3D2D8G72UB3369MSP-5C datasheet, PDF

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3D2D8G72UB3369MSP-5C: DescriptionDDR DRAM, 128MX72, CMOS, PBGA208, BGA-208; Categorystorage storage; File Size235KB，2 Pages; Manufacturer3D PLUS

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3D2D8G72UB3369MSP-5C Overview

DDR DRAM, 128MX72, CMOS, PBGA208, BGA-208

3D2D8G72UB3369MSP-5C Parametric

Parameter Name	Attribute value
Nominal supply voltage (Vsup)	1.8 V
access mode	MULTI BANK PAGE BURST
memory density	9663676416 bit
memory width	72
organize	128MX72
Memory IC Type	DDR DRAM
Operating mode	SYNCHRONOUS
self refresh	YES
technology	CMOS
Temperature level	MILITARY
Other features	SELF REFRESH
Number of functions	1
Number of ports	1
word count	134217728 words
character code	128000000
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
JESD-30 code	R-PBGA-B208
width	16 mm
length	22 mm
Maximum seat height	5.9 mm
encapsulated code	BGA
Terminal pitch	1 mm
Package shape	RECTANGULAR
Package form	GRID ARRAY
surface mount	YES
Terminal form	BALL
Terminal location	BOTTOM
Number of terminals	208
Package body material	PLASTIC/EPOXY
Minimum operating temperature	-55 °C
Maximum operating temperature	125 °C
Is Samacsys	N
Objectid	1383342620
package instruction	BGA,
Reach Compliance Code	Unknown
ECCN code	EAR99

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MEMORY MODULE

DDR2 SDRam 128Mx72-BGA

3D2D8G72UB3369

DDR2 Synchronous Dynamic Ram

8Gbit DDR2 SDRam organized as 128Mx72, based on 128Mx16

MODULE

Pin Assignment (Top View)

BGA 208 - (11x19 - Pitch 1.00mm)

(TOP VIEW - VIEWED BY TRANSPARENCY)

Features

- Organized as 128Mx72

- Core supply voltage 1.8V +/- 0.1V

- I/O supply voltage 1.8V +/- 0.1V

- Jedec standard 1.8V I/0 (SSTL_18 compatible)

- Data rate = 400, 533, 667, 800 Mbps

- Differential data strobe per byte

- 4n-bit prefetch architecture

- DLL to align DQ and DQS transitions with CK

- 8 internal banks per die for concurrent operation

- Programmable CAS Latency

- Posted CAS Additive Latency

- Write Latency = Read Latency - 1

- Programmable Burst Lengths: 4 or 8

- One Die Termination

- 208 leaded or lead-free balls - pitch 1,0mm

- Available Temperature Range :

0°C to + 70°C

-40°C to + 85°C

-55°C to +125°C

- Suitable for high reliability applications

A B C D E F G H J K L MN P R T U VW

VCC

VSS

DQ35

DQ52

LDM3

DQ38

UDM3

VCC

VSS

VCC

VSS

DQ51

DQ36

VSS

DQ33

VCC

DQ43

DQ57

DQ46

VCC

BA2

DQ59

UDM2

DQ62

VCC

VSS

VCC

VSS

DNU

VSS

VCC

DQ50

DQ39

DQ55

DQ63

VCC

DQ34

DQ53

LDQS2

DQ58

DQ56

VSS

CK3

DQ37

VCC

VSS

#CK3

#CK2

VSS

VCC

VSS

CK2

DQ32

LDQS3 DQ48

DQ42

DQ40

LDM2 DQ49

DQ54

DQ44

DQ60

DQ41

A10

A11

#LDQS2 #LDQS3

DQ61

DQ45

VCC #UDQS2 DQ47 UDQS2 UDQS3 #

UDQS3

VSS

VREF

VSS

VCC

VSS

ODT

VCC

VSS

VCC

DQ30

UDM0

DQ27

VCC

BA0

DQ14

DQ25

DQ11

A12

DQ9

DQ28

DQ17

DQ1

#WE

DQ65

DQ67

VSS

A13

BA1

DQ12

DQ22

LDM0

DQ4

DQ19

DQ68

VSS

VCC

VSS

VCC

UDM1

DQ6

LDM1

DQ20

DQ3

VSS

VCC

VSS

#UDQS1

UDQS1 UDQS0 DQ15

#UDQS0

DQ13

DQ29

DQ8

DQ10

DQ24

DQ26

DQ31

DQ23

DQ7

DQ18

#RAS

#CS

VCC

#LDQS1 #LDQS0

DQ0

CK0

VSS

VCC

VSS

DQ16

#CK0

#CK1

VSS

VCC

LDQS1 LDQS0

DQ5

CK1

#CK4

VSS

DQ21

DQ2

CK4

VCC

#LDQS4

UDQS4

#UDQS4

LDQS4

#CAS

DQ66

VSS

DQ71

DQ64

DQ69

VCC

CKE

DQ70

LDM4

VCC

FUNCTIONAL BLOCK DIAGRAM

LDQS0/#LDQS0 - UDQS0/#UDQS0

LDM0/UDM0

LDQS1/#LDQS1 - UDQS1/#UDQS1

LDM1/UDM1

LDQS2/#LDQS2 - UDQS2/#UDQS2

LDM2/UDM2

General description

The 3D2D8G72UB3369 is a high-speed highly integrated

DDR2 Synchronous Dynamic Ram Memory.

It is organized with 4 chips of 2Gbit + 1 chip for ECC.

It is particularly well suited for use in high reliability, high

performance and high density system applications, such as

servers or workstations.

The 3D2D8G72UB3369 is

packaged in a 208 balls BGA

DQ00-15

DQ16-31

DQ32-47

DQ48-63

DQ64-71

#CS #WE

#RAS #CAS CKE

LDQS3/#LDQS3 - UDQS3/#UDQS3

LDM3/UDM3

LDQS4/#LDQS4 - UDQS4/#UDQS4

LDM4

CK0/#CK0

CK1/#CK1

CK2/#CK2

CK3/#CK3

CK4/#CK4

available with lead-free or leaded balls.

(All other signals are common to the five memories)

DDR Memory Module

BETELGEUSE

3D PLUS S.A. reserves the right to change or cancel products or specifications without notice

3DFP-0369-REV : 5 - NOVEMBER 2012

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