SI7006-A10-IM datasheet, PDF - EEWORLD Datasheet

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SI7006-A10-IM: Description湿度温度传感器 0 ~ 100% 相对湿度 I²C ±5% RH 18 s 表面贴装型; CategoryThe sensor Temperature and humidity sensor; File Size919KB，34 Pages; ManufacturerSilicon Labs; Websitehttps://www.silabs.com

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SI7006-A10-IM Overview

湿度温度传感器 0 ~ 100% 相对湿度 I²C ±5% RH 18 s 表面贴装型

SI7006-A10-IM Parametric

Parameter Name	Attribute value
category
Maker	Silicon Labs
series	-
Package	Pipe fittings
sensor type	humidity, temperature
Humidity range	0 ~ 100% relative humidity
Output type	I²C
output	12b
Accuracy	±5% RH
Response time	18 s
Sensitivity	-
Voltage - Power supply	1.9V ~ 3.6V
Installation type	surface mount type
Operating temperature	-40°C ~ 125°C
Package/casing	6-WDFN Exposed Pad
Supplier device packaging	6-DFN（3x3）

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Si7006-A 1 0

C H

UMIDITY

Features



AND

E M P E R A T U R E

E N S O R

Precision Relative Humidity Sensor



± 5% RH (max), 0–90% RH

High Accuracy Temperature Sensor



±1 °C (max), –10 to 85 °C

0 to 100% RH operating range

–40 to +125 °C operating range

Wide operating voltage

(1.9 to 3.6 V)

Low Power Consumption



150

μA

active current



60 nA standby current



Factory-calibrated

C Interface

Integrated on-chip heater

3x3 mm DFN Package

Excellent long term stability

Optional factory-installed cover



Low-profile



Protection during reflow



Excludes liquids and particulates

Si7006

Ordering Information:

See page 27.

Applications



HVAC/R

Thermostats/humidistats

Respiratory therapy

White goods

Indoor weather stations



Micro-environments/data centers



Automotive climate control and

defogging



Asset and goods tracking



Mobile phones and tablets

Pin Assignments

Description

The Si7006 I

C Humidity and Temperature Sensor is a monolithic CMOS IC

integrating humidity and temperature sensor elements, an analog-to-digital

converter, signal processing, calibration data, and an I

C Interface. The patented

use of industry-standard, low-K polymeric dielectrics for sensing humidity enables

the construction of low-power, monolithic CMOS Sensor ICs with low drift and

hysteresis, and excellent long term stability.

The humidity and temperature sensors are factory-calibrated and the calibration

data is stored in the on-chip non-volatile memory. This ensures that the sensors

are fully interchangeable, with no recalibration or software changes required.

The Si7006 is available in a 3x3 mm DFN package and is reflow solderable. It can

be used as a hardware- and software-compatible drop-in upgrade for existing RH/

temperature sensors in 3x3 mm DFN-6 packages, featuring precision sensing

over a wider range and lower power consumption. The optional factory-installed

cover offers a low profile, convenient means of protecting the sensor during

assembly (e.g., reflow soldering) and throughout the life of the product, excluding

liquids (hydrophobic/oleophobic) and particulates.

The Si7006 offers an accurate, low-power, factory-calibrated digital solution ideal

for measuring humidity, dew-point, and temperature, in applications ranging from

HVAC/R and asset tracking to industrial and consumer platforms.

Top View

Patent Protected. Patents pending

Rev. 1.1 6/15

Si7006-A10

Si7006-A 10

A B L E

Section

ONTENTS

Page

1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

2. Typical Application Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

3. Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

4. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

4.1. Relative Humidity Sensor Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

4.2. Hysteresis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

4.3. Prolonged Exposure to High Humidity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

4.4. PCB Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

4.5. Protecting the Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

4.6. Bake/Hydrate Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

4.7. Long Term Drift/Aging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

5. I C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19

5.1. Issuing a Measurement Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

5.2. Reading and Writing User Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23

5.3. Electronic Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23

5.4. Firmware Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24

5.5. Heater . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24

6. Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25

6.1. Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25

7. Pin Descriptions: Si7006 (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26

8. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27

9. Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28

9.1. Package Outline: 3x3 6-pin DFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28

9.2. Package Outline: 3x3 6-pin DFN with Protective Cover . . . . . . . . . . . . . . . . . . . . . .29

10. PCB Land Pattern and Solder Mask Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30

11. Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31

11.1. Si7006 Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31

11.2. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31

12. Additional Reference Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32

Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33

Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34

Rev. 1.1

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