MT41J256M8DA-125:K TR datasheet, PDF

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MT41J256M8DA-125:K TR: DescriptionSDRAM - DDR3 存储器 IC 2Gb（256M x 8）并联 800 MHz 13.75 ns 78-FBGA（8x10.5）; Categorysemiconductor memory; File Size3MB，215 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/; Environmental Compliance

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MT41J256M8DA-125:K TR Overview

SDRAM - DDR3 存储器 IC 2Gb（256M x 8）并联 800 MHz 13.75 ns 78-FBGA（8x10.5）

MT41J256M8DA-125:K TR Parametric

Parameter Name	Attribute value
category
Maker	Micron Technology
series	-
Package	Tape and Reel (TR)
memory type	Volatile
memory format	DRAM
technology	SDRAM - DDR3
storage	2Gb（256M x 8）
memory interface	in parallel
Write cycle time - words, pages	-
Voltage - Power supply	1.425V ~ 1.575V
Operating temperature	0°C ~ 95°C（TC）
Installation type	surface mount type
Package/casing	78-TFBGA
Supplier device packaging	78-FBGA（8x10.5）
Clock frequency	800 MHz
interview time	13.75 ns
Basic product number	MT41J256M8

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2Gb: x4, x8, x16 DDR3 SDRAM

Features

DDR3 SDRAM

MT41J512M4 – 64 Meg x 4 x 8 Banks

MT41J256M8 – 32 Meg x 8 x 8 Banks

MT41J128M16 – 16 Meg x 16 x 8 Banks

Features

•

= V

DDQ

= 1.5V ±0.075V

1.5V center-terminated push/pull I/O

Differential bidirectional data strobe

8n-bit prefetch architecture

Differential clock inputs (CK, CK#)

8 internal banks

Nominal and dynamic on-die termination (ODT)

for data, strobe, and mask signals

Programmable CAS READ latency (CL)

Posted CAS additive latency (AL)

Programmable CAS WRITE latency (CWL) based on

Fixed burst length (BL) of 8 and burst chop (BC) of 4

(via the mode register set [MRS])

Selectable BC4 or BL8 on-the-fly (OTF)

Self refresh mode

of 0°C to 95°C

– 64ms, 8192 cycle refresh at 0°C to 85°C

– 32ms, 8192 cycle refresh at 85°C to 95°C

Self refresh temperature (SRT)

Automatic self refresh (ASR)

Write leveling

Multipurpose register

Output driver calibration

Options

• Configuration

– 512 Meg x 4

– 256 Meg x 8

– 128 Meg x 16

• FBGA package (Pb-free) – x4, x8

– 78-ball (8mm x 10.5mm) Rev. K

– 78-ball (8mm x 10.5mm) Rev. N

• FBGA package (Pb-free) – x16

– 96-ball (8mm x 14mm) Rev. K

– 96-ball (8mm x 14mm) Rev. N

• Timing – cycle time

– 938ps @ CL = 14 (DDR3-2133)

– 1.07ns @ CL = 13 (DDR3-1866)

– 1.25ns @ CL = 11 (DDR3-1600)

– 1.5ns @ CL = 9 (DDR3-1333)

– 1.87ns @ CL = 7 (DDR3-1066)

• Operating temperature

– Commercial (0°C

≤

+95°C)

– Industrial (–40°C

≤

+95°C)

• Revision

Note:

Marking

512M4

256M8

128M16

-093

-107

-125

-15E

-187E

None

:K / :N

•

1. Not all options listed can be combined to

define an offered product. Use the part

catalog search on http://www.micron.com

for available offerings.

Table 1: Key Timing Parameters

Speed Grade

-093

1, 2, 3, 4

-107

1, 2, 3

-125

1, 2,

-15E

-187E

Notes:

Data Rate (MT/s)

2133

1866

1600

1333

1066

Target

RCD-

RP-CL

14-14-14

13-13-13

11-11-11

9-9-9

7-7-7

RCD

(ns)

CL (ns)

13.13

13.91

13.75

13.5

13.1

13.13

13.91

13.75

13.5

13.1

13.13

13.91

13.75

13.5

13.1

Backward compatible to 1066, CL = 7 (-187E).

Backward compatible to 1333, CL = 9 (-15E).

Backward compatible to 1600, CL = 11 (-125).

Backward compatible to 1866, CL = 13 (-107).

PDF: 09005aef826aaadc

2Gb_DDR3_SDRAM.pdf - Rev. S 02/16 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Products and specifications discussed herein are subject to change by Micron without notice.

2Gb: x4, x8, x16 DDR3 SDRAM

Features

Contents

State Diagram ................................................................................................................................................ 11

Functional Description ................................................................................................................................... 12

Industrial Temperature ............................................................................................................................... 12

General Notes ............................................................................................................................................ 12

Functional Block Diagrams ............................................................................................................................. 14

Ball Assignments and Descriptions ................................................................................................................. 16

Package Dimensions ....................................................................................................................................... 22

Electrical Specifications .................................................................................................................................. 26

Absolute Ratings ......................................................................................................................................... 26

Input/Output Capacitance .......................................................................................................................... 27

Thermal Characteristics .................................................................................................................................. 28

Electrical Specifications – I

Specifications and Conditions ............................................................................ 31

Electrical Characteristics – I

Specifications .................................................................................................. 42

Electrical Specifications – DC and AC .............................................................................................................. 45

DC Operating Conditions ........................................................................................................................... 45

Input Operating Conditions ........................................................................................................................ 45

AC Overshoot/Undershoot Specification ..................................................................................................... 50

Slew Rate Definitions for Single-Ended Input Signals ................................................................................... 54

Slew Rate Definitions for Differential Input Signals ...................................................................................... 56

ODT Characteristics ....................................................................................................................................... 57

ODT Resistors ............................................................................................................................................ 58

ODT Sensitivity .......................................................................................................................................... 59

ODT Timing Definitions ............................................................................................................................. 59

Output Driver Impedance ............................................................................................................................... 63

34 Ohm Output Driver Impedance .............................................................................................................. 64

34 Ohm Driver ............................................................................................................................................ 65

34 Ohm Output Driver Sensitivity ................................................................................................................ 66

Alternative 40 Ohm Driver .......................................................................................................................... 67

40 Ohm Output Driver Sensitivity ................................................................................................................ 67

Output Characteristics and Operating Conditions ............................................................................................ 69

Reference Output Load ............................................................................................................................... 71

Slew Rate Definitions for Single-Ended Output Signals ................................................................................. 72

Slew Rate Definitions for Differential Output Signals .................................................................................... 73

Speed Bin Tables ............................................................................................................................................ 74

Electrical Characteristics and AC Operating Conditions ................................................................................... 79

Command and Address Setup, Hold, and Derating ........................................................................................... 99

Data Setup, Hold, and Derating ...................................................................................................................... 107

Commands – Truth Tables ............................................................................................................................. 116

Commands ................................................................................................................................................... 119

DESELECT ................................................................................................................................................ 119

NO OPERATION ........................................................................................................................................ 119

ZQ CALIBRATION LONG ........................................................................................................................... 119

ZQ CALIBRATION SHORT .......................................................................................................................... 119

ACTIVATE ................................................................................................................................................. 119

READ ........................................................................................................................................................ 119

WRITE ...................................................................................................................................................... 120

PRECHARGE ............................................................................................................................................. 121

REFRESH .................................................................................................................................................. 121

SELF REFRESH .......................................................................................................................................... 122

DLL Disable Mode ..................................................................................................................................... 123

PDF: 09005aef826aaadc

2Gb_DDR3_SDRAM.pdf - Rev. S 02/16 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

2Gb: x4, x8, x16 DDR3 SDRAM

Features

Input Clock Frequency Change ...................................................................................................................... 127

Write Leveling ............................................................................................................................................... 129

Write Leveling Procedure ........................................................................................................................... 131

Write Leveling Mode Exit Procedure ........................................................................................................... 133

Initialization ................................................................................................................................................. 134

Mode Registers .............................................................................................................................................. 136

Mode Register 0 (MR0) ................................................................................................................................... 137

Burst Length ............................................................................................................................................. 137

Burst Type ................................................................................................................................................. 138

DLL RESET ................................................................................................................................................ 139

Write Recovery .......................................................................................................................................... 140

Precharge Power-Down (Precharge PD) ...................................................................................................... 140

CAS Latency (CL) ....................................................................................................................................... 140

Mode Register 1 (MR1) ................................................................................................................................... 142

DLL ENABLE/DISABLE .............................................................................................................................. 142

Output Drive Strength ............................................................................................................................... 143

OUTPUT ENABLE/DISABLE ...................................................................................................................... 143

TDQS ENABLE .......................................................................................................................................... 143

On-Die Termination (ODT) ........................................................................................................................ 144

WRITE LEVELING ..................................................................................................................................... 144

Posted CAS Additive Latency (AL) ............................................................................................................... 144

Mode Register 2 (MR2) ................................................................................................................................... 146

CAS WRITE Latency (CWL) ........................................................................................................................ 146

AUTO SELF REFRESH (ASR) ....................................................................................................................... 147

SELF REFRESH TEMPERATURE (SRT) ........................................................................................................ 147

SRT versus ASR .......................................................................................................................................... 148

Dynamic On-Die Termination (ODT) ......................................................................................................... 148

Mode Register 3 (MR3) ................................................................................................................................... 149

MULTIPURPOSE REGISTER (MPR) ............................................................................................................ 149

MPR Functional Description ...................................................................................................................... 150

MPR Address Definitions and Bursting Order .............................................................................................. 151

MPR Read Predefined Pattern .................................................................................................................... 156

MODE REGISTER SET (MRS) Command ........................................................................................................ 156

ZQ CALIBRATION Operation ......................................................................................................................... 157

ACTIVATE Operation ..................................................................................................................................... 158

READ Operation ............................................................................................................................................ 160

WRITE Operation .......................................................................................................................................... 171

DQ Input Timing ....................................................................................................................................... 179

PRECHARGE Operation ................................................................................................................................. 181

SELF REFRESH Operation .............................................................................................................................. 181

Extended Temperature Usage ........................................................................................................................ 183

Power-Down Mode ........................................................................................................................................ 184

RESET Operation ........................................................................................................................................... 192

On-Die Termination (ODT) ............................................................................................................................ 194

Functional Representation of ODT ............................................................................................................. 194

Nominal ODT ............................................................................................................................................ 194

Dynamic ODT ............................................................................................................................................... 196

Dynamic ODT Special Use Case ................................................................................................................. 196

Functional Description .............................................................................................................................. 196

Synchronous ODT Mode ................................................................................................................................ 202

ODT Latency and Posted ODT .................................................................................................................... 202

Timing Parameters .................................................................................................................................... 202

PDF: 09005aef826aaadc

2Gb_DDR3_SDRAM.pdf - Rev. S 02/16 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

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