SIM3L1XX-B-DK datasheet, PDF - EEWORLD Datasheet

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SIM3L1XX-B-DK: DescriptionSiM3L1xx - series ARM® Cortex®-M3 MCU 32-位评估板 - 嵌入式; CategoryDevelopment board/suite/development tools Development board/development kit; File Size4MB，91 Pages; ManufacturerSilicon Labs; Websitehttps://www.silabs.com

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SiM3L1xx - series ARM® Cortex®-M3 MCU 32-位评估板 - 嵌入式

SIM3L1XX-B-DK Parametric

Parameter Name	Attribute value
category
Maker	Silicon Labs
series	Precision32™
Package	box
Board type	Evaluation platform
type	MCU 32nd place
core processor	ARM® Cortex®-M3
operating system	-
platform	-
IC/parts used	SiM3L1xx
Installation type	fixed
内含物	Board, Cable, Power Supply, USB Debug Adapter Programmer
Basic product number	SIM3L1

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SiM3L1xx

High-Performance, Low-Power, 32-Bit Precision32™

MCU Family with up to 256 kB of Flash

32-bit ARM Cortex-M3 CPU

50 MHz maximum frequency

Single-cycle multiplication, hardware division support

Nested vectored interrupt control (NVIC) with 8 priority levels

Memory

32–256 kB flash, in-system programmable

8–32 kB SRAM with configurable low power retention

Clock Sources

Internal oscillator with PLL: 23–50 MHz

Low power internal oscillator: 20 MHz

Low frequency internal oscillator (LFO): 16.4 kHz

External real-time clock (RTC) crystal oscillator

External oscillator: Crystal, RC, C, CMOS clock

Power Management

Three adjustable low drop-out (LDO) regulators

Power-on reset circuit and brownout detectors

DC-DC buck converter allows dynamic voltage scaling for

maximum efficiency (250 mW output)

Multiple power modes supported for low power optimization

Analog Peripherals

12-Bit Analog-to-Digital Converter: Up to 250 ksps 12-bit mode

2 x Low-current comparators

or 1 Msps 10-bit mode

10-Bit Current-mode Digital-to-Analog Converter

Digital and Communication Peripherals

1 x USART with IrDA and ISO7816 Smartcard support

1 x UART that operates in low power mode

2 x SPIs, 1 x I2C, 16/32-bit CRC

128/192/256-bit Hardware AES Encryption

Encoder/Decoder: Manchester and Three-out-of-Six

Integrated LCD Controller: up to 160 segments (40x4), auto-

contrast and low power operation

Timers/Counters

3 x 32-bit or 6 x 16-bit timers with capture/compare

16-bit, 6-channel counter with capture/compare/PWM and

dead-time controller with differential outputs

16-bit low power timer/advanced capture counter operational in

the lowest power mode

32-bit real time clock (RTC) with multiple alarms

Low Power Features

75 nA typical current in Power Mode 8

Low-current RTC (180 nA from LFO, 300 nA from crystal)

4 µs wakeup, register state retention and no reset required from

140 µA/MHz at 3.6 V executing from SRAM

Specialized on-chip charge pump reduces power consumption

Process/Voltage/Temperature (PVT) Monitor

5 V Tolerant Flexible I/O

Up to 62 contiguous 5 V tolerant GPIO with one priority cross-

bar providing flexibility in pin assignments

lowest power mode

175 µA/MHz at 3.6 V executing from flash

Watchdog timer

Low power mode advanced capture counter (ACCTR)

Data Transfer Peripherals

10-Channel DMA Controller

3 Channel Data Transfer Manager manages complex DMA

transfers without core intervention

On-Chip Debugging

Serial wire debug (SWD) with serial wire viewer (SWV) or JTAG

(no boundary scan) allow debug and programming

Cortex-M3 embedded trace macrocell (ETM)

Temperature Range: –40 to +85 °C

Supply Voltage: 1.8 to 3.8 V

Power

Scalable Digital LDO

Scalable Memory LDO

Scalable Analog LDO

DC-DC Buck Converter

Low Power Mode Charge Pump

Power Management Unit

32/64/128/256 kB Flash

Package Options

QFN options: 40-pin (6 x 6 mm), 64-pin (9 x 9 mm)

TQFP options: 64-pin (10 x 10 mm), 80-pin (12 x 12 mm)

Core / Memory / Support

ARM Cortex M3 (50 MHz)

8/16/32 kB Retention

RAM

Analog Peripherals

SAR ADC

(12-bit 250 ksps / 10-bit 1 Msps)

Voltage Reference

Current-Source DAC

2 x Low Current Comparators

Advanced Capture Counter

Flexible Pin Muxing

10-Ch DMA Controller + 3x Data Transfer Mgr.

Watchdog

Supply Monitor

Serial Wire or JTAG Debug / Programming + ETM

Clocking / Oscillators

50 MHz PLL

Real-Time Clock w/ Dedicated Crystal Oscillator

16 kHz Low Frequency Oscillator

20 MHz Low Power Oscillator

External Clock (XTAL / RC / C / CMOS)

Clock Selection

and Gating

1 x I2C

Digital Peripherals

2 x SPI

AES

CRC

Priority Crossbar

Encoder

3 x 32-bit Timers (6 x 16-bit)

1 x UART, 1 x USART w/ IrDA/SmartCard

Encoder/Decoder

6-Channel PWM

Low-Power Timer

LCD Controller

Rev 1.1 11/14

62 Multi-Function 5V-Tolerant I/O Pins

SiM3L1xx

SiM3L1xx

Ta b l e o f C o n t e n ts

1. Related Documents and Conventions ...............................................................................5

1.1. Related Documents........................................................................................................5

1.1.1. SiM3L1xx Reference Manual.................................................................................5

1.1.2. Hardware Access Layer (HAL) API Description ....................................................5

1.1.3. ARM Cortex-M3 Reference Manual.......................................................................5

1.2. Conventions ...................................................................................................................5

2. Typical Connection Diagrams ............................................................................................6

2.1. Power .............................................................................................................................6

3. Electrical Specifications......................................................................................................8

3.1. Electrical Characteristics ................................................................................................8

3.2. Thermal Conditions ...................................................................................................... 30

3.3. Absolute Maximum Ratings..........................................................................................31

4. Precision32™ SiM3L1xx System Overview.....................................................................32

4.1. Power ........................................................................................................................... 34

4.1.1. DC-DC Buck Converter (DCDC0)........................................................................ 34

4.1.2. Three Low Dropout LDO Regulators (LDO0) ...................................................... 35

4.1.3. Voltage Supply Monitor (VMON0) ....................................................................... 35

4.1.4. Power Management Unit (PMU).......................................................................... 35

4.1.5. Device Power Modes........................................................................................... 35

4.1.6. Process/Voltage/Temperature Monitor (TIMER2 and PVTOSC0)....................... 38

4.2. I/O................................................................................................................................. 39

4.2.1. General Features.................................................................................................39

4.2.2. Crossbar .............................................................................................................. 39

4.3. Clocking........................................................................................................................ 40

4.3.1. PLL (PLL0)........................................................................................................... 41

4.3.2. Low Power Oscillator (LPOSC0) ......................................................................... 41

4.3.3. Low Frequency Oscillator (LFOSC0)................................................................... 41

4.3.4. External Oscillators (EXTOSC0).......................................................................... 41

4.4. Integrated LCD Controller (LCD0)................................................................................ 42

4.5. Data Peripherals...........................................................................................................43

4.5.1. 10-Channel DMA Controller................................................................................. 43

4.5.2. Data Transfer Managers (DTM0, DTM1, DTM2) ................................................. 43

4.5.3. 128/192/256-bit Hardware AES Encryption (AES0) ............................................ 43

4.5.4. 16/32-bit Enhanced CRC (ECRC0) .....................................................................44

4.5.5. Encoder / Decoder (ENCDEC0) .......................................................................... 44

4.6. Counters/Timers........................................................................................................... 45

4.6.1. 32-bit Timer (TIMER0, TIMER1, TIMER2)........................................................... 45

4.6.2. Enhanced Programmable Counter Array (EPCA0) ............................................. 45

4.6.3. Real-Time Clock (RTC0) ..................................................................................... 46

4.6.4. Low Power Timer (LPTIMER0)............................................................................46

4.6.5. Watchdog Timer (WDTIMER0)............................................................................46

4.6.6. Low Power Mode Advanced Capture Counter (ACCTR0)................................... 47

4.7. Communications Peripherals ....................................................................................... 48

4.7.1. USART (USART0) ............................................................................................... 48

Rev 1.1

SiM3L1xx

4.7.2. UART (UART0).................................................................................................... 48

4.7.3. SPI (SPI0, SPI1) .................................................................................................. 49

4.7.4. I2C (I2C0) ............................................................................................................ 49

4.8. Analog .......................................................................................................................... 50

4.8.1. 12-Bit Analog-to-Digital Converter (SARADC0)................................................... 50

4.8.2. 10-Bit Digital-to-Analog Converter (IDAC0) ......................................................... 50

4.8.3. Low Current Comparators (CMP0, CMP1) .......................................................... 50

4.9. Reset Sources..............................................................................................................51

4.10.Security ........................................................................................................................ 52

4.11.On-Chip Debugging ..................................................................................................... 52

5. Ordering Information .........................................................................................................53

6. Pin Definitions.................................................................................................................... 55

6.1. SiM3L1x7 Pin Definitions ............................................................................................. 55

6.2. SiM3L1x6 Pin Definitions ............................................................................................. 62

6.3. SiM3L1x4 Pin Definitions ............................................................................................. 69

6.4. TQFP-80 Package Specifications ................................................................................ 74

6.4.1. TQFP-80 Solder Mask Design............................................................................. 77

6.4.2. TQFP-80 Stencil Design ...................................................................................... 77

6.4.3. TQFP-80 Card Assembly..................................................................................... 77

6.5. QFN-64 Package Specifications .................................................................................. 78

6.5.1. QFN-64 Solder Mask Design............................................................................... 80

6.5.2. QFN-64 Stencil Design ........................................................................................ 80

6.5.3. QFN-64 Card Assembly....................................................................................... 80

6.6. TQFP-64 Package Specifications ................................................................................ 81

6.6.1. TQFP-64 Solder Mask Design............................................................................. 84

6.6.2. TQFP-64 Stencil Design ...................................................................................... 84

6.6.3. TQFP-64 Card Assembly..................................................................................... 84

6.7. QFN-40 Package Specifications .................................................................................. 85

6.7.1. QFN-40 Solder Mask Design............................................................................... 87

6.7.2. QFN-40 Stencil Design ........................................................................................ 87

6.7.3. QFN-40 Card Assembly....................................................................................... 87

7. Revision Specific Behavior............................................................................................... 88

7.1. Revision Identification .................................................................................................. 88

Document Change List ........................................................................................................... 90

Contact Information ................................................................................................................ 91

Rev 1.1

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