Product Data Sheet
Industrial
SD Memory Card
S-200 Series
SPI, SD compliant
B U:
Date :
Re vi si o n :
Fi le :
Fl a sh Pr od u ct s
De ce m be r 11 , 2 0 1 2
1 .4 0
S -2 0 0 _d a t a _s h e et _S D - L xB N _ R ev 1 40 . d o c
Swissbit AG
Industriestrasse 4
CH-9552 Bronschhofen
Switzerland
Swissbit reserves the right to change products or specifications without notice.
www.swissbit.com
industrial@swissbit.com
Revision: 1.40
S-200_data_sheet_SD-LxBN_Rev140.doc
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S-200 Series
Industrial SD Memory Card
1
Feature
Custom-designed, highly-integrated memory controller
o
Fully compliant with SD Memory Card specification 2.0
o
Four integrated 4KByte Sector Buffers for fast data transfer
o
SPI Mode support
Standard SD Memory Card form factor
o
32.0mm x 24.0mm x 2.1mm
o
Write Protect slider
2.7…3.6V normal operating voltage
2.0…3.6V basic communication (CMD0, 15, 55 ACMD41) voltage
Low-power CMOS technology
Wear Leveling: equal wear leveling of static and dynamic data
The wear leveling assures that dynamic data as well as static data is balanced evenly across the memory.
With that the maximum write endurance of the device is guaranteed.
Patented power-off reliability
o
No data loss of older sectors
o
Max. 16 sectors data loss (old data kept) if power off during writing
High reliability
o
Best available SLC NAND Flash technology
o
Designed for embedded market
o
MTBF:
> 3,000,000 hours
o
Number of insertions: >10,000
o
Extended Temperature range -25° up to 85°C
o
Optional industrial Temperature range available -40° up to 85°C
Hot swappable
High performance
o
SD burst up to 25MB/s
o
SD Low speed 0…25MHz clock rate
o
SD High speed 25…50MHz clock rate
o
Flash burst up to 40MB/s
Available densities
o
up to 2GBytes (higher densities are in the SDHC S-220 Series available up to 8GB)
Controlled BOM
Life Time Monitoring SD/SPI with standard or vendor commands
Swissbit AG
Industriestrasse 4
CH-9552 Bronschhofen
Switzerland
Swissbit reserves the right to change products or specifications without notice.
www.swissbit.com
industrial@swissbit.com
Revision: 1.40
S-200_data_sheet_SD-LxBN_Rev140.doc
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2
Order Information
2.1 Extended and Industrial Temperature range
Table 1: Product List for standard products
Capacity
Part Number
512MB
SFSD0512LgBN1TO-t-ME-1x1-STD
1GB
SFSD1024LgBN2TO-t-ME-1x1-STD
2GB
SFSD2048LgBN2TO-t-DF-1x1-STD
g defines the product generation
t defines the temperature range (E=-25°C to +85°C, I=-40°C to +85°C)
x defines the FW
2.2 Current product list
Table 2: General Product List
Capacity
512MB
SFSD0512L1BN1TO-E-ME-161-STD
1GB
SFSD1024L1BN2TO-E-ME-161-STD
2GB
SFSD2048L1BN2TO-E-DF-161-STD
512MB
1GB
2GB
SFSD0512L1BN1TO-I-ME-161-STD
SFSD1024L1BN2TO-I-ME-161-STD
SFSD2048L1BN2TO-I-DF-161-STD
Part Number
2.3 Offered options for customer projects
Customer specified strings and IDs (MID, OID, PNM, PRV)
Customer specified capacities
Preload service
Customized labels & lasering
Swissbit AG
Industriestrasse 4
CH-9552 Bronschhofen
Switzerland
Swissbit reserves the right to change products or specifications without notice.
www.swissbit.com
industrial@swissbit.com
Revision: 1.40
S-200_data_sheet_SD-LxBN_Rev140.doc
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3 of 24
Contents
S-200 SERIES INDUSTRIAL SD MEMORY CARD
.............................................................................................................................. 2
1
FEATURE
....................................................................................................................................................................................... 2
2
ORDER INFORMATION
.................................................................................................................................................................. 3
2.1 E
XTENDED AND
I
NDUSTRIAL
T
EMPERATURE RANGE
......................................................................................................................... 3
2.2 C
URRENT PRODUCT LIST
............................................................................................................................................................ 3
2.3 O
FFERED OPTIONS FOR CUSTOMER PROJECTS
................................................................................................................................. 3
3
PRODUCT SPECIFICATION
............................................................................................................................................................. 5
3.1 S
YSTEM
P
ERFORMANCE
............................................................................................................................................................ 5
3.2 E
NVIRONMENTAL
S
PECIFICATIONS
............................................................................................................................................... 5
3.2.1 Recommended Operating Conditions................................................................................................................
5
3.2.2 Recommended Storage Conditions
................................................................................................................... 5
3.2.3 Humidity & ESD
.................................................................................................................................................... 6
3.2.4 Durability
.............................................................................................................................................................. 6
3.3 P
HYSICAL
D
IMENSIONS
............................................................................................................................................................ 6
3.4 R
ELIABILITY
.......................................................................................................................................................................... 6
4
CAPACITY SPECIFICATION
............................................................................................................................................................. 6
5
CARD PHYSICAL............................................................................................................................................................................
7
5.1 P
HYSICAL DESCRIPTION
............................................................................................................................................................ 7
6
ELECTRICAL INTERFACE
................................................................................................................................................................ 9
6.1 E
LECTRICAL DESCRIPTION
.......................................................................................................................................................... 9
6.2 DC
CHARACTERISTICS
..............................................................................................................................................................10
6.3 S
IGNAL
L
OADING
..................................................................................................................................................................10
6.4 AC
CHARACTERISTICS
.............................................................................................................................................................11
7
HOST ACCESS SPECIFICATION.......................................................................................................................................................13
7.1 SD
AND
SPI B
US
M
ODES
........................................................................................................................................................13
7.1.1 SD Bus Mode Protocol
..........................................................................................................................................13
7.1.2 SPI Bus Mode Protocol
........................................................................................................................................14
7.1.3 Mode Selection
....................................................................................................................................................14
7.2 C
ARD
R
EGISTERS
...................................................................................................................................................................15
8
DECLARATION OF CONFORMITY
...........................................................................................................................................18
9
ROHS AND WEEE UPDATE FROM SWISSBIT
................................................................................................................................19
10
PART NUMBER DECODER
..........................................................................................................................................................21
10.1 M
ANUFACTURER
..................................................................................................................................................................21
10.2 M
EMORY
T
YPE
....................................................................................................................................................................21
10.3 P
RODUCT
T
YPE
....................................................................................................................................................................21
10.4 C
APACITY
...........................................................................................................................................................................21
10.5 P
LATFORM
.........................................................................................................................................................................21
10.6 G
ENERATION
......................................................................................................................................................................21
10.7 M
EMORY
O
RGANIZATION
.......................................................................................................................................................21
10.8 T
ECHNOLOGY
......................................................................................................................................................................21
10.9 C
HANNELS
.........................................................................................................................................................................21
10.10 F
LASH
C
ODE
.....................................................................................................................................................................21
10.11 T
EMP
. O
PTION
...................................................................................................................................................................22
10.12 DIE C
LASSIFICATION
...........................................................................................................................................................22
10.13 PIN M
ODE
.......................................................................................................................................................................22
10.14 C
ONFIGURATION
XYZ
..........................................................................................................................................................22
10.15 O
PTION
............................................................................................................................................................................22
11
SWISSBIT LABEL SPECIFICATION
................................................................................................................................................23
11.1 F
RONT SIDE LABEL
.................................................................................................................................................................23
11.2 B
ACK SIDE LASERING
.............................................................................................................................................................23
12
REVISION HISTORY
.....................................................................................................................................................................24
Swissbit AG
Industriestrasse 4
CH-9552 Bronschhofen
Switzerland
Swissbit reserves the right to change products or specifications without notice.
www.swissbit.com
industrial@swissbit.com
Revision: 1.40
S-200_data_sheet_SD-LxBN_Rev140.doc
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4 of 24
3
Product Specification
The SD Memory Card is a small form factor non-volatile memory card which provides high capacity data storage.
Its aim is to capture, retain and transport data, audio and images, facilitating the transfer of all types of digital
information between a large variety of digital systems.
The Card operates in two basic modes:
SD card mode
SPI mode
The SD Memory Card also supports SD High Speed mode with up to 50MHz clock frequency.
The cards are compliant with
SD Memory Card Specification Part 1, Physical layer Specification V2.00
SD Memory Card Specification Part 2, File System Specification V2.00
The Card has an internal intelligent controller which manages interface protocols, data storage and retrieval as
well as hardware RS-code Error Correction Code (ECC), defect handling, diagnostics and clock control.
The wear leveling mechanism assures an equal usage of the Flash memory cells to extend the life time.
The hardware RS-code ECC allows to detect and correct 4 symbols per 528 Bytes.
The Card has a voltage detector and a powerful power-loss management feature to prevent data corruption after
power-down.
The power consumption is very low.
The data retention is 10 years @ life begin.
The cards are offered in 2 temperature ranges
Extended
-25°C…85°C
Industrial
-40…85°C on request
The cards are RoHS compliant and lead-free.
3.1 System Performance
Table 3: Performance
System Performance
Burst Data transfer Rate (max clock 50MHz)
Sustained Sequential Read
Sustained Sequential Write
512MB
1GB – 2GB
512MB
1GB – 2GB
typ
18.4
(1)(2)
18.4
(1)(2)
6.6
(1)(2)
12.8
(1)(2)
max
(1)
25 (166X)
21
21
13
18
Unit
MB/s
1.
2.
All values refer to Toshiba Flash 4Gb SD Memory Card in 4bit SD mode 50MHz, cycle time 20ns, write/read file sequential.
Sustained Speed measured with SanDisk Mobile mate USB-SD Memory Card reader. It depends on burst speed, flash type and
number, and file size
3.2 Environmental Specifications
3.2.1 Recommended Operating Conditions
Table 4: SD Memory Card Recommended Operating Conditions
Parameter
min
Commercial Operating Temperature
0
Industrial Operating Temperature
-40
Power Supply VCC (3.3V)
2.7
Table 5: Current consumption
Current Consumption (type)
Read
Write
Sleep Mode
typ
max
25
25
3.3
70
85
3.6
Unit
°C
°C
V
typ
28
55
0.2
max
40
60
0.3
Unit
mA
3.2.2 Recommended Storage Conditions
Table 6: SD Memory Card Recommended Storage Conditions
Parameter
min
Commercial Storage Temperature
-40
Industrial storage Temperature
-40
Swissbit AG
Industriestrasse 4
CH-9552 Bronschhofen
Switzerland
typ
max
25
25
85
100
Unit
°C
°C
Revision: 1.40
Swissbit reserves the right to change products or specifications without notice.
www.swissbit.com
industrial@swissbit.com
S-200_data_sheet_SD-LxBN_Rev140.doc
Page
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