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W948D6KBHX6E TR

Description
SDRAM - 移动 LPDDR 存储器 IC 256Mb(16M x 16) 并联 166 MHz 5 ns 60-VFBGA(8x9)
Categorysemiconductor    memory   
File Size1MB,57 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
Environmental Compliance
Download Datasheet Parametric View All

W948D6KBHX6E TR Overview

SDRAM - 移动 LPDDR 存储器 IC 256Mb(16M x 16) 并联 166 MHz 5 ns 60-VFBGA(8x9)

W948D6KBHX6E TR Parametric

Parameter NameAttribute value
category
MakerWinbond Electronics Corporation
series-
PackageTape and Reel (TR)
memory typeVolatile
memory formatDRAM
technologySDRAM - Mobile LPDDR
storage256Mb(16M x 16)
memory interfacein parallel
Clock frequency166 MHz
Write cycle time - words, pages15ns
interview time5 ns
Voltage - Power supply1.7V ~ 1.95V
Operating temperature-25°C ~ 85°C(TC)
Installation typesurface mount type
Package/casing60-TFBGA
Supplier device packaging60-VFBGA(8x9)
Basic product numberW948D6
W948D6KBHX
256Mb Mobile LPDDR
Table of Contents-
1.
2.
3.
4.
5.
GENERAL DESCRIPTION ................................................................................................................................. 4
FEATURES ........................................................................................................................................................ 4
ORDER INFORMATION .................................................................................................................................... 4
BALL CONFIGURATION .................................................................................................................................... 5
BALL DESCRIPTION ......................................................................................................................................... 6
5.1
Signal Descriptions ............................................................................................................................... 6
5.2
Addressing Table ................................................................................................................................. 7
6. BLOCK DIAGRAM.............................................................................................................................................. 8
6.1
Block Diagram ...................................................................................................................................... 8
6.2
Simplified State Diagram ...................................................................................................................... 9
7. FUNCTIONAL DESCRIPTION ......................................................................................................................... 10
7.1
Initialization......................................................................................................................................... 10
7.1.1
Initialization Flow Diagram.................................................................................................... 11
7.1.2
Initialization Waveform Sequence ........................................................................................ 12
7.2
Mode Register Set Operation ............................................................................................................. 12
7.3
Mode Register Definition .................................................................................................................... 13
7.3.1
Burst Length ......................................................................................................................... 13
7.3.2
Burst Definition ..................................................................................................................... 14
7.3.3
Burst Type ............................................................................................................................ 15
7.3.4
Read Latency ....................................................................................................................... 15
7.4
Extended Mode Register Description ................................................................................................. 15
7.4.1
Extended Mode Register Definition ...................................................................................... 16
7.4.2
Partial Array Self Refresh ..................................................................................................... 16
7.4.3
Automatic Temperature Compensated Self Refresh ............................................................ 16
7.4.4
Output Drive Strength ........................................................................................................... 16
7.5
Status Register Read ......................................................................................................................... 17
7.5.1
SRR Register Definition........................................................................................................ 17
7.5.2
Status Register Read Timing Diagram ................................................................................. 18
7.6
Commands ......................................................................................................................................... 19
7.6.1
Basic Timing Parameters for Commands ............................................................................. 19
7.6.2
Truth Table – Commands ..................................................................................................... 19
7.6.3
Truth Table - DM Operations ................................................................................................ 20
7.6.4
Truth Table – CKE................................................................................................................ 20
7.6.5
Truth Table - Current State Bank n - Command to Bank n ................................................... 21
7.6.6
Truth Table - Current State Bank n, Command to Bank m ................................................... 22
8. OPERATION .................................................................................................................................................... 24
8.1
Deselect ............................................................................................................................................. 24
8.2
No Operation ...................................................................................................................................... 24
8.2.1
NOP Command .................................................................................................................... 24
8.3
Mode Register Set .............................................................................................................................. 25
8.3.1
Mode Register Set Command .............................................................................................. 25
8.3.2
Mode Register Set Command Timing .................................................................................. 25
8.4
Active.................................................................................................................................................. 26
8.4.1
Active Command .................................................................................................................. 26
8.4.2
Bank Activation Command Cycle ......................................................................................... 27
Publication Release Date: Jul. 07, 2017
Revision: A01-002
-1-

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