OTP ROM, 128KX8, 150ns, CMOS, PDIP32, PLASTIC, DIP-32
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Fairchild |
| Parts packaging code | DIP |
| package instruction | DIP, DIP32,.6 |
| Contacts | 32 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 150 ns |
| Other features | TTL/CMOS COMPATIBLE INPUTS/OUTPUTS |
| I/O type | COMMON |
| JESD-30 code | R-PDIP-T32 |
| JESD-609 code | e0 |
| length | 41.912 mm |
| memory density | 1048576 bit |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 128KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP32,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| Maximum seat height | 5.334 mm |
| Maximum standby current | 0.00001 A |
| Maximum slew rate | 0.015 mA |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| Base Number Matches | 1 |
| FM27LV010N150L | FM27LV010NE150L | FM27LV010T150L | FM27LV010TE150L | FM27LV010V150L | FM27LV010VE150L | |
|---|---|---|---|---|---|---|
| Description | OTP ROM, 128KX8, 150ns, CMOS, PDIP32, PLASTIC, DIP-32 | OTP ROM, 128KX8, 150ns, CMOS, PDIP32, PLASTIC, DIP-32 | OTP ROM, 128KX8, 150ns, CMOS, PDSO32, PLASTIC, TSOP1-32 | OTP ROM, 128KX8, 150ns, CMOS, PDSO32, PLASTIC, TSOP1-32 | OTP ROM, 128KX8, 150ns, CMOS, PQCC32, PLASTIC, LCC-32 | OTP ROM, 128KX8, 150ns, CMOS, PQCC32, PLASTIC, LCC-32 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild | Fairchild |
| Parts packaging code | DIP | DIP | TSOP1 | TSOP1 | QFJ | QFJ |
| package instruction | DIP, DIP32,.6 | DIP, DIP32,.6 | TSOP1, TSSOP32,.8,20 | TSOP1, TSSOP32,.8,20 | QCCJ, LDCC32,.5X.6 | QCCJ, LDCC32,.5X.6 |
| Contacts | 32 | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 150 ns | 150 ns | 150 ns | 150 ns | 150 ns | 150 ns |
| Other features | TTL/CMOS COMPATIBLE INPUTS/OUTPUTS | TTL/CMOS COMPATIBLE INPUTS/OUTPUTS | TTL/CMOS COMPATIBLE INPUTS/OUTPUTS | TTL/CMOS COMPATIBLE INPUTS/OUTPUTS | TTL/CMOS COMPATIBLE INPUTS/OUTPUTS | TTL/CMOS COMPATIBLE INPUTS/OUTPUTS |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-PDIP-T32 | R-PDIP-T32 | R-PDSO-G32 | R-PDSO-G32 | R-PQCC-J32 | R-PQCC-J32 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 41.912 mm | 41.912 mm | 18.4 mm | 18.4 mm | 13.995 mm | 13.995 mm |
| memory density | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 32 | 32 | 32 | 32 | 32 | 32 |
| word count | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| character code | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C |
| organize | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | TSOP1 | TSOP1 | QCCJ | QCCJ |
| Encapsulate equivalent code | DIP32,.6 | DIP32,.6 | TSSOP32,.8,20 | TSSOP32,.8,20 | LDCC32,.5X.6 | LDCC32,.5X.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | CHIP CARRIER | CHIP CARRIER |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.334 mm | 5.334 mm | 1.2 mm | 1.2 mm | 3.56 mm | 3.56 mm |
| Maximum standby current | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A | 0.00001 A |
| Maximum slew rate | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA | 0.015 mA |
| Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | NO | NO | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | J BEND | J BEND |
| Terminal pitch | 2.54 mm | 2.54 mm | 0.5 mm | 0.5 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 15.24 mm | 15.24 mm | 8 mm | 8 mm | 11.455 mm | 11.455 mm |
京公网安备 11010802033920号
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