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3SMAJ5915B

Description
Zener Diode, 3.9V V(Z), 5%, 3W, Silicon, Unidirectional, DO-214AC, PLASTIC, SMA, 2 PIN
CategoryDiscrete semiconductor    diode   
File Size125KB,4 Pages
ManufacturerMicro Commercial Components (MCC)
Download Datasheet Parametric View All

3SMAJ5915B Overview

Zener Diode, 3.9V V(Z), 5%, 3W, Silicon, Unidirectional, DO-214AC, PLASTIC, SMA, 2 PIN

3SMAJ5915B Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeDO-214AC
package instructionR-PDSO-C2
Contacts2
Reach Compliance Codecompliant
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JEDEC-95 codeDO-214AC
JESD-30 codeR-PDSO-C2
JESD-609 codee0
Number of components1
Number of terminals2
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityUNIDIRECTIONAL
Maximum power dissipation3 W
Certification statusNot Qualified
Nominal reference voltage3.9 V
surface mountYES
technologyZENER
Terminal surfaceTIN LEAD
Terminal formC BEND
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Maximum voltage tolerance5%
Working test current96.1 mA
Base Number Matches1
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

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$ %    !"#
3SMAJ5913B
THRU
3SMAJ5943B
3.0 Watt
Surface Mount
Silicon
Zener Diodes

Features
Surface Mount Application
3.3
thru
56
Volt Voltage Range
Low Inductance,Low Profile Mounting
Glass Passivated Junction
High specified maximum current (IZM) when adequately heat sinking
Mechanical Data
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
Terminals solderable per MIL-STD-750, Method 2026
Polarity is indicated by cathode band.
Packaging: Standard 12mm Tape (see EIA 481)
Maximum temperature for soldering: 260 C for 10 seconds.
0
DO-214AC

(SMA) (LEAD FRAME)
H



J
Maximum Ratings @ 25
o
C Unless Otherwise Specified
A
C
Junction
to
Lead
NOTES:
1.
2.
Maximum
Forward
Voltage
Steady State
Power
Dissipation
Operation and
Storage
Temperature
Thermal
Resistance
V
F
P
d
T
J
,
T
STG
E
1.5V
3.0W
-55
o
C to
+150
o
C
(Note: 1)
(Note: 2)
D
F
G
DIMENSIONS
INCHES
MIN
.079
.050
.002
---
.030
.065
.189
.157
.090
MM
MIN
2.00
1.27
.05
---
.76
1.65
4.80
4.00
2.25
B
R
thJL
25
/W
DIM
A
B
C
D
E
F
G
H
J
MAX
.096
.064
.008
.02
.060
.091
.220
.181
.115
MAX
2.44
1.63
.20
.51
1.52
2.32
5.59
4.60
2.92
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.085 ”
MA X
Forward Current @ 200mA.
Mounted on 5.0mm (.013mm thick) Iand areas.
Lead temperature at T
L
=75 C
0.05
MI N
2
0.058 ” MI N
o
Revision:
3
www.mccsemi.com
1 of 4
2007/04/19
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