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5962-8969001LX

Description
Standard SRAM, 2KX8, 25ns, CMOS, 1.280 X 0.310 INCH, 0.200 INCH HEIGHT, DIP-24
Categorystorage    storage   
File Size204KB,9 Pages
ManufacturerCypress Semiconductor
Download Datasheet Parametric Compare View All

5962-8969001LX Overview

Standard SRAM, 2KX8, 25ns, CMOS, 1.280 X 0.310 INCH, 0.200 INCH HEIGHT, DIP-24

5962-8969001LX Parametric

Parameter NameAttribute value
MakerCypress Semiconductor
Parts packaging codeDIP
package instructionDIP, DIP24,.3
Contacts24
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
Maximum access time25 ns
I/O typeCOMMON
JESD-30 codeR-XDIP-T24
length31.877 mm
memory density16384 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of ports1
Number of terminals24
word count2048 words
character code2000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize2KX8
Output characteristics3-STATE
ExportableYES
Package body materialUNSPECIFIED
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum seat height5.08 mm
Maximum standby current0.02 A
Minimum standby current4.5 V
Maximum slew rate0.135 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width7.62 mm
Base Number Matches1

5962-8969001LX Related Products

5962-8969001LX 5962-8969002LX 5962-8969002YX
Description Standard SRAM, 2KX8, 25ns, CMOS, 1.280 X 0.310 INCH, 0.200 INCH HEIGHT, DIP-24 Standard SRAM, 2KX8, 20ns, CMOS, 1.280 X 0.310 INCH, 0.200 INCH HEIGHT, DIP-24 Standard SRAM, 2KX8, 20ns, CMOS, 0.308 X 0.408 INCH, 0.078 INCH HEIGHT, LCC-24
Parts packaging code DIP DIP LCC
package instruction DIP, DIP24,.3 DIP, DIP24,.3 QCCN, LCC24,.3X.4
Contacts 24 24 24
Reach Compliance Code unknown unknown unknown
ECCN code 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
Maximum access time 25 ns 20 ns 20 ns
I/O type COMMON COMMON COMMON
JESD-30 code R-XDIP-T24 R-XDIP-T24 R-XQCC-N24
length 31.877 mm 31.877 mm 10.16 mm
memory density 16384 bit 16384 bit 16384 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 8 8
Number of functions 1 1 1
Number of terminals 24 24 24
word count 2048 words 2048 words 2048 words
character code 2000 2000 2000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C
organize 2KX8 2KX8 2KX8
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code DIP DIP QCCN
Encapsulate equivalent code DIP24,.3 DIP24,.3 LCC24,.3X.4
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL PARALLEL
power supply 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified
Filter level MIL-STD-883 MIL-STD-883 MIL-STD-883
Maximum seat height 5.08 mm 5.08 mm 1.9812 mm
Maximum standby current 0.02 A 0.02 A 0.02 A
Minimum standby current 4.5 V 4.5 V 4.5 V
Maximum slew rate 0.135 mA 0.15 mA 0.15 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount NO NO YES
technology CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY
Terminal form THROUGH-HOLE THROUGH-HOLE NO LEAD
Terminal pitch 2.54 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL QUAD
width 7.62 mm 7.62 mm 7.62 mm
Base Number Matches 1 1 1
Maker Cypress Semiconductor - Cypress Semiconductor
Number of ports 1 1 -
Exportable YES YES -
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