SPST, 4 Func, 1 Channel, CMOS, CDIP14
| Parameter Name | Attribute value |
| package instruction | , |
| Reach Compliance Code | unknown |
| Analog Integrated Circuits - Other Types | SPST |
| JESD-30 code | R-GDIP-T14 |
| Nominal Negative Supply Voltage (Vsup) | |
| Number of channels | 1 |
| Number of functions | 4 |
| Number of terminals | 14 |
| Maximum on-state resistance (Ron) | 320 Ω |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| Maximum supply current (Isup) | 0.025 mA |
| Nominal supply voltage (Vsup) | 15 V |
| surface mount | NO |
| Maximum disconnect time | 95 ns |
| Maximum connection time | 95 ns |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| CD4066BFMS | 5962R9665201VXC | CD4066BDMSR | CD4066BDMS | 5962R9665201VCC | CD4066BKMSR | CD4066BKMS | |
|---|---|---|---|---|---|---|---|
| Description | SPST, 4 Func, 1 Channel, CMOS, CDIP14 | SPST, 4 Func, 1 Channel, CMOS, CDFP14 | SPST, 4 Func, 1 Channel, CMOS, CDIP14 | SPST, 4 Func, 1 Channel, CMOS, CDIP14 | SPST, 4 Func, 1 Channel, CMOS, CDIP14 | SPST, 4 Func, 1 Channel, CMOS, CDFP14 | SPST, 4 Func, 1 Channel, CMOS, CDFP14 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Analog Integrated Circuits - Other Types | SPST | SPST | SPST | SPST | SPST | SPST | SPST |
| JESD-30 code | R-GDIP-T14 | R-CDFP-F14 | R-CDIP-T14 | R-CDIP-T14 | R-CDIP-T14 | R-CDFP-F14 | R-CDFP-F14 |
| Number of channels | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of functions | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| Maximum on-state resistance (Ron) | 320 Ω | 320 Ω | 320 Ω | 320 Ω | 320 Ω | 320 Ω | 320 Ω |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | FLATPACK | IN-LINE | IN-LINE | IN-LINE | FLATPACK | FLATPACK |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply current (Isup) | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA |
| Nominal supply voltage (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| surface mount | NO | YES | NO | NO | NO | YES | YES |
| Maximum disconnect time | 95 ns | 95 ns | 95 ns | 95 ns | 95 ns | 95 ns | 95 ns |
| Maximum connection time | 95 ns | 95 ns | 95 ns | 95 ns | 95 ns | 95 ns | 95 ns |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - |
| JESD-609 code | - | e4 | e0 | - | e4 | e0 | - |
| Terminal surface | - | GOLD | Tin/Lead (Sn/Pb) | - | GOLD | Tin/Lead (Sn/Pb) | - |
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