SRAM Module, 128KX32, 55ns, CMOS, CQCC68
| Parameter Name | Attribute value |
| Is it Rohs certified? | No |
| ECCN code | 3A991.B.2.A |
| Is Samacsys | N |
| YTEOL | 0 |
| Objectid | 1154969289 |
| package instruction | QCCJ, LDCC68,1.0SQ |
| Reach Compliance Code | Unknown |
| Maximum access time | 55 ns |
| memory density | 4194304 bit |
| memory width | 32 |
| organize | 128KX32 |
| Nominal supply voltage (Vsup) | 5 V |
| Temperature level | COMMERCIAL |
| I/O type | COMMON |
| Output characteristics | 3-STATE |
| Minimum standby current | 2 V |
| Maximum slew rate | 0.48 mA |
| Parallel/Serial | PARALLEL |
| Maximum standby current | 0.003 A |
| technology | CMOS |
| Memory IC Type | SRAM MODULE |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | ASYNCHRONOUS |
| JESD-30 code | S-XQCC-J68 |
| JESD-609 code | e0 |
| Certification status | Not Qualified |
| Encapsulate equivalent code | LDCC68,1.0SQ |
| surface mount | YES |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Package body material | CERAMIC |
| encapsulated code | QCCJ |
| Package form | CHIP CARRIER |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Number of terminals | 68 |
| Package shape | SQUARE |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature |
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