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89HPES24T3G2ZCBLG

Description
PCI Bus Controller, PBGA676, 27 X 27 MM, 1 MM PITCH, GREEN, FCBGA-676
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,48 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
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89HPES24T3G2ZCBLG Overview

PCI Bus Controller, PBGA676, 27 X 27 MM, 1 MM PITCH, GREEN, FCBGA-676

89HPES24T3G2ZCBLG Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instructionBGA, BGA676,26X26,40
Contacts676
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresALSO REQUIRES 3.3V SUPPLY
Address bus width
Bus compatibilityPCI
maximum clock frequency125 MHz
External data bus width
JESD-30 codeS-PBGA-B676
JESD-609 codee3
length27 mm
Number of terminals676
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA676,26X26,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)260
power supply1,2.5,3.3 V
Certification statusNot Qualified
Maximum seat height3.22 mm
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceMatte Tin (Sn)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width27 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
Base Number Matches1
24-Lane 3-Port
Gen2 PCI Express® Switch
®
89HPES24T3G2
Data Sheet
Device Overview
The 89HPES24T3G2 is a member of IDT’s PRECISE™ family of PCI
Express® switching solutions. The PES24T3G2 is a 24-lane, 3-port
Gen2 peripheral chip that performs PCI Express base switching with a
feature set optimized for high performance applications such as servers,
storage, and communications systems. It provides connectivity and
switching functions between a PCI Express upstream port and two
downstream ports and supports switching between downstream ports.
Features
High Performance PCI Express Switch
– Twenty-four 5 Gbps Gen2 PCI Express lanes supporting
5 Gbps and 2.5 Gbps operation
– Up to three switch ports
– Support for Max Payload Size up to 2048 bytes
– Supports one virtual channel and eight traffic classes
– Fully compliant with PCI Express base specification Revision
2.0
Flexible Architecture with Numerous Configuration Options
– Automatic per port link width negotiation to x8, x4, x2, or x1
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Supports in-band hot-plug presence detect capability
– Supports external signal for hot plug event notification allowing
SCI/SMI generation for legacy operating systems
– Dynamic link width reconfiguration for power/performance
optimization
– Configurable downstream port PCI-to-PCI bridge device
numbering
– Crosslink support
– Supports ARI forwarding defined in the Alternative Routing-ID
Interpretation (ARI) ECN for virtualized and non-virtualized
environments
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Supports bus locked transactions, allowing use of PCI Express
with legacy software
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates twenty-four 5 Gbps / 2.5 Gbps embedded SerDes,
8B/10B encoder/decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
– Ability to disable peer-to-peer communications
– Supports ECRC and Advanced Error Reporting
– All internal data and control RAMs are SECDED ECC
protected
– Supports PCI Express hot-plug on all downstream ports
– Supports upstream port hot-plug
Block Diagram
3-Port Switch Core / 24 Gen2 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
...
...
...
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 48
©
2010 Integrated Device Technology, Inc.
September 29, 2010
DSC 6930

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89HPES24T3G2ZCBLG 89HPES24T3G2ZCALIG 89HPES24T3G2ZCBLGI 89HPES24T3G2ZCBL 89HPES24T3G2ZCBLI
Description PCI Bus Controller, PBGA676, 27 X 27 MM, 1 MM PITCH, GREEN, FCBGA-676 PCI Bus Controller, PBGA324, 19 X 19 MM, 1 MM PITCH, GREEN, FCBGA-324 PCI Bus Controller, PBGA676, 27 X 27 MM, 1 MM PITCH, GREEN, FCBGA-676 PCI Bus Controller, PBGA676, 27 X 27 MM, 1 MM PITCH, FCBGA-676 PCI Bus Controller, PBGA676, 27 X 27 MM, 1 MM PITCH, FCBGA-676
Is it lead-free? Lead free Lead free Lead free Contains lead Contains lead
Is it Rohs certified? conform to conform to conform to incompatible incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Parts packaging code BGA BGA BGA BGA BGA
package instruction BGA, BGA676,26X26,40 BGA, FCBGA-676 FCBGA-676 BGA, BGA676,26X26,40
Contacts 676 324 676 676 676
Reach Compliance Code compliant compliant compliant compliant compliant
ECCN code EAR99 3A001.A.3 EAR99 EAR99 EAR99
Bus compatibility PCI PCI PCI PCI PCI
maximum clock frequency 125 MHz 125 MHz 125 MHz 125 MHz 125 MHz
JESD-30 code S-PBGA-B676 S-PBGA-B324 S-PBGA-B676 S-PBGA-B676 S-PBGA-B676
JESD-609 code e3 e3 e1 e0 e0
length 27 mm 19 mm 27 mm 27 mm 27 mm
Number of terminals 676 324 676 676 676
Maximum operating temperature 70 °C 85 °C 85 °C 70 °C 85 °C
Minimum operating temperature - -40 °C -40 °C - -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA BGA
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 260 260 245 225 225
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.22 mm 3.42 mm 3.22 mm 3.22 mm 3.22 mm
Maximum supply voltage 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V
Minimum supply voltage 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V
Nominal supply voltage 1 V 1 V 1 V 1 V 1 V
surface mount YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL
Terminal surface Matte Tin (Sn) Matte Tin (Sn) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BALL BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 30 30 30 30
width 27 mm 19 mm 27 mm 27 mm 27 mm
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Base Number Matches 1 1 1 1 1
Encapsulate equivalent code BGA676,26X26,40 - BGA676,26X26,40 BGA676,26X26,40 BGA676,26X26,40
power supply 1,2.5,3.3 V - 1,2.5,3.3 V 1,2.5,3.3 V 1,2.5,3.3 V
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