SI7022-A10-IM1 datasheet, PDF - EEWORLD Datasheet

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SI7022-A10-IM1: Description湿度温度传感器 0 ~ 100% 相对湿度 PWM ±3% RH 18 s 表面贴装型; CategoryThe sensor Temperature and humidity sensor; File Size424KB，25 Pages; ManufacturerSilicon Labs; Websitehttps://www.silabs.com

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SI7022-A10-IM1 Overview

湿度温度传感器 0 ~ 100% 相对湿度 PWM ±3% RH 18 s 表面贴装型

SI7022-A10-IM1 Parametric

Parameter Name	Attribute value
category
Maker	Silicon Labs
series	-
Package	bring
sensor type	humidity, temperature
Humidity range	0 ~ 100% relative humidity
Output type	PWM
output	11b
Accuracy	±3% RH
Response time	18 s
Sensitivity	-
Voltage - Power supply	1.9V ~ 3.6V
Installation type	surface mount type
Operating temperature	-40°C ~ 125°C
Package/casing	6-WDFN Exposed Pad
Supplier device packaging	6-DFN（3x3）

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Si 7 0 2 2 - A1 0

U MI D I T Y

/ T

EMPERATURE

ENSOR WITH

P W M O

UTPUT

Features



Precision Relative Humidity Sensor



± 4% RH (max), 0–80% RH

High Accuracy Temperature Sensor



±0.4 °C (max), –10 to 85 °C

0 to 100% RH operating range

–40 to +125 °C operating range

Wide operating voltage

(1.9 to 3.6 V)

Low Power Consumption



Factory-calibrated

PWM Output

3x3 mm DFN Package

Excellent long term stability

Optional factory-installed cover



Low-profile



Protection during reflow



Excludes liquids and particulates

Applications



Si7022

Micro-environments/data centers



Automotive climate control and

defogging



Asset and goods tracking



Mobile phones and tablets



HVAC/R

Thermostats/humidistats

Respiratory therapy

White goods

Indoor weather stations

Ordering Information:

See page 18.

Pin Assignments

Top View

PWM1

GND

DNC

SELECT

VDD

PWM2

Description

The Si7022 Humidity and Temperature Sensor is a monolithic CMOS IC

integrating humidity and temperature sensor elements, an analog-to-digital

converter, signal processing, calibration data, and a PWM output. The PWM

output may be filtered to produce an analog voltage output. The patented use of

industry-standard, low-K polymeric dielectrics for sensing humidity enables the

construction of low-power, monolithic CMOS Sensor ICs with low drift and

hysteresis, and excellent long term stability.

The humidity and temperature sensors are factory-calibrated and the calibration

data is stored in the on-chip non-volatile memory. This ensures that the sensors

are fully interchangeable, with no recalibration or software changes required.

The Si7022 is available in a 3x3 mm DFN package and is reflow solderable. It can

be used as a hardware- and software-compatible drop-in upgrade for existing RH/

temperature sensors in 3x3 mm DFN-6 packages, featuring precision sensing

over a wider range and lower power consumption. The optional factory-installed

cover offers a low profile, convenient means of protecting the sensor during

assembly (e.g., reflow soldering) and throughout the life of the product, excluding

liquids (hydrophobic/oleophobic) and particulates.

The Si7022 offers an accurate, low-power, factory-calibrated digital solution ideal

for measuring humidity, dew-point, and temperature, in applications ranging from

HVAC/R and asset tracking to industrial and consumer platforms.

Patent Protected. Patents pending

Rev. 1.1 6/15

Si7022-A10

Si7022-A10

ABLE O F

ONTENTS

Section

Page

1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

2. Typical Application Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

3. Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

4. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

4.1. Relative Humidity Sensor Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

4.2. Hysteresis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

4.3. Prolonged Exposure to High Humidity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

4.4. PCB Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

4.5. Protecting the Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

4.6. Bake/Hydrate Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

4.7. Long Term Drift/Aging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

5. PWM Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

6. Pin Descriptions: Si7022 (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

7. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

8. Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

8.1. Package Outline: 3x3 6-pin DFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

8.2. Package Outline: 3x3 6-pin DFN with Protective Cover . . . . . . . . . . . . . . . . . . . . . . 20

9. PCB Land Pattern and Solder Mask Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

10. Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22

10.1. Si7022 Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

10.2. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

11. Additional Reference Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24

Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25

Rev. 1.1

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