PowerSource 1915 LMI
TM
2.5 Gb/s Laser Module - 10 mW
1550 nm Direct Modulation Laser
This Avanex laser module contains an Avanex SLMQW DFB laser with 25
Ω
impedance
matching designed for use in Wavelength Division Multiplexed (WDM) systems, high power
direct modulation operations up to 2.7 Gb/s supporting application up to 3200 ps/nm. The
module incorporates a thermoelectric cooler, precision thermistor, and optical isolator for
stable operation under all conditions.
FEATURES
• 10 mW Output Power
• Up to 3200 ps/nm Dispersion
Performance
• Low Dispersion Penalty
• Optimized for Direct Modulation up to
2.7 Gb/s
• Wavelength Selection According to
ITU-T G.692 from 1529.55 nm to
1569.59 nm
• 25
Ω
RF Impedance Matching and
DC Bias RF Filtering
• Industry-Standard Hermetic 14-Pin
Butterfly Package
• Low Profile Package (height 8.3 mm)
• InGaAsP Distributed FeedBack
SLMQW (DFB) Laser
CONTENTS
Description ............................................................1
Features.................................................................1
Applications ...........................................................1
Electrical and Optical Characteristics ...................2
Definitions..............................................................2
Absolute Maximum Ratings ..................................3
Pin-Out ..................................................................3
Mechanical Details ................................................4
Marketing, Packaging and Deliverable Data .........5
Device Marking .....................................................5
Packing..................................................................5
Deliverable Data ....................................................5
Safety and Handling ..............................................5
Safety and IEC.825 Classification .........................5
Handling ................................................................5
Ordering Information .............................................6
APPLICATIONS
• STM-16, OC-48 and DWDM
Metropolitan Area Networks
Equipment
• STM-16, OC-48 DWDM Transceiver
and Transponder for Metropolitan
and Extended Reach Metropolitan
Application
• Saturation Laser for WDM EDFA
• Instrumentation
• Digital CATV Transmission
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PowerSource 1915 LMI
TM
2.5 Gb/s Laser Module - 10 mW
ELECTRICAL AND OPTICAL CHARACTERISTICS
Table 1, unless otherwise stated: BOL @ Tcase = 25 °C
Parameter
Operating Case Temperature
Fiber-Coupled Peak Power
Threshold Current
Laser Forward Voltage
Modulation Current
Sym
Tc
Ppeak
I
th
V
f
I
f
ER
λ
Δλ
Twave
Δλ
/ΔTwave
Δλ
/ΔTc
TE
SMSR
ΔS
I
m
I
d
R
S
ΟΙ
I
t
V
t
R
TH
β
Conditions
@Twave
@Twave
@Ppeak = 10 mW; Pin 11 & 3
@Ppeak = 10 mW; Pin 11 & 3: Note 1; for Butterfly Package
@Ppeak = 10 mW; Pin 11 & 3: Note 1; for Low Profile Package
Min
-5
10
3
Typ
Max
70
Units
°C
mW
25
2.5
60
80
50
mA
V
mA
mA
dB
Extinction Ratio
Emission Wavelength
Δ(Emitted-Target
Wavelength)
Submount Temperature
Emitted
λ
Drift vs Twave
Emitted
λ
Drift vs Tcase
Tracking Error
Side Mode Suppression
Dispersion Penalty
Photodiode Current
Note 2
See Table 3
@Twave, See Table 3 for
Δ
target
20°C
≤
Tsubmount
≤
35°C
-5°C
≤
Tc
≤
70°C
@ Ppeak = 10 mW, Note 3
@Twave; Note 2
Note 2 and 4
V = -5 V, @Pmean = Ppeak/2, Note 4: for Butterfly Package
V = -5 V, @Pmean = Ppeak/2, Note 4: for Low Profile Package
10
1529.55
-0.1
20
90
0.5
10
40
-
2
30
15
300
300
0.1
25
30
-
-
9.7
3800
-
1.2
2.4
10.3
4000
1569.59
+0.1
35
nm
nm
°C
pm/°C
pm/°C
%
dB
dB
µA
µA
µA
Ω
dB
A
V
kΩ
K
Photodiode Dark Current
Serial Resistance
Optical Isolation
TEC Current EOL
TEC Voltage EOL
Thermistor Resistance
Thermistor
β
Coefficient
Note
Note
Note
Note
1:
2:
3:
4:
V = -5 V
Ppeak = 10mW; Pin 11 and 12
-5°C
≤
Tc
≤
70°C
@I(10mW), Twave = 20°C, Tc = 70°C
@I(10mW), Twave = 20°C, Tc = 70°C
Tsubmount = 25°C
Tsubmount = 25°C
Modulation current : I
f
= 2* (I
Pmean
-I
th
)* [ (1 – ER) / (1+ER) ] where Pmean = P
peak/2
. End Of Life criteria; delta I
f
/I
f
= 20% or delta I
m
/I
m
= 20%
2.488 Gb/s, Pmean, BER = 10 -10, ER = 10 +/- 0.1 dB for 1800 ps/nm, ER = 8.6 +/- 0.2 dB for 3200 ps/nm, NRZ line code, PRBS 2 23 -1
TE = Max {| [P(70 C) - P(25 C)] / P(25 C) |; | [P(-5 C) - P(25 C)] / P(25 C) | } measurements @ -5 & 70°C are with I
f
set at constant I
f
(25 C)
Application depending: 3200 ps/nm or 1800 ps/nm dispersion assuming fiber with an average dispersion of 18 ps/nm.km @ 1550 nm
DEFINITIONS
Twave:
Twave is the submount temperature at which the laser emission wavelength reaches the target wavelength with an accuracy of better
than:
λ
target
± 0.1 nm. This temperature is calculated during manufacturing according to: Twave = 25°C + (1/C)*(λ
target
-
λ
25°C
), where C is
the laser wavelength drift with temperature (in nm/°C).
Emitted wavelength drift vs Tcase:
Absolute value of maximum emitted wavelength deviation per unit of case temperature (°C) when
Tcase varies from min to max operating conditions. Wavelength is stabilized through the thermal regulation of the laser chip based on the
thermistor reading.
I
Pmean
:
Laser bias current (mA) allowing to reach the mean optical output power (Pmean).
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PowerSource 1915 LMI
TM
2.5 Gb/s Laser Module - 10 mW
ABSOLUTE MAXIMUM RATINGS
Exposing the device to stresses above those listed in absolute maximum rating could cause permanent damage.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Table 2
Parameter
Operating Case Temperature
Storage Temperature
Laser Forward Current
Laser Reverse Voltage
Photodiode Forward Current
Photodiode Reverse Voltage
TEC Voltage
TEC Current
Lead Soldering Time (at 260°C)
Fiber Bend Radius
Packing Mounting Screw Torque
25
0.2
Min
-10
-40
Max
70
85
150
2
1
20
2.8
1.4
10
Unit
°C
°C
mA
V
mA
V
V
A
s
mm
N.m
PIN-OUT
Nº
1
2
3
4
5
6
7
Description
Thermistor
Thermistor
Laser DC Bias (-)
Photodetector Anode (-)
Photodetector Cathode (+)
TEC (+)
TEC (-)
Nº
8
9
10
11
12
13
14
Description
Case Ground
Case Ground
Not Connected
RF Common (+)
Laser Modulation (-)
RF Common (+)
Not Connected
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PowerSource 1915 LMI
TM
2.5 Gb/s Laser Module - 10 mW
MECHANICAL DETAILS
Butterfly Package
Dimensions are in mm
Fiber length 1600 ± 100 mm
(including optical connector)
Low Profile Package
Dimensions are in mm
Fiber length 1600 ± 100 mm
(including optical connector)
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PowerSource 1915 LMI
TM
2.5 Gb/s Laser Module - 10 mW
MARKING, PACKAGING AND DELIVERABLE DATA
Device Marking
Each device includes the following information as a minimum:
1. Avanex logo
2. Product family name: 1915 LMI
3. Product code: 3CN code (see Ordering Information section)
4. Serial number
Packing
Each device is individually packed in an antistatic container and in such a manner as to prevent damage in transit.
The packaging shall include the following information:
1. Avanex logo
2. Product family name: PowerSource
TM
1915 LMI
3. Product code: 3CN code (see Ordering Information section)
4. Serial number
5. Hazard warning label (ESD)
6. Laser Safety Class Label
Deliverable Data
The following data shall be supplied with each device:
1. L(I)/V(I) curves @ Tc/ Tsubmount = 25°C/Twave
2. I
t
, V
t
@ Tc/Tsubmount = 25°C/70°C, P = 10mW
3. Values of Twave and RTH @ Tsubmount = Twave
4. Values of I
f
, I
m
, I
th
and external differential efficiency @ Tsubmount = Twave
5. Peak wavelength
λ
@ Tc = 25°C and Tsubmount = Twave under modulation
6. Dispersion penalty
ΔS
For Single Channel application Twave = Tsubmount = 25°C
Product testing shall be carried out at a level that ensures conformity to the customer specification.
SAFETY AND HANDLING
Safety and IEC.825 Classification
Take appropriate precautions to prevent undue exposure to naked eye. This product is classified Class 3A Laser Product according to
IEC.825. FDA/CDRH Class IIIb laser product. All versions are Class IIIb laser products per CDRH, 21 CFR 1040 Laser. Safety requirements
under accession number 9622256-00.
Handling
This product, in line with all similar devices, is sensitive to electrostatic discharge. Take precautions to prevent ESD; use wrist straps,
grounded work surfaces and recognized anti-static techniques when handling the laser. Handle the laser module by its package only, never
hold it by leads or pigtail.
For package mounting the following procedure should be carefully followed:
1. In order to achieve the ultimate thermal performance of the device, thermal paste can be usefully added on the support.
2. Tighten screws up to 200 mN/m - Do not exceed this mounting torque.
3. Assure that the leads are aligned and in contact with appropriate contact pads.
Care should be taken to avoid supply transient and over voltage. Over voltage above the maximum
specified in absolute maximum rating section (table 2) may cause permanent damage to the device.
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