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KIS064-33TT

Description
IC Socket, PGA64, 64 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,
CategoryThe connector    socket   
File Size175KB,2 Pages
ManufacturerAdvanced Interconnections Corp.
Download Datasheet Parametric View All

KIS064-33TT Overview

IC Socket, PGA64, 64 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,

KIS064-33TT Parametric

Parameter NameAttribute value
Installation methodSTRAIGHT
PCB contact patternRECTANGULAR
Termination typeSOLDER
Contact structure10X10
Contact to complete cooperationTIN LEAD OVER NICKEL
Contact completed and terminatedTin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Contact styleRND PIN-SKT
Shell materialPOLYAMIDE
Plug contact pitch0.1 inch
PCB contact row spacing0.1 mm
Contact materialBERYLLIUM COPPER
Number of contacts64
Terminal pitch2.54 mm
JESD-609 codee0
Maximum operating temperature400 °C
Minimum operating temperature-269 °C
Is it lead-free?No
Is it Rohs certified?No
YTEOL4.39
Objectid2102951703
Reach Compliance CodeCompliant
Country Of OriginUSA
ECCN codeEAR99
Is SamacsysN
Other features1.0 OZ. AVG. INSERTION FORCE
Device slot typeIC SOCKET
Type of equipment usedPGA64
body width1 inch
subject depth0.165 inch
body length1 inch
Low Insertion Force
Peel-A-Way
®
PGA Sockets
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
Peel-A-Way
®
Low Insertion Force PGA Sockets
Polyimide Film
.005
(.13)
Features:
• Disposable carriers peel away after
soldering.
• Peel-A-Way
®
tabs and full grid wafer
supplied on all Peel-A-Way
®
PGA sockets.
• Maximum air flow under PGA for greater
cooling.
• Better flux rinse and cleaning.
• Allows inspection of solder joints on both
sides of PCB.
• Lowest profile with use of type -210
terminal.
• Peel-A-Way
®
disposable socket terminal
carrier available in any configuration shown
or custom designed to meet your
specifications.
1
Footprint Dash #
If Applicable*
How To Order
KS
068
-85
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See next page
for terminal types
Body Type
KS - 2.5 oz.(70.85 g) avg. insertion force
KIS - 1 oz.(28.34 g) avg. insertion force
Number of Pins
004 to 484
*See pages 37 - 64
for PGA footprints
Polyimide Film
Polyimide Film
Terminals and Contacts:
Terminal: Brass - Copper Alloy (C36000)
ASTM-B-16
Contact: Beryllium Copper (C17200)
ASTM-B-194
Peel away
after soldering
to PCB.
PCB
Solder fillets visible both sides
for inspection and cleaning.
Solder Preform:
63% Tin, 37% Lead
How To Use:
1. Place socket in PCB.
2. Send PCB and socket through soldering operation.
3. Peel away polyimide film carrier.
Plating:
Terminal: Gold over Nickel or
Tin-Lead over Nickel
Contact: Gold over Nickel or
Tin-Lead over Nickel
Gold per MIL-G-45204
Tin-Lead per MIL-P-81728
Nickel per QQ-N-290
Sealant Options
RTV
Seal
Body Material:
KS/KIS -
Polyimide Film
-269˚C to 400˚C (-452˚F to 752˚F)
RTV Sealed
To order: Add RTV to end of part #
Note: RTV not available with HCS or HCIS Insulators
Peel-A-Way
®
covered by patent rights issued and/or pending.
Tape Sealed
To order: Add 3M to end of part #
inch/(mm)
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
Page 34

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Index Files: 264  2557  715  1890  1795  6  52  15  39  37 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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