SYNC Voltage .............................................................6V
Operating Junction Temperature Range (Note 2)
LT8620E ............................................ –40°C to 125°C
LT8620I ............................................. –40°C to 125°C
LT8620H ............................................ –40°C to 150°C
LT8620MP ......................................... –55°C to 150°C
Storage Temperature Range .................. –65°C to 150°C
PIN CONFIGURATION
TOP VIEW
NC
NC
NC
24 23 22 21
TOP VIEW
SYNC
TR/SS
RT
EN/UV
V
IN
V
IN
NC
GND
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
FB
PG
BIAS
INTV
CC
BST
SW
SW
SW
SYNC 1
TR/SS 2
RT 3
EN/UV 4
V
IN
5
V
IN
6
NC 7
GND 8
9 10 11 12
NC
NC
GND
NC
25
GND
20 FB
19 PG
18 BIAS
17 INTV
CC
16 BST
15 SW
14 SW
13 SW
NC
17
GND
MSE PACKAGE
16-LEAD PLASTIC MSOP
θ
JA
= 40°C/W,
θ
JC(PAD)
= 10°C/W
EXPOSED PAD (PIN 17) IS GND, MUST BE SOLDERED TO PCB
UDD PACKAGE
24-LEAD (3mm
×
5mm) PLASTIC QFN
θ
JA
= 46°C/W,
θ
JC(PAD)
= 5°C/W
EXPOSED PAD (PIN 25) IS GND, MUST BE SOLDERED TO PCB
ORDER INFORMATION
LEAD FREE FINISH
LT8620EMSE#PBF
LT8620IMSE#PBF
LT8620HMSE#PBF
LT8620MPMSE#PBF
LT8620EUDD#PBF
LT8620IUDD#PBF
TAPE AND REEL
LT8620EMSE#TRPBF
LT8620IMSE#TRPBF
LT8620HMSE#TRPBF
LT8620MPMSE#TRPBF
LT8620EUDD#TRPBF
LT8620IUDD#TRPBF
PART MARKING*
8620
8620
8620
8620
LGGV
LGGV
PACKAGE DESCRIPTION
16-Lead Plastic MSOP
16-Lead Plastic MSOP
16-Lead Plastic MSOP
16-Lead Plastic MSOP
24-Lead (3mm
×
5mm) Plastic QFN
24-Lead (3mm
×
5mm) Plastic QFN
TEMPERATURE RANGE
–40°C to 125°C
–40°C to 125°C
–40°C to 150°C
–55°C to 150°C
–40°C to 125°C
–40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to:
http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to:
http://www.linear.com/tapeandreel/
2
8620fa
For more information
www.linear.com/LT8620
LT8620
ELECTRICAL CHARACTERISTICS
PARAMETER
Minimum Input Voltage
V
IN
Quiescent Current
CONDITIONS
l
The
l
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25°C.
MIN
TYP
2.9
1.0
1.0
1.7
1.7
0.28
20
200
0.970
0.970
0.004
3.4
3.29
2.6
7.2
30
30
90
210
700
2.00
175
4.1
85
3.9
1.0
40
9.0
–9.0
1.3
680
1.0
1.3
2
220
MAX
3.4
3
8
4
10
0.5
50
350
0.976
0.982
0.02
20
3.57
3.35
2.7
45
45
130
240
735
2.15
4.9
4.7
1.5
1.06
20
12
–12
40
2000
1.2
1.5
100
2.7
UNITS
V
µA
µA
µA
µA
mA
µA
µA
V
V
%/V
nA
V
V
V
mA
ns
ns
ns
kHz
kHz
MHz
mΩ
A
mΩ
A
µA
V
mV
nA
%
%
%
nA
Ω
V
V
nA
µA
Ω
V
EN/UV
= 0V, V
SYNC
= 0V
l
V
EN/UV
= 2V, Not Switching, V
SYNC
= 0V
l
V
IN
Current in Regulation
Feedback Reference Voltage
Feedback Voltage Line Regulation
Feedback Pin Input Current
INTV
CC
Voltage
INTV
CC
Undervoltage Lockout
BIAS Pin Current Consumption
Minimum On-Time
Minimum Off-Time
Oscillator Frequency
Top Power NMOS On-Resistance
Top Power NMOS Current Limit
Bottom Power NMOS On-Resistance
Bottom Power NMOS Current Limit
SW Leakage Current
EN/UV Pin Threshold
EN/UV Pin Hysteresis
EN/UV Pin Current
PG Upper Threshold Offset from V
FB
PG Lower Threshold Offset from V
FB
PG Hysteresis
PG Leakage
PG Pull-Down Resistance
SYNC Threshold
SYNC Pin Current
TR/SS Source Current
TR/SS Pull-Down Resistance
V
EN/UV
= 2V, Not Switching, V
SYNC
= 2V
V
OUT
= 0.97V, V
IN
= 6V, Output Load = 100µA
V
OUT
= 0.97V, V
IN
= 6V, Output Load = 1mA
V
IN
= 6V, I
LOAD
= 0.5A
V
IN
= 6V, I
LOAD
= 0.5A
V
IN
= 4.0V to 42V, I
LOAD
= 0.5A
V
FB
= 1V
I
LOAD
= 0mA, V
BIAS
= 0V
I
LOAD
= 0mA, V
BIAS
= 3.3V
V
BIAS
= 3.3V, I
LOAD
= 1A, 2MHz
I
LOAD
= 1A, SYNC = 0V
I
LOAD
= 1A, SYNC = 3.3V
R
T
= 221k, I
LOAD
= 1A
R
T
= 60.4k, I
LOAD
= 1A
R
T
= 18.2k, I
LOAD
= 1A
I
SW
= 1A
V
INTVCC
= 3.4V, I
SW
= 1A
V
INTVCC
= 3.4V
V
IN
= 42V, V
SW
= 0V, 42V
EN/UV Rising
V
EN/UV
= 2V
V
FB
Falling
V
FB
Rising
V
PG
= 3.3V
V
PG
= 0.1V
SYNC Falling
SYNC Rising
V
SYNC
= 6V
Fault Condition, TR/SS = 0.1V
l
l
l
l
0.964
0.958
–20
3.23
3.25
2.5
l
l
l
l
l
180
665
1.85
2.8
2.9
–1.5
0.94
–20
6
–6
–40
l
l
l
l
l
l
0.8
1.1
–100
1.2
Note 1:
Stresses beyond those listed under Absolute Maximum Ratings may
cause permanent damage to the device. Exposure to any Absolute Maximum
Rating condition for extended periods may affect device reliability and lifetime.
Note 2:
The LT8620E is guaranteed to meet performance specifications
from 0°C to 125°C junction temperature. Specifications over the –40°C
to 125°C operating junction temperature range are assured by design,
characterization, and correlation with statistical process controls. The
LT8620I is guaranteed over the full –40°C to 125°C operating junction
temperature range. The LT8620H is guaranteed over the full
−40°C
to
150°C operating junction temperature range. The LT8620MP is 100%
tested and guaranteed over the full
−55°C
to 150°C operating junction
temperature range. High junction temperatures degrade operating lifetimes.
Operating lifetime is derated at junction temperatures greater than 125°C.
Note 3:
This IC includes overtemperature protection that is intended to protect
the device during overload conditions. Junction temperature will exceed 150°C
when overtemperature protection is active. Continuous operation above the
specified maximum operating junction temperature will reduce lifetime.
http://www.keil.com/support/docs/3080.htm
ARM: How to analyze DAbt exceptions This article is intended for:Any version of ARMProblem: My ARM application does not work. When I run it in the emulator or...
[i=s]This post was last edited by shiguangjiqiren on 2017-4-7 15:24[/i] Hello to all the great masters passing by! I am a novice and made a circuit board by myself. The main chip I used is 28027. Afte...
Hello everyone, I just started learning Windows driver development and I have no idea about it. I have a question: the sample programs in the book, such as hellowdm, do not have any actual devices, bu...
[i=s]This post was last edited by qwqwqw2088 on 2020-8-11 07:35[/i]The Internet of Things (IoT) and Industrial Internet of Things (IIoT) have become synonymous with connected factories, making traditi...
1. Equipment Overview
Shell-and-tube heat exchangers are a common heat exchange device used in chemical evaporation and heating equipment. Currently, the tubesheets of shell-and-tube heat exch...[Details]
A vacuum eutectic furnace is a critical piece of equipment used in the manufacturing and processing of various materials, particularly in the fields of microelectronics and nanotechnology. One of t...[Details]
On August 22nd, Lantu Motors unveiled a new technology called "Lanhai Intelligent Hybrid" during a live broadcast of CCTV News' "Top Laboratory." The name sounds like another new term, but a closer...[Details]
According to foreign media reports, Nissan Motor has recently reached a cooperation with US battery technology company LiCAP Technologies to jointly promote the research and development of next-gen...[Details]
Since its invention in the mid-1940s, the microwave oven has evolved from a humble beginning to commercial use, entering homes in the 1960s and rapidly gaining popularity. Its basic functionality a...[Details]
As AI accelerates across industries, the demand for data center infrastructure is also growing rapidly.
Keysight Technologies, in collaboration with Heavy Reading, released the "Beyo...[Details]
There are basically three causes of spontaneous combustion of electric vehicles: The first is that the battery components are punctured or suffer fatal damage due to a collision accident, and part ...[Details]
SMT placement machines are important equipment in surface mount technology (Surface Mount Technology). Their performance has a decisive impact on the quality and efficiency of electronic manufactur...[Details]
Learned the following information.
Customer product: industrial computer motherboard
Glue application area: CPU/BGA filling
Glue color requirements: black or t...[Details]
Reflow soldering, as an electronics assembly process, has become a vital component of the electronics manufacturing industry. Choosing reflow soldering equipment is crucial for improving production...[Details]
With growing environmental awareness, the continuous improvement of three-electric technology and the increasing deployment of infrastructure such as charging stations, the electrification of new e...[Details]
Renesas Electronics' new ultra-low-power RA4C1 MCU features advanced security and a dedicated peripheral set, making it ideal for metering and other applications.
The new product mee...[Details]
introduction
With the development and widespread use of integrated circuits in power electronics design, electronic products are trending towards smaller sizes, more components, and greater fu...[Details]
The screen is the first thing you notice when evaluating a phone's quality. Its quality directly impacts both visual and operational performance. However, understanding mobile phone screens r...[Details]
The Radxa Cubie A7A is a single-board computer (SBC) powered by the Allwinner A733 octa-core Cortex-A76/A55 SoC, equipped with a 3 TOPS AI accelerator and up to 16GB of LPDDR5 memory.
Fo...[Details]
ARM Technology
京公网安备 11010802033920号
EEWORLD
