MT48LC4M16A2P-7E:J TR datasheet, PDF

Datasheet> All Categories > semiconductor> memory> MT48LC4M16A2P-7E:J TR

MT48LC4M16A2P-7E:J TR: DescriptionSDRAM 存储器 IC 64Mb（4M x 16）并联 133 MHz 5.4 ns 54-TSOP II; Categorysemiconductor memory; File Size4MB，85 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/; Environmental Compliance

Download Datasheet Parametric View All

MT48LC4M16A2P-7E:J TR Overview

SDRAM 存储器 IC 64Mb（4M x 16）并联 133 MHz 5.4 ns 54-TSOP II

MT48LC4M16A2P-7E:J TR Parametric

Parameter Name	Attribute value
category
Maker	Micron Technology
series	-
Package	Tape and Reel (TR)
memory type	Volatile
memory format	DRAM
technology	SDRAM
storage	64Mb（4M x 16）
memory interface	in parallel
Write cycle time - words, pages	14ns
Voltage - Power supply	3V ~ 3.6V
Operating temperature	0°C ~ 70°C（TA）
Installation type	surface mount type
Package/casing	54-TSOP (0.400", 10.16mm wide)
Supplier device packaging	54-TSOP II
Clock frequency	133 MHz
interview time	5.4 ns
Basic product number	MT48LC4M16A2

Preview

Download Datasheet

View All

128Mb: x4, x8, x16 SDRAM

Features

SDR SDRAM

MT48LC32M4A2 – 8 Meg x 4 x 4 Banks

MT48LC16M8A2 – 4 Meg x 8 x 4 Banks

MT48LC8M16A2 – 2 Meg x 16 x 4 Banks

Features

• PC100- and PC133-compliant

• Fully synchronous; all signals registered on positive

edge of system clock

• Internal, pipelined operation; column address can

be changed every clock cycle

• Internal banks for hiding row access/precharge

• Programmable burst lengths (BL): 1, 2, 4, 8, or full

page

• Auto precharge, includes concurrent auto precharge

and auto refresh modes

• Self refresh modes: Standard and low power

(not available on AT devices)

• Auto Refresh

– 64ms, 4096-cycle refresh (commercial and

industrial)

– 16ms, 4096-cycle refresh (automotive)

• LVTTL-compatible inputs and outputs

• Single 3.3V ±0.3V power supply

• Plastic package – OCPL

– 54-pin TSOP II (400 mil)

– 54-pin TSOP II (400 mil) Pb-free

– 60-ball TFBGA (8mm x 16mm)

– 60-ball TFBGA (8mm x 16mm) Pb-

free

– 54-ball VFBGA (x16 only) (8mm x

8mm)

– 54-ball VFBGA (x16 only) (8mm x

8mm) Pb-free

• Timing – cycle time

– 7.5ns @ CL = 3 (PC133)

– 7.5ns @ CL = 2 (PC133)

– 6.0ns @ CL = 3 (x16 only)

• Self refresh

– Standard

– Low power

• Revision

• Operating temperature range

– Commercial (0˚C to +70˚C)

– Industrial (–40˚C to +85˚C)

– Automotive (–40˚C to +105˚C)

Notes:

1. Contact Micron for availability.

2. Off-center parting line.

3. Only available on Revision G.

Options

Marking

-75

-7E

-6A

None

:G/:L

None

Options

• Configurations

– 32 Meg x 4 (8 Meg x 4 x 4 banks)

– 16 Meg x 8 (4 Meg x 8 x 4 banks)

– 8 Meg x 16 (2 Meg x 16 x 4 banks)

• Write recovery (

WR)

–

WR = 2 CLK

Table 1: Key Timing Parameters

CL = CAS (READ) latency

Speed Grade

-6A

-75

-7E

Clock

Frequency (MHz)

167

133

Marking

32M4

16M8

8M16

Target

RCD-

RP-CL

3-3-3

2-2-2

RCD

(ns)

CL (ns)

PDF: 09005aef8091e66d

128mb_x4x8x16_sdram.pdf - Rev. V 09/14 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

128Mb: x4, x8, x16 SDRAM

Features

Contents

General Description ......................................................................................................................................... 7

Automotive Temperature .............................................................................................................................. 7

Functional Block Diagrams ............................................................................................................................... 8

Pin and Ball Assignments and Descriptions ..................................................................................................... 11

Package Dimensions ....................................................................................................................................... 15

Temperature and Thermal Impedance ............................................................................................................ 18

Electrical Specifications .................................................................................................................................. 22

Electrical Specifications – I

Parameters ........................................................................................................ 24

Electrical Specifications – AC Operating Conditions ......................................................................................... 26

Functional Description ................................................................................................................................... 29

Commands .................................................................................................................................................... 30

COMMAND INHIBIT .................................................................................................................................. 30

NO OPERATION (NOP) ............................................................................................................................... 31

LOAD MODE REGISTER (LMR) ................................................................................................................... 31

ACTIVE ...................................................................................................................................................... 31

READ ......................................................................................................................................................... 32

WRITE ....................................................................................................................................................... 33

PRECHARGE .............................................................................................................................................. 34

BURST TERMINATE ................................................................................................................................... 34

REFRESH ................................................................................................................................................... 35

AUTO REFRESH ..................................................................................................................................... 35

SELF REFRESH ....................................................................................................................................... 35

Truth Tables ................................................................................................................................................... 36

Initialization .................................................................................................................................................. 41

Mode Register ................................................................................................................................................ 43

Burst Length .............................................................................................................................................. 45

Burst Type .................................................................................................................................................. 45

CAS Latency ............................................................................................................................................... 47

Operating Mode ......................................................................................................................................... 47

Write Burst Mode ....................................................................................................................................... 47

Bank/Row Activation ...................................................................................................................................... 48

READ Operation ............................................................................................................................................. 49

WRITE Operation ........................................................................................................................................... 58

Burst Read/Single Write .............................................................................................................................. 65

PRECHARGE Operation .................................................................................................................................. 66

Auto Precharge ........................................................................................................................................... 66

AUTO REFRESH Operation ............................................................................................................................. 78

SELF REFRESH Operation ............................................................................................................................... 80

Power-Down .................................................................................................................................................. 82

Clock Suspend ............................................................................................................................................... 83

PDF: 09005aef8091e66d

128mb_x4x8x16_sdram.pdf - Rev. V 09/14 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

128Mb: x4, x8, x16 SDRAM

Features

List of Figures

Figure 1: 32 Meg x 4 Functional Block Diagram ................................................................................................. 8

Figure 2: 16 Meg x 8 Functional Block Diagram ................................................................................................. 9

Figure 3: 8 Meg x 16 Functional Block Diagram ............................................................................................... 10

Figure 4: 54-Pin TSOP (Top View) .................................................................................................................. 11

Figure 5: 60-Ball FBGA (TopView) .................................................................................................................. 12

Figure 6: 54-Ball VFBGA (Top View) ............................................................................................................... 13

Figure 7: 54-Pin Plastic TSOP (400 mil) ........................................................................................................... 15

Figure 8: 60-Ball TFBGA (x8 Device), 8mm x 16mm – Package Code FB/BB ...................................................... 16

Figure 9: 54-Ball VFBGA (x16 Device), 8mm x 8mm – Package Code F4/B4 ....................................................... 17

Figure 10: Example: Temperature Test Point Location, 54-Pin TSOP (Top View) ............................................... 20

Figure 11: Example: Temperature Test Point Location, 54-Ball VFBGA (Top View) ............................................ 21

Figure 12: Example: Temperature Test Point Location, 60-Ball FBGA (Top View) .............................................. 21

Figure 13: ACTIVE Command ........................................................................................................................ 31

Figure 14: READ Command ........................................................................................................................... 32

Figure 15: WRITE Command ......................................................................................................................... 33

Figure 16: PRECHARGE Command ................................................................................................................ 34

Figure 17: Initialize and Load Mode Register .................................................................................................. 42

Figure 18: Mode Register Definition ............................................................................................................... 44

Figure 19: CAS Latency .................................................................................................................................. 47

Figure 20: Example: Meeting

RCD (MIN) When 2 <

RCD (MIN)/

CK < 3 .......................................................... 48

Figure 21: Consecutive READ Bursts .............................................................................................................. 50

Figure 22: Random READ Accesses ................................................................................................................ 51

Figure 23: READ-to-WRITE ............................................................................................................................ 52

Figure 24: READ-to-WRITE With Extra Clock Cycle ......................................................................................... 53

Figure 25: READ-to-PRECHARGE .................................................................................................................. 53

Figure 26: Terminating a READ Burst ............................................................................................................. 54

Figure 27: Alternating Bank Read Accesses ..................................................................................................... 55

Figure 28: READ Continuous Page Burst ......................................................................................................... 56

Figure 29: READ – DQM Operation ................................................................................................................ 57

Figure 30: WRITE Burst ................................................................................................................................. 58

Figure 31: WRITE-to-WRITE .......................................................................................................................... 59

Figure 32: Random WRITE Cycles .................................................................................................................. 60

Figure 33: WRITE-to-READ ............................................................................................................................ 60

Figure 34: WRITE-to-PRECHARGE ................................................................................................................. 61

Figure 35: Terminating a WRITE Burst ............................................................................................................ 62

Figure 36: Alternating Bank Write Accesses ..................................................................................................... 63

Figure 37: WRITE – Continuous Page Burst ..................................................................................................... 64

Figure 38: WRITE – DQM Operation ............................................................................................................... 65

Figure 39: READ With Auto Precharge Interrupted by a READ ......................................................................... 67

Figure 40: READ With Auto Precharge Interrupted by a WRITE ........................................................................ 68

Figure 41: READ With Auto Precharge ............................................................................................................ 69

Figure 42: READ Without Auto Precharge ....................................................................................................... 70

Figure 43: Single READ With Auto Precharge .................................................................................................. 71

Figure 44: Single READ Without Auto Precharge ............................................................................................. 72

Figure 45: WRITE With Auto Precharge Interrupted by a READ ........................................................................ 73

Figure 46: WRITE With Auto Precharge Interrupted by a WRITE ...................................................................... 73

Figure 47: WRITE With Auto Precharge ........................................................................................................... 74

Figure 48: WRITE Without Auto Precharge ..................................................................................................... 75

Figure 49: Single WRITE With Auto Precharge ................................................................................................. 76

Figure 50: Single WRITE Without Auto Precharge ............................................................................................ 77

PDF: 09005aef8091e66d

128mb_x4x8x16_sdram.pdf - Rev. V 09/14 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Recommended Resources

Reactance shunt excitation circuit

Oscilloscope test switching power supply example

Negative reference voltage circuit diagram 2

The most practical basic diagram circuit 09 - three-phase power indication and protection circuit

Common emitter inductive feedback oscillation circuit

Has anyone tried to power the TP4056 using the USB of a PC?: The charging current of TP4056 is set to 800mA, the input voltage is 5V, and the USB output of PC is +5V and 500mA. If the TP4056 module is powered through the USB port of PC, will the PC USB port be ...; HXHNTTXLLAabc Power technology

【Uncle T's Library】14 albums on copper plating: [font=微软雅黑][size=4][url=https://download.eeworld.com.cn/source/582097]Copper plating related album: AD comprehensive copper plating rules.pdf[/url] [url=https://download.eeworld.com.cn/source/582099]C...; 高进 Download Centre

Show the process of WEBENCH design + basic AC-DC switching power supply design: [i=s]This post was last edited by accboy on 2014-8-20 10:43[/i] As for the basic switching power supply, there are many chips that can make 12V switching power supply. At present, SROB and other serie...; accboy Analogue and Mixed Signal

Porting iptables to the Linux kernel: I can use iptables-1.3.6 installed on the host Red Hat Linux 9.0, but I changed the kernel path and executable file path to the ARM file system and burned it to the board (the kernel is Linux-2.6.8.1)...; wrathydra Linux and Android

【Book Collection】Phase-locked and frequency synthesis technology: [color=black]This book describes the theory, composition, performance test and design of analog and digital phase-locked loops and frequency synthesizers. It also describes in detail single-loop digit...; wzt DSP and ARM Processors

ARM textbook (Zhejiang University): This is definitely internal information, please share it...; zjutchenxiao MCU

Simple and easy automatic charging

Emergency hand-held lamps powered by 6V maintenance-free batteries are widely used in rural areas. The charger used is a transformer step-down and single diode half-wave rectifier, and the charging...[Details]
Design of vehicle intersection access system based on radio frequency identification technology

0. Introduction In daily life, we often see some special-purpose vehicles. When these vehicles pass through intersections, they often obtain the right of way at intersections by temporarily op...[Details]
Interleaving Power Stages—Not Just for Buck Converters Anymore

introduction For the voltage regulator modules (VRMs) that power the latest computer central processing units (CPUs), power supply designers have historically used multiphase interleaved b...[Details]
Application example of CIF50-PB bus card and force control configuration software

1. Introduction to CIF Board Fieldbus integration based on PC system Whether it is a master or a slave, fieldbus has won unanimous praise in the field of PC-based automation. For more...[Details]
Supercapacitor integration optimizes hybrid bus powertrain

Problems such as the depletion of natural resources, air pollution, traffic congestion, and rising fossil fuel prices have forced societies and individuals to seek alternative means of transportati...[Details]
Solutions to Motor Electromagnetic Compatibility (EMC)

Motors, especially those with brushes, generate a lot of noise. This noise must be dealt with if the appliance is to meet the requirements of EMC standards. The means to solve EMC are nothing more ...[Details]
The present and future of automotive LEDs

1 Introduction to LED With the development of science and technology, people have higher and higher requirements on automobile light sources. LED (Light Emitting Diode) has gradually attracted...[Details]
Bottlenecks and difficulties faced in the innovation and industrialization of LED products in my country

LED is the abbreviation of the English word. Its main meanings are: LED = Light Emitting Diode, a solid-state semiconductor device that can convert electrical energy into visible light. It can dire...[Details]
Advantages of new green LED lamps

LED is now known as the fourth generation of light sources. High-power LED has many advantages over traditional light sources in outdoor lighting. 1 LED lamps have high light efficiency C...[Details]
Application of portable power supply

Portable power applications are broad and varied. Products range from wireless sensor nodes with average power consumption of only a few microwatts to in-vehicle medical or data acquisition systems...[Details]
Ways to improve current load transient response

This article focuses on closing the feedback loop of an isolated power supply using a TL431 shunt regulator. The article discusses a method to extend the bandwidth of the power supply control loop ...[Details]
Stepper motor control driver for PLC

Traditionally, when using PLC to control stepper motors, a dedicated stepper motor control intelligent module is usually added to the PLC, and then connected to the drive power supply to realize th...[Details]
Electronic ballast for car headlights

In the 1980s, breakthroughs were made in the design and production of small, low-power quartz metal halide lamps with precise dimensions. At the same time, with the acceleration of people's lives a...[Details]
Application of Pilz safety control module in automobile manufacturing

As we all know, the manufacturing of modern automobiles is divided into four major processes: stamping, welding, painting and assembly, and the powertrain constitutes five inseparable production pr...[Details]
Research on LED chip packaging defect detection method

LED (Light-emitting diode) is widely used in indication, display and other fields due to its advantages such as long life and low energy consumption. Reliability, stability and high light output ar...[Details]

Shortcut: L0 L1 L2 L3 L4 L5 L6 L7 L8 L9 LA LB LC LD LE LF LG LH LI LJ LK LL LM LN LO LP LQ LR LS LT LU LV LW LX LY LZ M0 M1 M2 M3 M4 M5 M6 M7 M8 M9 MA MB MC MD ME MF MG MH MI MJ MK ML MM MN MO MP MQ MR MS MT MU MV MW MX MY MZ N0 N1 N2 N3 N4 N5 N6 N7 N8 NA NB NC ND NE NF NG NH NI NJ NK NL NM NN NO NP NQ NR NS NT NU NV NX NZ O0 O1 O2 O3 OA OB OC OD OE OF OG OH OI OJ OK OL OM ON OP OQ OR OS OT OV OX OY OZ P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 PA PB PC PD PE PF PG PH PI PJ PK PL PM PN PO PP PQ PR PS PT PU PV PW PX PY PZ Q1 Q2 Q3 Q4 Q5 Q6 Q8 Q9 QA QB QC QE QF QG QH QK QL QM QP QR QS QT QV QW QX QY R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 RA RB RC RD RE RF RG RH RI RJ RK RL RM RN RO RP RQ RR RS RT RU RV RW RX RY RZ

Popular Components