Si7057/8/9-A10
D
IGITA L
I
2
C T
EMPERATURE
S
ENSOR
Features
High Accuracy Temperature
Sensor
Si7057:
Low Power Consumption
50
nA, standby current
2
–40 to +125 °C operating range
Pin-selectable I C addresses
2x2 mm QFN package
Low Voltage Operation (1.8 V)
Excellent long term stability
14-bit resolution
±0.35 °C (max), 0 to 70 °C
Factory-calibrated
Si7058: ±0.5 °C (max), 0 to 70 °C
2
I C Interface
Si7059: ±1.0 °C (max), 0 to 70 °C
Applications
Mobile smartphones and tablets
Consumer electronics
HVAC/R
White goods
Asset and goods tracking
Thermostats
Micro-environments/data centers
Indoor weather stations
Description
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VDD
1
SCL
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The Si7057/8/9 I
2
C Temperature Sensors are monolithic CMOS ICs that
integrate temperature sensor elements, an analog-to-digital converter,
signal processing, calibration data, and an I
2
C interface.
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The temperature sensors are factory-calibrated and the calibration data is
stored in the on-chip non-volatile memory. This ensures that the sensors
are fully interchangeable, with no calibration or software changes
required.
The Si7057/8/9 devices are available in a 2x2 mm DFN package and are
reflow solderable. The Si7057/8/9 sensors offer an accurate, low-power,
factory-calibrated digital solution ideal for measuring temperature in
applications ranging from HVAC/R and asset tracking to industrial and
consumer platforms.
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Patent Protected. Patents pending
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Rev. 1.1 4/17
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Copyright © 2017 by Silicon Laboratories
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Ordering Information:
See page 17.
Pin Assignments
DNC
6
5
GND
3
4
SDA
ADD
Top View
Si7057/8/9-A10
Si7057/8/9-A10
Functional Block Diagram
Vdd
Si705x
1.25V
Ref
Calibration
Memory
Temp
Sensor
ADC
Control Logic
I
2
C Interface
GND
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SDA
SCL
Si7057/8/9-A10
T
ABLE O F
C
ONTENTS
Section
Page
1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
2. Typical Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
3. Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5. I2C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.1. Issuing a Measurement Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.2. Measuring Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.3. Firmware Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.4. Electronic Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
6. Pin Descriptions: Si7057/8/9 (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
8. Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
8.1. Package Outline: 2x2 6-pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
9. PCB Land Pattern and Solder Mask Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
10. Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
10.1. Si7057/8/9 Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
10.2. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
11. Additional Reference Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
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Si7057/8/9-A10
1. Electrical Specifications
Unless otherwise specified, all min/max specifications apply over the recommended operating conditions.
Parameter
Power Supply
Operating Temperature
Symbol
V
DD
T
A
Test Condition
Min
1.67
–40
Typ
—
—
Table 2. General Specifications
Parameter
Input Voltage High
Input Voltage Low
Input Voltage Range
Symbol
V
IH
VIL
VIN
1.67
V
DD
1.98 V; T
A
= –40 to +125 °C unless otherwise noted.
Test Condition
ADD, SCL, SDA pins
ADD, SCL, SDA pins
Min
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0.7xVDD
—
0.0
0.0
—
—
—
—
—
—
—
—
—
SCL, SDA pins with respect to GND
ADD pin with respect to GND
Input Leakage
Output Voltage Low
Current Consumption
IIL
VOL
I
DD
ADD, SCL, SDA pins
SDA pin; IOL = 1.5 mA
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Normal Mode, Temperature conver-
sion in progress, second step
1
Standby, –40 to +85 °C
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Normal Mode, Temperature conver-
sion in progress, first step
1
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Standby, –40 to +125 °C
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Peak IDD during powerup
3
Peak IDD during I
2
C operations
4
After writing to user registers
5
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Notes:
1.
Total conversion time is first-step time plus second-step time.
2.
No conversion or I
2
C transaction in progress. Typical values measured at 25 °C.
3.
Occurs once during powerup. Duration is <5 msec.
4.
Occurs during I
2
C commands for Reset, Read/Write User Registers, Read EID, and Read Firmware Version. Duration
is <100
μs
when I
2
C clock speed is >100 kHz (>200 kHz for 2-byte commands).
5.
IDD after a user register write. Initiating any other subsequent I
2
C transaction on the same bus (such as a user register
read, starting an RH measurement, or traffic directed at other I
2
C devices) will transition the device to standby mode.
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Max
Unit
V
1.98
+125
°C
Typ
—
Max
—
0.3xVDD
VDD+2
VDD+0.3
1
0.4
288
145
0.56
5.2
5.1
4
17
Unit
V
V
V
V
μA
V
μA
μA
μA
μA
mA
mA
µA
—
—
—
—
—
245
106
0.05
0.05
4
3.5
11.6
Table 1. Recommended Operating Conditions
Si7057/8/9-A10
Table 2. General Specifications (Continued)
Parameter
Conversion Time
1
Symbol
t
CONV
1.67
V
DD
1.98 V; T
A
= –40 to +125 °C unless otherwise noted.
Test Condition
Normal Mode,
Temperature conversion first step
Fast Mode,
Temperature conversion first step
Normal or Fast Mode,
Temperature conversion second step
Min
Typ
3.7
Max
6
Unit
ms
Powerup Time
t
PU
From VDD
≥
1.67 V to ready for a
conversion, 25 °C
From VDD
≥
1.67 V to ready for a
conversion, full temperature range
After issuing a software reset
command
—
—
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Notes:
1.
Total conversion time is first-step time plus second-step time.
2.
No conversion or I
2
C transaction in progress. Typical values measured at 25 °C.
3.
Occurs once during powerup. Duration is <5 msec.
4.
Occurs during I
2
C commands for Reset, Read/Write User Registers, Read EID, and Read Firmware Version. Duration
is <100
μs
when I
2
C clock speed is >100 kHz (>200 kHz for 2-byte commands).
5.
IDD after a user register write. Initiating any other subsequent I
2
C transaction on the same bus (such as a user register
read, starting an RH measurement, or traffic directed at other I
2
C devices) will transition the device to standby mode.
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0.9
2.5
10
—
1.5
4.0
15
ms
ms
ms
50
2.0
ms
ms
1.2
5
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