Freescale Semiconductor
Technical Data
Document Number: MC34933
Rev. 2.0, 12/2013
1.4 A Dual H-Bridge Driver
Compatible with 3.0 V Logic
The 34933 is a two channel H-Bridge driver aimed at the digital
camera market. There are a variety of applications containing bipolar
step motors and/or brush DC motors, such as Auto Focus control for
the digital camera lens. The 34933 uses Freescale's proprietary
SMOS8 Bi CMOS process to deliver a low power device, with a
maximum quiescent current of 100
μA
for the motor drive supply and
400μA for the control logic supply.
The 34933 V
M
supply operates from 2.0 V to 7.0 V using an internal
charge pump, with independent control of each H-Bridge driver via the
MCU (IN1A, IN1B, IN2A, IN2B). The 34933 has a low total R
DS(ON)
of
1.0
Ω
(max. at 25 °C). Shoot-through current protection is a built-in
feature for the 34933 device.
The 34933 has four operation modes: forward, reverse, brake, and
tri-state (high-impedance). The 34933 employs a VCC detection circuit
to sense when the logic supply switches to an off-state with a maximum
current of 1uA to extend battery life. The H-Bridge drivers can be
independently pulse width modulated up to 200 kHz for speed/ torque
and/or current control. Note that tri-state mode of H-Bridge drivers can
occur when either VCC detect is low or the thermal detect is active.
Features
•
•
•
•
•
•
•
•
•
•
Built-in 2-channel H-Bridge driver
H-Bridge operation voltage 2.0 V~7.0 V
Max. load output current 1.0 A @ T
A
= 25 °C
Low total R
DS(ON)
0.8
Ω
(typ), 1.0
Ω
(max.) @ T
A
= 25 °C peak
Dual channel parallel driver, R
DS(ON)
0.4
Ω
(typ.). max. DC
current 1.4 A
PWM control input frequency up to 200 kHz
Built-in shoot-through current prevention circuit
Built-in charge pump circuit (external cap type)
VCC low voltage detection for logic power supply voltage
Thermal detection for H-Bridge driver
3V
34933
VCC
VG
CH
CL
IN1A
IN1B
IN2A
IN2B
VM1
VM2
OUT1A
OUT1B
5V
MC34933EP
34933
H-BRIDGE DRIVER
EP SUFFIX (Pb-FREE)
98ASA00110D
16-PIN UQFN
ORDERING INFORMATION
Device
(For Tape and Reel, add an R2
Suffix)
Temperature
Range (T
A
)
-20 °C to 85 °C
Package
16-UQFN
MCU
OUT2A
OUT2B
PGND1
PGND2
M
Stepper
Motor
Figure 1. 34933 Simplified Application Diagram
© Freescale Semiconductor, Inc., 2012-2013. All rights reserved.
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
VM
VG = VM+VCC
VCC
VCC
VG
VCC DETECTION
CHARGE PUMP
THERMAL DETECTION
VCCdet
tdet
CH
CL
VM1
VCCdet
VCC
VCC
High Side Driver
VCC
VG
tdet
VCC
IN1A
OUT1A
OUT1B
IN1B
CONTROL
LOGIC
IN2A
High Side Driver
LEVEL SHIFTER
PRE-DRIVER
Low Side Driver
PGND1
VM2
IN2B
OUT2A
OUT2B
Low Side Driver
PGND2
* VM1 and VM2 are connected internally. Both VM1 and VM2 must be tied together on the PCB.
PGND1 and PGND2 are connected internally. Both PGND1 and PGND2 must be tied together on the PCB.
Figure 2. 34933 Simplified Internal Block Diagram
34933
2
Analog Integrated Circuit Device Data
Freescale Semiconductor
PIN CONNECTIONS
PIN CONNECTIONS
OUT1B
VM1
CH
OUT1A
PGND1
PGND2
OUT2A
16 15 14 13
12
17
2
Exposed 11
Pad
10
3
1
4
5
OUT2B
6
VM2
7
IN2A
8
IN2B
9
CL
VG
VCC
IN1A
IN1B
Figure 3. 34933 Pin Connections
Table 1. 34933 Pin Definitions
Pin
Number
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Pin Name
OUT1A
PGND1
PGND2
OUT2A
OUT2B
VM2
IN2A
IN2B
IN1B
IN1A
VCC
VG
CL
CH
VM1
OUT1B
Pin Function
Output
Power supply
Power supply
Output
Output
Power supply
Input
Input
Input
Input
Power supply
Output
Input/Output
Input/Output
Power supply
Output
Formal Name
H-Bridge output 1A
Power ground 1
Power ground 2
H-Bridge output 2A
H-Bridge output 2B
Motor drive power supply 2
Logic input control 2A
Logic input control 2B
Logic input control 1B
Logic input control 1A
Control logic power supply
Charge pump output
capacitor
Charge pump capacitor 1
Charge pump capacitor 2
Motor drive power supply 1
H-Bridge output 1B
Definition
Output A of H-Bridge channel 1.
Power Supply Grounds for the 34933 device. Please refer to the
Application Diagram for recommended layout.
Power Supply Grounds for the 34933 device. Please refer to the
Application Diagram for recommended layout.
Output A of H-Bridge channel 2
Output B of H-Bridge channel 2
Power Supply pins for the 34933 Motor Drive circuitry. Please refer
to the Application diagram for recommended layout.
Logic input control of OUT2A
Logic input control of OUT2B
Logic input control of OUT1B
Logic input control of OUT1A
Power Supply for the Control Logic circuitry.
Charge Pump Output pin connected to an external capacitor. Note
the VG voltage is the sum of the VCC and VM power supplies.
Low side Charge Pump capacitor connection
High side Charge Pump capacitor connection
Power Supply pins for the 34933 Motor Drive circuitry. Please refer
to the Application diagram for recommended layout.
Output B of H-Bridge channel 1
The Exposed Pad is connected to Ground plane via the Exposed
Pad solder pad. Note the primary purpose of the Exposed pad for
34933 is thermal heat dissipation. Therefore, adequate thermal vias
should be included in the PCB design.
17
(1)
Exposed Pad Power supply
EP
Notes
1. Exposed pad is used as a heat sink. Connect it to the power ground through four thermal vias where the area is wide.
34933
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
ELECTRICAL RATINGS
Control Logic Power Supply Voltage
Motor Drive Power Supply
VCC Level Pin Voltage - IN1A, IN1B, IN2A, IN2B
VM Level Pin Voltage - OUT1A, OUT1B, OUT2A, OUT2B, CL
VM+VCC Level Pin Voltage - CH, VG
Motor Drive Maximum Load Current, T
A
= 85 °C
Motor Drive Maximum Load Current, T
A
= 25 °C
Motor Drive Maximum Peak Load Current
(3)
Power Dissipation
(4)
ESD Voltage
(2)
Human Body Model (HBM)
Machine Model (MM)
Charge Device Model (CDM)
THERMAL RATINGS
Operating Temperature Range
Operating Junction Temperature
Storage Temperature Range
THERMAL RESISTANCE
Thermal Resistance, Junction to Case
(5)
Peak Package Reflow Temperature During Reflow
(6), (7)
Notes
2.
3.
4.
5.
6.
7.
ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 W), the Machine Model
(MM) (CZAP = 200 pF, RZAP = 0 W), and the Charge Device Model (CDM), Robotic (CZAP = 4.0 pF).
Peak time is for 10ms pulse width at 200ms intervals. T
A
= 25°C.
R
θ
JA = 50 °C/W, in case of 2s2p printed-circuit board that defined on SEMI JEDEC JESD51- 3 and JESD51-6.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and
enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
R
θJC
T
PPRT
23
Note 7
°C/W
°C
T
A
T
J
Tstg
-20 to +85
150
-65 to +150
°C
°C
°C
VCC
VM
Vpin1
Vpin2
Vpin3
Iload_dc_MD
Iload_dc_MD
Iload_peak_MD
PD
V
ESD
±4000
±350
±1000
-0.5 to +6.0
-0.5 to +7.5
-0.5 to +5.5
-0.5 to +7.5
-0.5 to +13.5
0.7
1.0
1.4
1.0
V
V
V
V
V
A
A
A
W
V
Symbol
Value
Unit
34933
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Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
STATIC AND DYNAMIC ELECTRICAL CHARACTERISTICS
STATIC AND DYNAMIC ELECTRICAL CHARACTERISTICS
Table 3. Static and Dynamic Electrical Characteristics
Characteristics noted under conditions, VM = 5.0 V, VCC = 3.0 V, unless otherwise noted. Typical values noted reflect the
approximate parameter means at T
A =
25 °C under nominal conditions, unless otherwise noted.
Characteristic
POWER SUPPLY
Motor Drive Power Supply Voltage
Control Logic Power Supply Voltage
Driver Quiescent Supply Current (IN1A, IN1B,IN2A, IN2B = L)
No Signal Input
Logic Quiescent Supply Current (IN1A, IN1B, IN2A, IN2B = L)
No Signal Input
Control Logic Power Supply Operating Current (IN1A, IN2A = L, IN1B, IN2B = 200kHz)
Charge Pump Target Voltage
VM = 2.0 V, VCC = 2.7 V, I
LOAD =
0A
VM = 5.0 V, VCC = 3.0 V, I
LOAD =
0A
VM = 7.0 V, VCC = 5.5 V, I
LOAD =
0A
Charge Pump Wake Up Time
Charge pump is enabled in VCC>Vccdet
Driver Quiescent Supply Current at VCCDET = L
V
M
= 5.0 V, V
CC =
0 V
Charge Pump Switching Frequency
H-BRIDGE DRIVER
H-Bridge Driver High/Low Side Driver On-Resistance 1
V
CC
= 2.7 V, Isink = 100 mA, T
A =
25°C
H-Bridge Driver High/Low Side Driver On-Resistance 2
(8)
V
CC
= 2.7 V, Isink = 700mA, T
A =
25°C
H-Bridge Driver High/Low Side Driver On-Resistance 3
(8)
V
CC
= 2.7 V, Isink = 700mA, T
A =
85°C
H-Bridge Driver High/Low Side Driver On-Resistance 4
V
CC
= 3.0 V, Isink = 100mA, T
A =
25°C
H-Bridge Driver High/Low Side Driver On-Resistance 5
(8)
V
CC
= 3.0 V, Isink = 700mA, T
A =
25°C
H-Bridge Driver High/Low Side Driver On-Resistance 6
(8)
V
CC
= 3.0 V, Isink = 700mA, T
A =
85°C
H-Bridge Driver Output Body Diode Forward Voltage
I
f
= 100 mA
Input Pulse Frequency (INA/B)
Duty of input signal = 50 %
Notes
8. Guaranteed by design
F
IN
-
-
200
V
f
-
0.8
1.2
kHz
Ron6
-
0.49
0.58
V
Ron5
-
0.41
0.48
Ron4
-
0.39
0.43
Ron3
-
0.51
0.62
Ron2
-
0.43
0.51
Ron1
-
0.4
0.45
F
QP
I
QM_VCD = L
-
-
-
150
1.0
-
KHz
T
VGON
130
400
uA
I
VCC
V
G
4.2
7.6
12.0
4.45
7.8
12.3
4.7
8.0
12.5
us
I
QVCC
-
-
114
350
400
800
uA
V
V
M
V
cc
I
QM
-
72
100
uA
2.0
2.7
5.0
3.0
7.0
5.5
V
V
uA
Symbol
Min
Typ
Max
Unit
Ω
Ω
Ω
Ω
Ω
Ω
34933
Analog Integrated Circuit Device Data
Freescale Semiconductor
5