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MT9JDF25672PIZ-1G4XX

Description
DDR DRAM Module, 256MX72, CMOS, HALOGEN FREE, MO-269, RDIMM-240
Categorystorage    storage   
File Size377KB,19 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Download Datasheet Parametric View All

MT9JDF25672PIZ-1G4XX Overview

DDR DRAM Module, 256MX72, CMOS, HALOGEN FREE, MO-269, RDIMM-240

MT9JDF25672PIZ-1G4XX Parametric

Parameter NameAttribute value
MakerMicron Technology
Parts packaging codeDIMM
package instructionHALOGEN FREE, MO-269, RDIMM-240
Contacts240
Reach Compliance Codeunknown
ECCN codeEAR99
access modeSINGLE BANK PAGE BURST
Other featuresSELF CONTAINED REFRESH
JESD-30 codeR-XDMA-N240
JESD-609 codee4
length133.35 mm
memory density19327352832 bit
Memory IC TypeDDR DRAM MODULE
memory width72
Number of functions1
Number of ports1
Number of terminals240
word count268435456 words
character code256000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256MX72
Package body materialUNSPECIFIED
encapsulated codeDIMM
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Certification statusNot Qualified
Maximum seat height4 mm
self refreshYES
Maximum supply voltage (Vsup)1.575 V
Minimum supply voltage (Vsup)1.425 V
Nominal supply voltage (Vsup)1.5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceGOLD
Terminal formNO LEAD
Terminal locationDUAL
width18.75 mm
1GB, 2GB (x72, ECC, SR) 240-Pin DDR3 RDIMM
Features
DDR3 SDRAM RDIMM
MT9JDF12872PZ – 1GB
MT9JDF25672PZ – 2GB
Features
• DDR3 functionality and operations supported as
defined in the component data sheet
• 240-pin, registered dual in-line memory module
(RDIMM)
• Fast data transfer rates: PC3-12800, PC3-10600,
PC3-8500, or PC3-6400
• 1GB (128 Meg x 72), 2GB (256 Meg x 72)
• V
DD
= 1.5V ±0.075V
• V
DDSPD
= +3.0V to +3.6V
• Supports ECC error detection and correction
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Single rank
• On-board I
2
C temperature sensor with integrated
serial presence-detect (SPD) EEPROM
• 8 internal device banks
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Gold edge contacts
• Halogen-free
• Fly-by topology
• Terminated control, command, and address bus
Table 1: Key Timing Parameters
Speed
Grade
-1G6
-1G4
-1G1
-1G0
-80B
Industry
Nomenclature
PC3-12800
PC3-10600
PC3-8500
PC3-8500
PC3-6400
Data Rate (MT/s)
CL = 11 CL = 10
1600
1333
1333
CL = 9
1333
1333
CL = 8
1066
1066
1066
1066
CL = 7
1066
1066
1066
CL = 6
800
800
800
800
800
CL = 5
667
667
667
667
667
t
RCD
t
RP
t
RC
Figure 1: 240-Pin RDIMM (MO-269 R/C K)
Module height: 18.75mm (0.738in)
Options
• Operating
– Commercial (0°C
T
A
+70°C)
– Industrial (–40°C
T
A
+85°C)
• Package
– 240-pin DIMM (halogen-free)
• Frequency/CAS latency
– 1.25ns @ CL = 11 (DDR3-1600)
– 1.5ns @ CL = 9 (DDR3-1333)
– 1.87ns @ CL = 7 (DDR3-1066)
Note:
temperature
1
Marking
None
I
Z
-1G6
-1G4
-1G1
1. Contact Micron for industrial temperature
module offerings.
(ns)
13.125
13.125
13.125
15
15
(ns)
13.125
13.125
13.125
15
15
(ns)
48.125
49.125
50.625
52.5
52.5
PDF: 09005aef83a2476b
jdf9c128_256x72pz.pdf - Rev. D 04/13
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
©
2009 Micron Technology, Inc. All rights reserved.
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