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FH10A-23S-1SHB

Description
Card Edge Connector, 23 Contact(s), 1 Row(s), Male, Right Angle, 0.039 inch Pitch, Surface Mount Terminal, Locking Mech, Natural Insulator
CategoryThe connector    The connector   
File Size105KB,5 Pages
ManufacturerHirose
Websitehttp://www.hirose-connectors.com/
Download Datasheet Parametric View All

FH10A-23S-1SHB Overview

Card Edge Connector, 23 Contact(s), 1 Row(s), Male, Right Angle, 0.039 inch Pitch, Surface Mount Terminal, Locking Mech, Natural Insulator

FH10A-23S-1SHB Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerHirose
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresZIF
Board mount optionsPEG
body width0.118 inch
subject depth0.26 inch
body length1.15 inch
Connector typeFFC/FPC CONNECTOR
Contact to complete cooperationTIN LEAD
Contact completed and terminatedTIN LEAD
Contact point genderMALE
Contact materialPHOSPHOR BRONZE
contact modeRECTANGULAR
Contact resistance25 mΩ
Contact styleBELLOWED TYPE
DIN complianceNO
Dielectric withstand voltage500VAC V
Durability30 Cycles
Filter functionNO
IEC complianceNO
maximum insertion forceZIF N
Insulation resistance500000000 Ω
Insulator colorNATURAL
insulator materialPOLYBUTYLENE TEREPHTHALATE
JESD-609 codee0
MIL complianceNO
Plug contact pitch0.039 inch
Plug informationRIBBON CABLE
Mixed contactsNO
Installation option 1LOCKING MECH
Installation option 2LOCKING
Installation methodRIGHT ANGLE
Installation typeBOARD
PCB row number1
Number of rows loaded1
Maximum operating temperature85 °C
Minimum operating temperature-55 °C
OptionsGENERAL PURPOSE
PCB contact patternRECTANGULAR
Rated current (signal)0.5 A
GuidelineUL
reliabilityCOMMERCIAL
Terminal length
Terminal pitch1 mm
Termination typeSURFACE MOUNT
Total number of contacts23
UL Flammability Code94V-0
Evacuation force-minimum valueZIF N
Base Number Matches1
1mm Pitch FPC/FFC Connector
FH10A Series
sFeatures
1. ZIF Mechanism
ZIF mechanism allows a stable contact to slightly insert FPC
and FFC connectors and push movable members, so that
mounting serviceability can be secured.
2. 1mm Pitch Connector Suitable to SMT
This connector is installed in the board with high density, and
automatic mountable SMT type, while the contact pitch is 1mm.
3. Products Packaged in Embossed Tapes
Products packaged in embossed tapes are available,
correspondent to automatic mounting.
sApplications
HDD, facsimiles, printers, VTR, crystal liquid modules, etc.
sProduct
Specifications
Rating
Rated Current: 0.5A
Rated Voltage: 50V AC
Operating Temperature Range:-55~+85ç (Note 1) Storage Temperature Range:-10~+60ç (Note 2)
Operating Humidity Range:Relative humidity, 90% max. Storage Humidity Range:Relative humidity, 90% max.
(Not dewed)
Applicable FPC
Item
1. Insulation Resistance
2. Withstand voltage
3. Contact Resistance
4. Mechanical operation
5. Vibration
6. Shock
500Mø min
Neither short or breakdown should occur
25mø max.
* FPC conductor resistance included
Contact resistance : 25mø max.
No part should be broken, cracked or loosened
Electrical discontinuity, 1µs min.
No part should be broken, cracked or loosened
Electrical discontinuity, 1µs min.
No part should be broken, cracked or loosened
Contact resistance: 25mø max.
Insulation resistance: 50Mø min.
No part should be broken, cracked or loosened
Contact resistance: 25mø max.
Insulation resistance: 50Mø min.
No part should be broken, cracked or loosened
Neither appearance should be
deformed nor contact remarkably loosened.
t=0.3±0.5 Solder plating
Specification
Measured at 100V DC
500V AC for 1 minute
Measured at 100A
Condition
(Not dewed)
30 cycles
Frequency: 10~55Hz and full amplitude 1.52mm in
3 directions for 2 hours, respectively
Acceleration: 490m/S
2
, duration: 11ms, sine half-wave
in 3 directions for 3 times, respectively
7. Moisture Resistance in Steady State
Exposed to temperature 40ç and humidity 90~95% for 96 hours
8. Temperature Cycle
Temperature: -40ç¡+15~35¡+85¡+15~+35ç
Time: 30
¡
5~30 max.
¡
5 minutes
5 cycles under conditions as follows
Reflow: According to recommended temperature profile
Automatic soldering: 350±5 for 3 seconds
9. Resistance to Soldering heat
Note 1. Temperature rise included when energized
Note 2. This storage indicates a long-term storage state for the unusedproduct before board mounted.The operating temperature and
humidity ranges are applied to the non-energized state after the connector has been installed in the board.
Note 3. The above standards represent this series. The individual formal agreement should be based on the "Specification"
D10

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