Standard SRAM, 128KX9, 9ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Micron Technology |
| Parts packaging code | QFP |
| package instruction | PLASTIC, MS-026, TQFP-100 |
| Contacts | 100 |
| Reach Compliance Code | not_compliant |
| ECCN code | 3A991.B.2.A |
| Maximum access time | 9 ns |
| I/O type | COMMON |
| JESD-30 code | R-PQFP-G100 |
| JESD-609 code | e0 |
| length | 20 mm |
| memory density | 1179648 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 9 |
| Number of functions | 1 |
| Number of terminals | 100 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 128KX9 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LQFP |
| Encapsulate equivalent code | QFP100,.63X.87 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK, LOW PROFILE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 235 |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.6 mm |
| Maximum standby current | 0.01 A |
| Minimum standby current | 3.14 V |
| Maximum slew rate | 0.25 mA |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3.135 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 30 |
| width | 14 mm |
| MT58LC32K36B4LG-9 | MT58LC32K36B4LG-10 | MT58LC32K32B4LG-8.5 | MT58LC32K36B4LG-8.5 | MT58LC32K32B4LG-7.5 | MT58LC64K18B4LG-8.5 | MT58LC64K18B4LG-7.5 | MT58LC32K36B4LG-7.5 | |
|---|---|---|---|---|---|---|---|---|
| Description | Standard SRAM, 128KX9, 9ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100 | Cache SRAM, 128KX9, 10ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100 | Cache SRAM, 128KX8, 8.5ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100 | Cache SRAM, 128KX9, 8.5ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100 | Cache SRAM, 128KX8, 7.5ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100 | Cache SRAM, 64KX18, 8.5ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100 | Cache SRAM, 64KX18, 7.5ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100 | Cache SRAM, 128KX9, 7.5ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Parts packaging code | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
| package instruction | PLASTIC, MS-026, TQFP-100 | PLASTIC, MS-026, TQFP-100 | PLASTIC, MS-026, TQFP-100 | PLASTIC, MS-026, TQFP-100 | PLASTIC, MS-026, TQFP-100 | PLASTIC, MS-026, TQFP-100 | PLASTIC, MS-026, TQFP-100 | PLASTIC, MS-026, TQFP-100 |
| Contacts | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
| Reach Compliance Code | not_compliant | not_compliant | unknown | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN code | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.B | 3A991.B.2.A | 3A991.B.2.B | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| Maximum access time | 9 ns | 10 ns | 8.5 ns | 8.5 ns | 7.5 ns | 8.5 ns | 7.5 ns | 7.5 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm |
| memory density | 1179648 bit | 1179648 bit | 1048576 bit | 1179648 bit | 1048576 bit | 1179648 bit | 1179648 bit | 1179648 bit |
| Memory IC Type | STANDARD SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM |
| memory width | 9 | 9 | 8 | 9 | 8 | 18 | 18 | 9 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
| word count | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 65536 words | 65536 words | 131072 words |
| character code | 128000 | 128000 | 128000 | 128000 | 128000 | 64000 | 64000 | 128000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 128KX9 | 128KX9 | 128KX8 | 128KX9 | 128KX8 | 64KX18 | 64KX18 | 128KX9 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP | LQFP |
| Encapsulate equivalent code | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 | QFP100,.63X.87 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE | FLATPACK, LOW PROFILE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
| Maximum standby current | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A | 0.01 A |
| Minimum standby current | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V |
| Maximum slew rate | 0.25 mA | 0.2 mA | 0.25 mA | 0.25 mA | 0.28 mA | 0.25 mA | 0.28 mA | 0.28 mA |
| Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| width | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |