Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
h
FE
CLASSIFICATION
Classification
h
FE2
A
110 ~ 220
B
200 ~ 450
C
420 ~ 800
ORDERING INFORMATION
Part Number
BC556ABU
BC556ATA
BC556BTA
BC556BTF
BC556BTFR
BC557ATA
BC557BTA
BC557BTF
BC558BTA
BC559BTA
BC559CTA
BC560CTA
Marking
BC556A
BC556A
BC556B
BC556B
BC556B
BC557A
BC557B
BC557B
BC558B
BC559B
BC559C
BC560C
Package
TO−92−3, case 135AN (Pb−Free)
TO−92−3, case 135AR (Pb−Free)
TO−92−3, case 135AR (Pb−Free)
TO−92−3, case 135AR (Pb−Free)
TO−92−3, case 135AR (Pb−Free)
TO−92−3, case 135AR (Pb−Free)
TO−92−3, case 135AR (Pb−Free)
TO−92−3, case 135AR (Pb−Free)
TO−92−3, case 135AR (Pb−Free)
TO−92−3, case 135AR (Pb−Free)
TO−92−3, case 135AR (Pb−Free)
TO−92−3, case 135AR (Pb−Free)
Shipping
†
10,000 Units/ Bulk Box
2,000 Units/ Fan−Fold
2,000 Units/ Fan−Fold
2,000 Units/ Tape & Reel
2,000 Units/ Tape & Reel
2,000 Units/ Fan−Fold
2,000 Units/ Fan−Fold
2,000 Units/ Tape & Reel
2,000 Units/ Fan−Fold
2,000 Units/ Fan−Fold
2,000 Units/ Fan−Fold
2,000 Units/ Fan−Fold
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
www.onsemi.com
2
BC556, BC557, BC558, BC559, BC560
TYPICAL PERFORMANCE CHARACTERISTICS
−50
1000
I
B
= −400
m
A
I
B
= −300
m
A
I
B
= −250
m
A
I
B
= −200
m
A
I
B
= −150
m
A
I
B
= −100
m
A
I
B
= −50
m
A
I
B
= −350
m
A
T
A
= 150 C
o
I
C
, COLLECTOR CURRENT [mA]
−45
−40
−35
−30
−25
−20
−15
−10
−5
−0
−2
−4
−6
−8
V
CE
= −5 V
h
FE
, DC CURRENT GAIN
T
A
= 25 C
T
A
= −55 C
o
o
100
−10 −12 −14 −16 −18 −20
10
−1
−10
−100
−1000
V
CE
, COLLECTOR−EMITTER VOLTAGE [V]
I
C
, COLLECTOR CURRENT [mA]
Figure 1. Static Characteristic
Figure 2. DC Current Gain
V
CE(sat)
, COLLECTOR−EMITTER SATURATION
VOLTAGE [V]
−10
I
C
= 20 I
B
−1000
I
C
, COLLECTOR CURRENT [mA]
I
C
= 20 I
B
−1
−100
T
A
= 150 C
o
T
A
= 25 C
o
−0.1
T
A
= −55 C
o
−10
T
A
= 150 C
o
T
A
= 25 C
o
T
A
= −55 C
o
−0.01
−1
−10
−100
−1000
−1
−0.0
−0.2
−0.4
−0.6
−0.8
−1.0
−1.2
I
C
, COLLECTOR CURRENT [mA]
V
BE(sat)
, BASE−EMITTER SATURATION VOLTAGE [V]
Figure 3. Collector−Emitter Saturation Voltage
Figure 4. Base−Emitter Saturation Voltage
−1000
I
C
, COLLECTOR CURRENT [mA]
V
CE
= −5 V
C
ob
, CAPACITANCE [pF]
10
f=1MHz
I
E
= 0
−100
−10
T
A
= 150 C
o
T
A
= 25 C
o
T
A
= −55 C
o
0
−0.2
−0.4
−0.6
−0.8
−1.0
−1.2
1
−1
−10
−100
V
BE(on)
, BASE−EMITTER ON VOLTAGE [V]
V
CB
, COLLECTOR−BASE VOLTAGE [V]
Figure 5. Base−Emitter On Voltage
Figure 6. Collector Output Capacitance
www.onsemi.com
3
BC556, BC557, BC558, BC559, BC560
TYPICAL PERFORMANCE CHARACTERISTICS
(continued)
1000
1000
f
T
, CURRENT GAIN BANDWIDTH
PRODUCT [MHz]
P
D
, POWER DISSIPATION [mW]
−10
V
CE
= −5 V
100
100
10
10
−1
1
0
50
100
150
I
C
, COLLECTOR CURRENT [mA]
T
A
, AMBIENT TEMPERATURE [°C]
Figure 7. Current Gain Bandwidth Product
1000
Figure 8. Power Deration
r(t), NORMALIZED TRANSIENT THERMAL
RESISTANCE
100
50%
30%
10%
10
5%
2%
Rthja(t)=r(t)*Rthja
o
Rthja=250
C/W
1
D=1%
0.1
Single Pulse
0.01
1E−5 1E−4 1E−3
0.01
0.1
1
10
100
1000
t1, TIME [s]
Figure 9. Normalized Transient Thermal
Resistance
www.onsemi.com
4
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TO−92 3 4.825x4.76
CASE 135AN
ISSUE O
DATE 31 JUL 2016
DOCUMENT NUMBER:
DESCRIPTION:
98AON13880G
TO−92 3 4.825X4.76
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
[b][font=微软雅黑][size=4][color=#000000] [/color][/size][/font][/b][b][url=http://www.deyisupport.com/question_answer/w/faq/556.4048v.aspx]【Automobile Classroom】40 Common Knowledge about 48V System, Coll...
Our company now has a complete product line of modules (including DVB-H, ISDB-T, CMMB) and has already shipped in batches. Our modules are mainly sold in the car and handheld markets. We have been coo...
SPI is a high-speed, full-duplex, synchronous communication bus, and only occupies four wires on the chip pins, saving chip pins and saving space for PCB layout, providing convenience. It is precisely...
[i=s]This post was last edited by paulhyde on 2014-9-15 09:15[/i] 1. Welcome to post relevant content about the provincial or national college student electronic design competition, including topics, ...
For electronics enthusiasts, engineers, and technicians, the wide variety of oscilloscopes on the market may make people dazzled. Oscilloscopes have a variety of parameters and functions, coupled with...
For example, the functions of parts in analog circuits and digital circuits. I don't even know what a transistor is used for! Oh~ Are there any good and simple books on these subjects? Please recommen...
With the booming electronics industry, vision systems have become a leader in the electronics automation sector. However, the delicate nature of electronic products often affects product yields due...[Details]
Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
What is "Car Electronic Fence"
Fleet managers can define a graphical area (regular or irregular) or divide it into administrative zones in Yamei Technology's vehicle backend management system ...[Details]
On August 24th, media outlets reported, citing sources, that NavInfo, a listed company on the A-share market, is nearing completion in its acquisition of the intelligent driving c...[Details]
White light LEDs are voltage-sensitive devices. In actual operation, their upper limit is 20mA. However, the current often increases due to various reasons during use. If no protective measures are...[Details]
According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
Zos Automotive Research Institute released the "2025
Smart Cockpit
Tier 1 Research Report (Domestic Edition)."
This report analyzes the operating conditions of more than a dozen ...[Details]
Robotics
has become
LiDAR
's "second growth curve."
While LiDAR was still battling with its "pure vision" rivals in the automotive field, another field ignited the demand f...[Details]
The Automotive Testing and Quality Assurance Expo (ATE 2025) will open on August 27th. At the expo, Rohde & Schwarz (R&S) will showcase six automotive testing solutions, themed "Intelligently Drivi...[Details]
Recently, Tesla released the "Tesla Car Voice Assistant Terms of Use", announcing that the car voice assistant will be connected to the Doubao large model (Skylark large model) and DeepSeek Chat pr...[Details]
The all-new MG4 was recently officially announced on the Ministry of Industry and Information Technology's (MIIT) new vehicle announcement. The all-new MG4's semi-solid-state battery version addres...[Details]
introduction
The concept of the smart home is gradually developing and gaining market acceptance. We believe its ultimate form lies in the interconnection of all home appliances through open i...[Details]
Spark plugs are an indispensable device for engines. As the saying goes, without spark plugs, the engine cannot work properly. The serious consequence is that when driving at high speeds, the engin...[Details]
Keysight Technologies is combining its electromagnetic simulator with Synopsys' AI-driven RF design migration flow to create an integrated design flow for migrating from TSMC's N6RF+ process techno...[Details]
Plessey Semiconductors has been acquired by Haylo Labs, which was established in March last year with a $100 million, five-year loan from Chinese technology company Goertek.
Haylo Labs w...[Details]