Wirewound Chip Inductors
FEATURES
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CERAMIC BODY, WIRE WOUND CHIP INDUCTOR
includes all homogeneous materials
SIZES K (0402)
HIGH CURRENT AND LOW DCR
*See Part Number System for Details
REFLOW SOLDERING APPLICABLE
TAPE & REEL PACKAGING FOR AUTOMATIC PICK-PLACE
Specifications
NIN-S Series
RoHS
Compliant
Case Size Code
0402 (K)
Inductance Range
1.3nH ~ 75nH
Inductance Tolerance
±0.1nH (B), ±0.2nH (C), ±0.3nH (S), ±0.5nH (D), ±2% (G), ±3% (H), ±5% (J), ±10% (K)
Operating Temperature Range
-40°C ~ +125°C (including self-heating)
ENVIRONMENTAL CHARACTERISTICS
Test
Solderability
Resistance to Soldering Heat
Humidity Resistance (no load)
High Temperature Resistance (no load)
Low Temperature Resistance (no load)
High Temperature Load Life
Humidity Load Life
Specifications
90% Min. Coverage
Test Method & Condition
Flux: 25% Resin, 75% Ethanol (by weight)
Solder: Sn/Ag3.0/Cu0.5,
Solder Temp.: 240 ± 5°C, Immersion: 3 ± 0.5 sec.
Device reflowed on pcb for 10 seconds at +260°C
± 5°C in solder Sn/Ag3.0/Cu0.5. Test time 6 min.
After 1000 hours at +60°C ± 2°C and 90 ~ 95% RH
(1) No mechanical damage
(2) Inductance change ±5% of initial value
(3) Q factor within ±20% of initial value.
Measure after chip is stablized at room
temperature for 1 ~ 2 hours.
After 1000 +24/-0 hours at +125°C ± 2°C
After 1000 +24/-0 hours at -40°C ± 2°C
After 1000 hrs at +125°C ± 2°C and rated current
After 1000 hrs at +60°C ± 2°C, 90~95% RH
and rated current
COMPONENT DIMENSIONS (mm):
Type
NIN-SK
Case Size
0402
A
1.10 ± 0.10
B
0.60 ± 0.10
B
B
C
0.60 ± 0.10
C
D ref.
0.20
E
F
E
0.50 ± 0.10
F
0.20 ± 0.10
A
D
PART NUMBER SYSTEM
NIN-S K 22N
J
TR F
Pb-free/RoHS compliant
Taped & Reeled
Tolerance Code: ±0.2nH (C), ±0.3nH (S), ±0.5nH (D), ±2% (G),
±3% (H), ±5% (J) and ±10% (K)
Inductance Value in Nanohenries
(see standard values table for appropriate value codes)
Case Code (K = 0402, J = 0603)
Series
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
®
1
NIC COMPONENTS CORP.
www.niccomp.com
Specifications are subject to change
F
Microcontroller MCU
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