MT48H4M32LFB5-75 IT:K datasheet, PDF

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MT48H4M32LFB5-75 IT:K: DescriptionSDRAM - 移动 LPSDR 存储器 IC 128Mb（4M x 32）并联 133 MHz 5.4 ns 90-VFBGA（8x13）; Categorysemiconductor memory; File Size2MB，86 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/; Environmental Compliance

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MT48H4M32LFB5-75 IT:K Overview

SDRAM - 移动 LPSDR 存储器 IC 128Mb（4M x 32）并联 133 MHz 5.4 ns 90-VFBGA（8x13）

MT48H4M32LFB5-75 IT:K Parametric

Parameter Name	Attribute value
category
Maker	Micron Technology
series	-
Package	tray
memory type	Volatile
memory format	DRAM
technology	SDRAM - Mobile LPSDR
storage	128Mb（4M x 32）
memory interface	in parallel
Write cycle time - words, pages	15ns
Voltage - Power supply	1.7V ~ 1.95V
Operating temperature	-40°C ~ 85°C（TA）
Installation type	surface mount type
Package/casing	90-VFBGA
Supplier device packaging	90-VFBGA（8x13）
Clock frequency	133 MHz
interview time	5.4 ns
Basic product number	MT48H4M32

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128Mb: 8 Meg x 16, 4 Meg x 32 Mobile SDRAM

Features

Mobile Low-Power SDR SDRAM

MT48H8M16LF – 2 Meg x 16 x 4 banks

MT48H4M32LF – 1 Meg x 32 x 4 banks

Features

• V

DDQ

= 1.7–1.95V

• Fully synchronous; all signals registered on positive

edge of system clock

• Internal, pipelined operation; column address can

be changed every clock cycle

• 4 internal banks for concurrent operation

• Programmable burst lengths (BL): 1, 2, 4, 8, and con-

tinuous

• Auto precharge, includes concurrent auto precharge

• Auto refresh and self refresh modes

• LVTTL-compatible inputs and outputs

• On-chip temperature sensor to control self refresh

rate

• Partial-array self refresh (PASR)

• Deep power-down (DPD)

• Selectable output drive strength (DS)

• 64ms refresh period

Options

• V

DDQ

: 1.8V/1.8V

• Addressing

– Standard addressing option

• Configuration

– 8 Meg x 16 (2 Meg x 16 x 4 banks)

– 4 Meg x 32 (1 Meg x 32 x 4 banks)

• Plastic “green” packages

– 54-ball VFBGA (8mm x 8mm)

– 90-ball VFBGA (8mm x 13mm)

• Timing: cycle time

– 6ns at CL = 3

– 7.5ns at CL = 3

• Operating temperature range

– Commercial (0˚C to +70˚C)

– Industrial (–40˚C to +85˚C)

• Revision

Notes:

Marking

8M16

4M32

-6

-75

None

1. Available only for x16 configuration.

2. Available only for x32 configuration.

Table 1: Configuration Addressing

Architecture

Number of banks

Bank address balls

Row address balls

Column address balls

8 Meg x 16

BA0, BA1

A[11:0]

A[8:0]

4 Meg x 32

BA0, BA1

A[11:0]

A[7:0]

Table 2: Key Timing Parameters

Speed

Grade

-6

-75

Note:

Clock Rate (MHz)

CL = 2

104

CL = 3

166

133

Access Time

CL = 2

8ns

CL = 3

5ns

5.4ns

1. CL = CAS (READ) latency

PDF: 09005aef832ff1ea

128mb_mobile_sdram_y35M.pdf - Rev. G 10/09 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

128Mb: 8 Meg x 16, 4 Meg x 32 Mobile SDRAM

Features

Contents

General Description ......................................................................................................................................... 8

Functional Block Diagram ................................................................................................................................ 9

Ball Assignments and Descriptions ................................................................................................................. 10

Package Dimensions ....................................................................................................................................... 13

Electrical Specifications .................................................................................................................................. 15

Absolute Maximum Ratings ........................................................................................................................ 15

Electrical Specifications – I

Parameters ........................................................................................................ 17

Electrical Specifications – AC Operating Conditions ......................................................................................... 20

Output Drive Characteristics ........................................................................................................................... 23

Functional Description ................................................................................................................................... 26

Commands .................................................................................................................................................... 27

COMMAND INHIBIT .................................................................................................................................. 28

NO OPERATION (NOP) ............................................................................................................................... 28

LOAD MODE REGISTER (LMR) ................................................................................................................... 28

ACTIVE ...................................................................................................................................................... 28

READ ......................................................................................................................................................... 29

WRITE ....................................................................................................................................................... 30

PRECHARGE .............................................................................................................................................. 31

BURST TERMINATE ................................................................................................................................... 31

AUTO REFRESH ......................................................................................................................................... 31

SELF REFRESH ........................................................................................................................................... 32

DEEP POWER-DOWN ................................................................................................................................. 32

Truth Tables ................................................................................................................................................... 33

Initialization .................................................................................................................................................. 38

Mode Register ................................................................................................................................................ 40

Burst Length .............................................................................................................................................. 41

Burst Type .................................................................................................................................................. 41

CAS Latency ............................................................................................................................................... 43

Operating Mode ......................................................................................................................................... 43

Write Burst Mode ....................................................................................................................................... 43

Extended Mode Register ................................................................................................................................. 44

Temperature-Compensated Self Refresh ...................................................................................................... 44

Partial-Array Self Refresh ............................................................................................................................ 45

Output Drive Strength ................................................................................................................................ 45

Bank/Row Activation ...................................................................................................................................... 46

READ Operation ............................................................................................................................................. 47

WRITE Operation ........................................................................................................................................... 56

Burst Read/Single Write .............................................................................................................................. 63

PRECHARGE Operation .................................................................................................................................. 64

Auto Precharge ........................................................................................................................................... 64

AUTO REFRESH Operation ............................................................................................................................. 76

SELF REFRESH Operation ............................................................................................................................... 78

Power-Down .................................................................................................................................................. 80

Deep Power-Down ......................................................................................................................................... 81

Clock Suspend ............................................................................................................................................... 82

Revision History ............................................................................................................................................. 85

Rev. G, Production – 10/09 .......................................................................................................................... 85

Rev. F, Production – 8/09 ............................................................................................................................. 85

Rev. E, Production – 4/09 ............................................................................................................................ 85

Rev. D, Production – 10/08 .......................................................................................................................... 85

PDF: 09005aef832ff1ea

128mb_mobile_sdram_y35M.pdf - Rev. G 10/09 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

128Mb: 8 Meg x 16, 4 Meg x 32 Mobile SDRAM

Features

List of Tables

Table 1: Configuration Addressing ................................................................................................................... 1

Table 2: Key Timing Parameters ....................................................................................................................... 1

Table 3: VFBGA Ball Descriptions ................................................................................................................... 12

Table 4: Absolute Maximum Ratings .............................................................................................................. 15

Table 5: DC Electrical Characteristics and Operating Conditions ..................................................................... 15

Table 6: Capacitance ..................................................................................................................................... 16

Table 7: I

Specifications and Conditions (x16) ............................................................................................. 17

Table 8: I

Specifications and Conditions (x32) ............................................................................................. 17

Table 9: I

DD7

Specifications and Conditions (x16 and x32) ............................................................................... 18

Table 10: Electrical Characteristics and Recommended AC Operating Conditions ............................................ 20

Table 11: AC Functional Characteristics ......................................................................................................... 21

Table 12: Target Output Drive Characteristics (Full Strength) ........................................................................... 23

Table 13: Target Output Drive Characteristics (Three-Quarter Strength) .......................................................... 24

Table 14: Target Output Drive Characteristics (One-Half Strength) .................................................................. 25

Table 15: Truth Table – Commands and DQM Operation ................................................................................. 27

Table 16: Truth Table – Current State Bank

Command to Bank

.................................................................. 33

Table 17: Truth Table – Current State Bank n, Command to Bank

................................................................. 35

Table 18: Truth Table – CKE ........................................................................................................................... 37

Table 19: Burst Definition Table ..................................................................................................................... 42

PDF: 09005aef832ff1ea

128mb_mobile_sdram_y35M.pdf - Rev. G 10/09 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

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