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74ABT244PW,118

Description
buffers & line drivers octal buf/line drvr 3-S
Categorylogic    logic   
File Size102KB,10 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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74ABT244PW,118 Overview

buffers & line drivers octal buf/line drvr 3-S

74ABT244PW,118 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconductor
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeTSSOP2
package instructionTSSOP, TSSOP20,.25
Contacts20
Manufacturer packaging codeSOT360-1
Reach Compliance Codecompliant
Control typeENABLE LOW
seriesABT
JESD-30 codeR-PDSO-G20
JESD-609 codee4
length6.5 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeBUS DRIVER
MaximumI(ol)0.064 A
Humidity sensitivity level1
Number of digits4
Number of functions2
Number of ports2
Number of terminals20
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP20,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)260
power supply5 V
Maximum supply current (ICC)30 mA
Prop。Delay @ Nom-Sup4.6 ns
propagation delay (tpd)4.6 ns
Certification statusNot Qualified
Maximum seat height1.1 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyBICMOS
Temperature levelINDUSTRIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width4.4 mm
Base Number Matches1
INTEGRATED CIRCUITS
74ABT244
Octal buffer/line driver (3-State)
Product specification
Supersedes data of 1995 Sep 06
IC23 Data Handbook
1998 Jan 16
Philips
Semiconductors

74ABT244PW,118 Related Products

74ABT244PW,118 74ABT244DB,112 74ABT244D,602 74ABT244DB,118 74ABT244D,623 74ABT244PW,112
Description buffers & line drivers octal buf/line drvr 3-S buffers & line drivers octal buf/line drvr buffers & line drivers octal buff/ldrvr 3st buffers & line drivers octal buff/ldrvr 3st buffers & line drivers octal buffer/line driver 3-S buffers & line drivers octal buf/line drvr
Brand Name NXP Semiconductor NXP Semiconductor NXP Semiconductor NXP Semiconductor NXP Semiconductor NXP Semiconductor
Is it Rohs certified? conform to conform to conform to conform to conform to conform to
Maker NXP NXP NXP NXP NXP NXP
Parts packaging code TSSOP2 SSOP2 SOP SSOP2 SOP TSSOP2
package instruction TSSOP, TSSOP20,.25 SSOP, SSOP20,.3 SOP, SOP20,.4 SSOP, SSOP20,.3 SOP, SOP20,.4 TSSOP, TSSOP20,.25
Contacts 20 20 20 20 20 20
Manufacturer packaging code SOT360-1 SOT339-1 SOT163-1 SOT339-1 SOT163-1 SOT360-1
Reach Compliance Code compliant compliant compliant compliant compliant compliant
Control type ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW
series ABT ABT ABT ABT ABT ABT
JESD-30 code R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20 R-PDSO-G20
JESD-609 code e4 e4 e4 e4 e4 e4
length 6.5 mm 7.2 mm 12.8 mm 7.2 mm 12.8 mm 6.5 mm
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
MaximumI(ol) 0.064 A 0.064 A 0.064 A 0.064 A 0.064 A 0.064 A
Humidity sensitivity level 1 1 1 1 1 1
Number of digits 4 4 4 4 4 4
Number of functions 2 2 2 2 2 2
Number of ports 2 2 2 2 2 2
Number of terminals 20 20 20 20 20 20
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Output polarity TRUE TRUE TRUE TRUE TRUE TRUE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP SSOP SOP SSOP SOP TSSOP
Encapsulate equivalent code TSSOP20,.25 SSOP20,.3 SOP20,.4 SSOP20,.3 SOP20,.4 TSSOP20,.25
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Maximum supply current (ICC) 30 mA 30 mA 30 mA 30 mA 30 mA 30 mA
Prop。Delay @ Nom-Sup 4.6 ns 4.6 ns 4.6 ns 4.6 ns 4.6 ns 4.6 ns
propagation delay (tpd) 4.6 ns 4.6 ns 4.6 ns 4.6 ns 4.6 ns 4.6 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.1 mm 2 mm 2.65 mm 2 mm 2.65 mm 1.1 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES
technology BICMOS BICMOS BICMOS BICMOS BICMOS BICMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 0.65 mm 1.27 mm 0.65 mm 1.27 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 30 30 30 30 30
width 4.4 mm 5.3 mm 7.5 mm 5.3 mm 7.5 mm 4.4 mm
Base Number Matches 1 1 1 1 1 1
method of packing TAPE AND REEL TUBE - TAPE AND REEL TAPE AND REEL TUBE
Other features - POWER OFF DISABLE OUTPUTS TO PERMIT LIVE INSERTION POWER OFF DISABLE OUTPUTS TO PERMIT LIVE INSERTION POWER OFF DISABLE OUTPUTS TO PERMIT LIVE INSERTION POWER OFF DISABLE OUTPUTS TO PERMIT LIVE INSERTION -

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