CAT93C46RLI-GT3 datasheet, PDF

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CAT93C46RLI-GT3: Description64X16 MICROWIRE BUS SERIAL EEPROM, PDIP8, 0.300 INCH, ROHS COMPLIANT, PLASTIC, MS-001, DIP-8; Categorystorage storage; File Size147KB，13 Pages; ManufacturerON Semiconductor; Websitehttp://www.onsemi.cn

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CAT93C46RLI-GT3 Overview

64X16 MICROWIRE BUS SERIAL EEPROM, PDIP8, 0.300 INCH, ROHS COMPLIANT, PLASTIC, MS-001, DIP-8

CAT93C46RLI-GT3 Parametric

Parameter Name	Attribute value
Maker	ON Semiconductor
Parts packaging code	DIP
package instruction	DIP,
Contacts	8
Reach Compliance Code	unknown
ECCN code	EAR99
Spare memory width	8
Maximum clock frequency (fCLK)	2 MHz
JESD-30 code	R-PDIP-T8
JESD-609 code	e4
length	9.27 mm
memory density	1024 bit
Memory IC Type	EEPROM
memory width	16
Number of functions	1
Number of terminals	8
word count	64 words
character code	64
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	64X16
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	SERIAL
Certification status	Not Qualified
Maximum seat height	5.33 mm
Serial bus type	MICROWIRE
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.8 V
Nominal supply voltage (Vsup)	3 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	NICKEL PALLADIUM GOLD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm
Base Number Matches	1

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CAT93C46

1 Kb Microwire Serial

EEPROM

Description

The CAT93C46 is a 1 Kb Serial EEPROM memory device which is

configured as either 64 registers of 16 bits (ORG pin at V

) or 128

registers of 8 bits (ORG pin at GND). Each register can be written (or

read) serially by using the DI (or DO) pin. The CAT93C46 features a

self−timed internal write with auto−clear. On−chip Power−On Reset

circuit protects the internal logic against powering up in the wrong

state.

Features

http://onsemi.com

•

High Speed Operation: 2 MHz

1.8 V to 5.5 V Supply Voltage Range

Selectable x8 or x16 Memory Organization

Self−Timed Write Cycle with Auto−Clear

Software Write Protection

Power−up Inadvertant Write Protection

Low Power CMOS Technology

1,000,000 Program/Erase Cycles

100 Year Data Retention

Industrial Temperature Range

8−pin PDIP, SOIC, TSSOP and 8−pad TDFN Packages

This Device is Pb−Free, Halogen Free/BFR Free and RoHS

Compliant*

PDIP−8

L SUFFIX

CASE 646AA

TSSOP−8

Y SUFFIX

CASE 948AL

SOIC−8

V, W SUFFIX

CASE 751BD

SOIC−8

X SUFFIX

CASE 751BE

TDFN−8*

VP2 SUFFIX

CASE 511AK

PIN CONFIGURATIONS

ORG CS

GND

ORG

GND

PDIP (L), SOIC (V, X),

TSSOP (Y), TDFN (VP2)*

(Top View)

SOIC (W)

(Top View)

PIN FUNCTION

ORG

CAT93C46

Pin Name

GND

ORG

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

Function

Chip Select

Clock Input

Serial Data Input

Serial Data Output

Power Supply

Ground

Memory Organization

No Connection

Figure 1. Functional Symbol

Note: When the ORG pin is connected to V

, the

x16 organization is selected. When it is connected

to ground, the x8 organization is selected. If the

ORG pin is left unconnected, then an internal pullup

device will select the x16 organization.

ORDERING INFORMATION

See detailed ordering and shipping information in the package

dimensions section on page 13 of this data sheet.

* Not Recommended for New Designs

Semiconductor Components Industries, LLC, 2013

October, 2013

−

Rev. 10

Publication Order Number:

CAT93C46/D

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Description	64X16 MICROWIRE BUS SERIAL EEPROM, PDIP8, 0.300 INCH, ROHS COMPLIANT, PLASTIC, MS-001, DIP-8	64X16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 4.40 MM, GREEN, MO-153, TSSOP-8	64X16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.150 INCH, GREEN, MS-012, SOIC-8	64X16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.150 INCH, GREEN, MS-012, SOIC-8	IC 64 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 2 X 3 MM, GREEN, MS-229, TDFN-8, Programmable ROM	IC 64 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8, GREEN, EIAJ, SOIC-8, Programmable ROM
Maker	ON Semiconductor	ON Semiconductor	ON Semiconductor	ON Semiconductor	ON Semiconductor	ON Semiconductor
Parts packaging code	DIP	TSSOP	SOIC	SOIC	SON	SOIC
package instruction	DIP,	TSSOP, TSSOP8,.25	SOP, SOP8,.25	SOP, SOP8,.25	HVSON, SOLCC8,.11,20	SOP, SOP8,.25
Contacts	8	8	8	8	8	8
Reach Compliance Code	unknown	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Spare memory width	8	8	8	8	8	8
Maximum clock frequency (fCLK)	2 MHz	2 MHz	2 MHz	2 MHz	2 MHz	2 MHz
JESD-30 code	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-N8	R-PDSO-G8
JESD-609 code	e4	e4	e4	e4	e4	e4
memory density	1024 bit	1024 bit	1024 bit	1024 bit	1024 bit	1024 bit
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
memory width	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1
Number of terminals	8	8	8	8	8	8
word count	64 words	64 words	64 words	64 words	64 words	64 words
character code	64	64	64	64	64	64
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	64X16	64X16	64X16	64X16	64X16	64X16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	TSSOP	SOP	SOP	HVSON	SOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Serial bus type	MICROWIRE	MICROWIRE	MICROWIRE	MICROWIRE	MICROWIRE	MICROWIRE
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
Nominal supply voltage (Vsup)	3 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	NO LEAD	GULL WING
Terminal pitch	2.54 mm	0.65 mm	1.27 mm	1.27 mm	0.5 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
length	9.27 mm	4.4 mm	4.9 mm	4.9 mm	3 mm	-
Maximum seat height	5.33 mm	1.2 mm	1.75 mm	1.75 mm	0.8 mm	-
width	7.62 mm	3 mm	3.9 mm	3.9 mm	2 mm	-
Is it lead-free?	-	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	-	conform to	conform to	conform to	conform to	conform to
Data retention time - minimum	-	100	100	100	100	100
Durability	-	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles
Encapsulate equivalent code	-	TSSOP8,.25	SOP8,.25	SOP8,.25	SOLCC8,.11,20	SOP8,.25
Peak Reflow Temperature (Celsius)	-	260	260	260	260	260
power supply	-	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V
Maximum standby current	-	0.00001 A	0.00001 A	0.00001 A	0.00001 A	0.00001 A
Maximum slew rate	-	0.001 mA	0.001 mA	0.001 mA	0.001 mA	0.003 mA
Maximum time at peak reflow temperature	-	40	40	40	40	40
write protect	-	SOFTWARE	SOFTWARE	SOFTWARE	SOFTWARE	SOFTWARE

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