Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
h
FE
CLASSIFICATION
Classification
h
FE2
A
110 ~ 220
B
200 ~ 450
C
420 ~ 800
ORDERING INFORMATION
Part Number
BC556ABU
BC556ATA
BC556BTA
BC556BTF
BC556BTFR
BC557ATA
BC557BTA
BC557BTF
BC558BTA
BC559BTA
BC559CTA
BC560CTA
Marking
BC556A
BC556A
BC556B
BC556B
BC556B
BC557A
BC557B
BC557B
BC558B
BC559B
BC559C
BC560C
Package
TO−92−3, case 135AN (Pb−Free)
TO−92−3, case 135AR (Pb−Free)
TO−92−3, case 135AR (Pb−Free)
TO−92−3, case 135AR (Pb−Free)
TO−92−3, case 135AR (Pb−Free)
TO−92−3, case 135AR (Pb−Free)
TO−92−3, case 135AR (Pb−Free)
TO−92−3, case 135AR (Pb−Free)
TO−92−3, case 135AR (Pb−Free)
TO−92−3, case 135AR (Pb−Free)
TO−92−3, case 135AR (Pb−Free)
TO−92−3, case 135AR (Pb−Free)
Shipping
†
10,000 Units/ Bulk Box
2,000 Units/ Fan−Fold
2,000 Units/ Fan−Fold
2,000 Units/ Tape & Reel
2,000 Units/ Tape & Reel
2,000 Units/ Fan−Fold
2,000 Units/ Fan−Fold
2,000 Units/ Tape & Reel
2,000 Units/ Fan−Fold
2,000 Units/ Fan−Fold
2,000 Units/ Fan−Fold
2,000 Units/ Fan−Fold
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
www.onsemi.com
2
BC556, BC557, BC558, BC559, BC560
TYPICAL PERFORMANCE CHARACTERISTICS
−50
1000
I
B
= −400
m
A
I
B
= −300
m
A
I
B
= −250
m
A
I
B
= −200
m
A
I
B
= −150
m
A
I
B
= −100
m
A
I
B
= −50
m
A
I
B
= −350
m
A
T
A
= 150 C
o
I
C
, COLLECTOR CURRENT [mA]
−45
−40
−35
−30
−25
−20
−15
−10
−5
−0
−2
−4
−6
−8
V
CE
= −5 V
h
FE
, DC CURRENT GAIN
T
A
= 25 C
T
A
= −55 C
o
o
100
−10 −12 −14 −16 −18 −20
10
−1
−10
−100
−1000
V
CE
, COLLECTOR−EMITTER VOLTAGE [V]
I
C
, COLLECTOR CURRENT [mA]
Figure 1. Static Characteristic
Figure 2. DC Current Gain
V
CE(sat)
, COLLECTOR−EMITTER SATURATION
VOLTAGE [V]
−10
I
C
= 20 I
B
−1000
I
C
, COLLECTOR CURRENT [mA]
I
C
= 20 I
B
−1
−100
T
A
= 150 C
o
T
A
= 25 C
o
−0.1
T
A
= −55 C
o
−10
T
A
= 150 C
o
T
A
= 25 C
o
T
A
= −55 C
o
−0.01
−1
−10
−100
−1000
−1
−0.0
−0.2
−0.4
−0.6
−0.8
−1.0
−1.2
I
C
, COLLECTOR CURRENT [mA]
V
BE(sat)
, BASE−EMITTER SATURATION VOLTAGE [V]
Figure 3. Collector−Emitter Saturation Voltage
Figure 4. Base−Emitter Saturation Voltage
−1000
I
C
, COLLECTOR CURRENT [mA]
V
CE
= −5 V
C
ob
, CAPACITANCE [pF]
10
f=1MHz
I
E
= 0
−100
−10
T
A
= 150 C
o
T
A
= 25 C
o
T
A
= −55 C
o
0
−0.2
−0.4
−0.6
−0.8
−1.0
−1.2
1
−1
−10
−100
V
BE(on)
, BASE−EMITTER ON VOLTAGE [V]
V
CB
, COLLECTOR−BASE VOLTAGE [V]
Figure 5. Base−Emitter On Voltage
Figure 6. Collector Output Capacitance
www.onsemi.com
3
BC556, BC557, BC558, BC559, BC560
TYPICAL PERFORMANCE CHARACTERISTICS
(continued)
1000
1000
f
T
, CURRENT GAIN BANDWIDTH
PRODUCT [MHz]
P
D
, POWER DISSIPATION [mW]
−10
V
CE
= −5 V
100
100
10
10
−1
1
0
50
100
150
I
C
, COLLECTOR CURRENT [mA]
T
A
, AMBIENT TEMPERATURE [°C]
Figure 7. Current Gain Bandwidth Product
1000
Figure 8. Power Deration
r(t), NORMALIZED TRANSIENT THERMAL
RESISTANCE
100
50%
30%
10%
10
5%
2%
Rthja(t)=r(t)*Rthja
o
Rthja=250
C/W
1
D=1%
0.1
Single Pulse
0.01
1E−5 1E−4 1E−3
0.01
0.1
1
10
100
1000
t1, TIME [s]
Figure 9. Normalized Transient Thermal
Resistance
www.onsemi.com
4
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TO−92 3 4.825x4.76
CASE 135AN
ISSUE O
DATE 31 JUL 2016
DOCUMENT NUMBER:
DESCRIPTION:
98AON13880G
TO−92 3 4.825X4.76
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
In battery pack design, battery safety, battery life, battery life, fast charging, etc. are important design considerations. Currently, the battery pack design solutions provided by TI can be applied ...
[i=s] This post was last edited by paulhyde on 2014-9-15 03:47 [/i] 1. Components for this group Single-chip microcomputer minimum system board (only single-chip microcomputer chip, keyboard and displ...
This is a part of the 2009 National Electronic Design Competition, D: Wireless Environment Monitoring Simulation Device, mainly about temperature and light. Lighting is very simple and can be handled ...
[i=s] This post was last edited by paulhyde on 2014-9-15 09:48 [/i] :( :( :( I'm begging for the course design assignment for the microcontroller "0~99 adder counter". I'd be grateful if any expert co...
[url=https://bbs.eeworld.com.cn/thread-487874-1-1.html][MicroPython] Data collection for development version[/url] [url=https://bbs.eeworld.com.cn/thread-488231-1-1.html][MicroPython] Host computer wr...
Dual-mode inverters can operate both in conjunction with the grid and independently. These inverters can inject excess energy from renewable energy and storage devices into the grid, and withdraw p...[Details]
There are many different ways of human-computer interaction. The more common ones are listed below:
Mouse interaction: Using a mouse to operate a computer and interact was the most common human...[Details]
Reflow soldering is a critical process in electronics assembly production, and the cleanliness of the reflow oven has a direct impact on product quality. Dust and residue accumulation within the ov...[Details]
Introduction to the principles of speech recognition technology
Automatic speech recognition (ASR) technology aims to enable computers to understand human speech and extract the textual inform...[Details]
summary
There are multiple approaches to making industrial systems more intelligent, including applying artificial intelligence (AI) technology at the edge and in the cloud to sensor...[Details]
On August 25th, SK Hynix announced that it has completed development and entered mass production of its 321-layer, 2Tb QLC NAND flash memory product. This achievement marks the world's first applic...[Details]
On August 20th, Tiantai Robotics Co., Ltd., along with strategic partners including Shandong Future Robotics Technology Co., Ltd., Shandong Future Data Technology Co., Ltd., and Gangzai Robotics Gr...[Details]
As the scale and business applications of national e-government networks continue to expand, the data and services transmitted over them are becoming increasingly sensitive and critical. To protect...[Details]
Normally, we determine our location and where we want to go by comparing our surroundings with observation and simple GPS tools. However, this kind of reasoning is very difficult for self-driving c...[Details]
A multilevel inverter converts a DC signal into a multilevel staircase waveform. Instead of a straight positive-negative output waveform, the output waveform of a multilevel inverter alternates in ...[Details]
We often hear about the precautions for using pure electric vehicles in winter, and many owners even develop relevant strategies, such as adopting a "charge as you go" principle for their vehicles,...[Details]
Charging is an essential topic for electric vehicles. Batteries are a core component of new energy vehicles. So, what's the optimal charge level for electric vehicles? Based on current battery tech...[Details]
Electric vehicles are composed of three main components: electric motors, electric motors, and electric vehicles. Maintenance is much simpler than for gasoline-powered vehicles. Maintenance for ele...[Details]
Common Mode Semiconductor has officially launched the GM6503 series—a 5 V, 3 A synchronous step-down DC/DC power module designed for optical communications, servers, industrial applications, and FP...[Details]
Nidec Precision Testing Technology Co., Ltd. will participate in "Testing Expo China—Automotive 2025" to be held at the Shanghai World Expo Exhibition and Convention Center from August 27 (Wednesda...[Details]
Energy Infrastructure?
京公网安备 11010802033920号
EEWORLD
