IC,SRAM,256X4,ECL10,DIP,24PIN,CERAMIC
| Parameter Name | Attribute value |
| Package body material | CERAMIC |
| Encapsulate equivalent code | DIP24,.4 |
| Package form | IN-LINE |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal location | DUAL |
| Number of terminals | 24 |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| surface mount | NO |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Is Samacsys | N |
| YTEOL | 0 |
| Objectid | 1435692419 |
| Reach Compliance Code | Compliant |
| ECCN code | EAR99 |
| Is it Rohs certified? | No |
| Maximum access time | 5 ns |
| memory density | 1024 bit |
| memory width | 4 |
| organize | 256X4 |
| I/O type | SEPARATE |
| word count | 256 words |
| character code | 256 |
| Maximum slew rate | 0.23 mA |
| technology | ECL10K |
| Temperature level | COMMERCIAL |
| Memory IC Type | STANDARD SRAM |
| Operating mode | ASYNCHRONOUS |
| Output characteristics | OPEN-EMITTER |
| Parallel/Serial | PARALLEL |
| JESD-30 code | R-XDIP-T24 |
| JESD-609 code | e0 |
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