BCP
Vishay Electro-Films
Thin Film Back-Contact Resistor with Part Mark
CHIP
RESISTORS
FEATURES
•
Only one wire bond required
Product may not
be to scale
•
Part marked - 5 digits maximum
•
Smallest size: 0.022 inches square
The BCP series single-value back-contact resistor chip
requires only one wire bond, thus saving hybrid space.
The BCPs are part marked with resistance value allowing user the
ability to visually determine the resistance value of the chip.
The BCPs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology. The BCPs are 100% electrically tested and
visually inspected to MIL-STD-883.
•
Resistance range: 10
Ω
to 1M
Ω
•
Oxidized silicon substrate for good power dissipation
•
Resistor material: tantalum nitride, self-passivating
•
Moisture resistant
APPLICATIONS
Vishay EFI BCP resistor chips are widely used in hybrid packages where space is limited. The bottom connection is made by
attaching the back of the chip to the substrate either eutectically or with conductive epoxy. The single wire bond is made to the
notched pad on the top of the chip. (The other rectangular pad on the top of the chip is a via hole, a low-ohmic contact connecting
the resistor to the bottom of the chip.) The die is part marked with the resistance value.
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES
Tightest Standard Tolerance Available
5%
2.5%
1%
0.5%
0.2%
0.1%
PROCESS CODE
CLASS H*
CLASS K*
133
132
131
130
103
102
101
100
*MIL-PRF-38534 inspection criteria
±
25ppm/°C
±
50ppm/°C
±
100ppm/°C
±
250ppm/°C
10Ω
20Ω 50Ω 100Ω 200Ω 1KΩ
200KΩ 360KΩ 620KΩ 1MΩ
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-202, Method 308
100
Ω
- 250k
Ω
< 100
Ω
or > 251k
Ω
Moisture resistance, MIL-STD-202
Method 106
Stability, 1000 hours, + 125°C, 125mW
Operating temperature range
Thermal shock, MIL-STD-202,
Method 107, Test condition F
High temperature exposure, + 150°C, 100 hours
Dielectric voltage breakdown
Insulation resistance
Operating voltage
DC power rating at + 70°C (derated to zero at + 175°C)
5 x rated power short-time overload, + 25°C, 5 seconds
- 35dB typical
- 20dB typical
± 0.5% maximum
∆
R/R
± 1.0% maximum
∆
R/R
- 55°C to + 125°C
± 0.25% maximum
∆
R/R
± 0.5% maximum
∆
R/R
100V
10
12
minimum
75V maximum
250mW
± 0.25% maximum
∆
R/R
VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121
• ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988
• SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389
www.vishay.com
58
For technical questions contact: efi@vishay.com
Document Number: 61027
Revision: 03-Aug-04
BCP
Thin Film Back-Contact Resistor
DIMENSIONS
in inches
CHIP
RESISTORS
0.005
PART MARK
PART MARK
PART MARK
PART MARK
Vishay Electro-Films
PART MARK
PART MARK
PART MARK
0.018
PART MARK
0.022
TYPICAL RANGE
< 30Ω
TYPICAL RANGE
30Ω - 199Ω
TYPICAL RANGE
200Ω - 1KΩ
0.004
TYPICAL RANGE
1KΩ - 1MΩ
STANDARD MARKING - 5 DIGITS
XXXX
Four significant digits of
value
X
Multiplier
C = 0.001
B = 0.01
A = 0.1
0=0
1 = 10
1 = 100
3 = 1000
SCHEMATIC
BACK OF DIE
MECHANICAL SPECIFICATIONS
in inches
PARAMETER
Chip size
Chip thickness
Chip substrate material
Resistor material
Bonding pad size
Number of pads
Pad material
Backing
Recommended attachment method
0.022 x 0.022 ± 0.002 (0.55 x 0.55 ± 0.05mm)
0.010 ± 0.002 (0.254 ± 0.05mm)
Oxidized silicon, 10kÅ minimum SiO
2
Tantalum nitride, self-passivating
0.005 x 0.005 (0.127 x 0.127mm)
1
10kÅ minimum aluminum
3kÅ minimum gold
Eutectic or conductive epoxy
ORDERING INFORMATION
Example: 100% visual, 10k
Ω,
± 1%, ± 250ppm/°C TCR, Aluminum Pads, Class H Visual inspection
W
INSPECTION
/PACKAGING
W = 100% visually inspected
parts in matrix tray per
MIL-STD-883
X = Sample, commercial visually
inspected parts loaded in matrix
trays (4% AQL)
BCP
PRODUCT
FAMILY
100
PROCESS
CODE
See Process Code
Table
1000
RESISTANCE
VALUE
Use first 4 digits
significant digits of the
resistance
1
MULTIPLIER
CODE
B
= 0.01
A
= 0.1
0
=1
1
= 10
2
= 100
3
= 1000
4
= 10000
F
TOLERANCE
CODE
B
= 0.1%
C
= 0.2%
D
= 0.5%
F
= 1.0%
G
= 2.0%
H
= 2.5%
J
= 5.0%
K
= 10%
VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121
• ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 • SINGAPORE +65.788.6668 FAX: +65.788.0988
• SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389
Document Number: 61027
Revision: 03-Aug-04
For technical questions contact: efi@vishay.com
www.vishay.com
59
Microchip MCU
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