc
1.3 V dc
1.35 V dc 3/
0.8 V dc 4/
12 MHz or 16 MHz
-55°C to +125°C
1/
2/
3/
4/
At V logic = 5.5 V dc, MSTCLR, CLOCK IN, STRBD inputs.
At V logic = 5.5 V dc, all other inputs.
At V logic = 4.5 V dc, MSTCLR, CLOCK IN, STRBD inputs.
At V logic = 4.5 V dc, all other inputs.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
A
REVISION LEVEL
G
5962-96887
SHEET
4
DSCC FORM 2234
APR 97
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The
manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as
defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not
affect the form, fit, or function of the device for the applicable device class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Pin functions. The pin functions shall be as specified in table III.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,
for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those
which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be
made available to the preparing activity (DLA Land and Maritime -VA) upon request.
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime -VA shall affirm that the
manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein.
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form,
fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply:
a.
Burn-in test, method 1015 of MIL-STD-883.
(1)
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DLA Land and Maritime -VA or the acquiring activity upon request.
Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance
with the intent specified in method 1015 of MIL-STD-883.
T
A
or T
C
as specified in the approved manufacturer's QM plan.
Burn-in test shall be for 320 hours.
(2)
(3)
b.
Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
100% Nondestructive bond pull test.
c.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
G
5962-96887
SHEET
5
DSCC FORM 2234
APR 97
FPGA/CPLD
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